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    • 4. 发明申请
    • EXTENDED LIFETIME ION SOURCE
    • 延伸的生命之源
    • US20140326594A1
    • 2014-11-06
    • US13886683
    • 2013-05-03
    • VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
    • Costel BiloiuDavid P. SporlederJay ScheuerNeil Bassom
    • H01J37/30C23F4/00H01J37/305
    • C23F4/00H01J27/08H01J37/08H01J37/3053H01J2237/022H01J2237/3341
    • An ion source includes an ion source chamber, a cathode disposed within the ion source chamber and configured to emit electrons to generate an arc plasma, and a repeller configured to repell electrons back into the arc plasma. The ion source chamber and cathode may comprise a refractory metal. The ion source chamber further includes a gas source configured to provide a halogen species to the ion source chamber. The reactive insert is interoperative with the halogen species to yield a first etch rate of the refractory metal material within the ion source chamber under a first set of operating conditions that is less than a second etch rate of the refractory metal material within the ion source chamber under the first set of operating conditions when the reactive insert is not disposed within the ion source chamber.
    • 离子源包括离子源室,设置在离子源室内的并且被配置为发射电子以产生电弧等离子体的阴极,以及构造成将电子排斥回到电弧等离子体中的反射器。 离子源室和阴极可以包括难熔金属。 离子源室还包括被配置为向离子源室提供卤素物质的气体源。 反应性插入物与卤素物质相互作用,以在离子源室内的难熔金属材料的小于第二蚀刻速率的第一组操作条件下产生耐热金属材料在离子源室内的第一蚀刻速率 当反应性插入物未设置在离子源室内时,在第一组操作条件下。