专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08143084B2 Image sensing device and manufacture method thereof 有权
标题翻译：图像感测装置及其制造方法
公开(公告)号：US08143084B2
公开(公告)日：2012-03-27
申请号：US12356347
申请日：2009-01-20
申请人： Hsiao-Wen Lee
发明人： Hsiao-Wen Lee
IPC分类号： H01L21/00
CPC分类号： H01L27/14685 , H01L27/14603 , H01L27/14621 , H01L27/14625 , H01L27/14627
摘要： An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes a micro prism and a micro lens for adjusting the incident angle and converging the incident light, respectively, a photo sensor for converting the photo signals into electronic signals, and an IC stacking layer for processing the electronic signals.
摘要翻译：提供一种用于接收具有入射角的入射光和由此形成的光信号的图像感测装置。图像感测装置包括微棱镜和微透镜，用于分别调节入射角度并会聚入射光，用于将光信号转换成电子信号的光传感器，以及用于处理电子信号的IC堆叠层。

2. 发明授权

US07589033B2 Fabrication of wafer-level test module for testing image sensor chips 有权
标题翻译：制造用于测试图像传感器芯片的晶片级测试模块
公开(公告)号：US07589033B2
公开(公告)日：2009-09-15
申请号：US12219087
申请日：2008-07-16
申请人： Sheng-Feng Lu , Wei-Hua Lee
发明人： Sheng-Feng Lu , Wei-Hua Lee
IPC分类号： H01L21/00
CPC分类号： H04N17/002 , H01L27/146 , H04N5/2257 , Y10T29/49117
摘要： A wafer-level test module is disclosed to include a base layer having multiple first apertures spaced from one another at a pitch corresponding to the pitch of the image sensor chips of an integrated circuit wafer, a cover layer having second apertures respectively axially aimed at the first apertures, and an optical layer sandwiched between the base layer and the cover layer having multiple optical lenses of which the optical axes pass through the first apertures and the second apertures, so that when one image capturing device of the image sensor chips of an integrated circuit wafer is adjusted to the image plane of one of the optical lenses and the wafer-level test module is set in alignment with the integrated circuit wafer horizontally and vertically, then the effective test light can be simultaneously projected onto the image capturing devices of the respective image sensor chips through the wafer-level test module to achieve an effective wafer-level test on multiple image sensor chips of the integrated circuit wafer accurately and rapidly.
摘要翻译：公开了一种晶片级测试模块，其包括具有彼此间隔开的多个第一孔的基底层，其间距对应于集成电路晶片的图像传感器芯片的间距，覆盖层具有分别轴向对准的第二孔第一孔和夹在基层和覆盖层之间的光学层具有多个光学透镜，光轴穿过第一孔和第二孔，使得当一个图像传感器芯片的一个图像捕获装置集成电路晶片被调整到其中一个光学透镜的像平面，并且晶片级测试模块被设置为与集成电路晶片水平和垂直对准，然后有效测试光可以同时投影到图像捕获设备相应的图像传感器芯片通过晶圆级测试模块实现对多个图像传感器的有效晶片级测试准确而快速地集成电路晶片的芯片。

3. 发明申请

US20080136434A1 Wafer-level test module for testing image sensor chips, the related test method and fabrication 有权
公开(公告)号：US20080136434A1
公开(公告)日：2008-06-12
申请号：US11730813
申请日：2007-04-04
申请人： Sheng-Feng Lu , Wei-Hua Lee
发明人： Sheng-Feng Lu , Wei-Hua Lee
IPC分类号： G01R31/02 , H01R43/00
CPC分类号： H04N17/002 , H01L27/146 , H04N5/2257 , Y10T29/49117
摘要： A wafer-level test module is disclosed to include a base layer having multiple first apertures spaced from one another at a pitch corresponding to the pitch of the image sensor chips of an integrated circuit wafer, a cover layer having second apertures respectively axially aimed at the first apertures, and an optical layer sandwiched between the base layer and the cover layer having multiple optical lenses of which the optical axes pass through the first apertures and the second apertures, so that when one image capturing device of the image sensor chips of an integrated circuit wafer is adjusted to the image plane of one of the optical lenses and the wafer-level test module is set in alignment with the integrated circuit wafer horizontally and vertically, then the effective test light can be simultaneously projected onto the image capturing devices of the respective image sensor chips through the wafer-level test module to achieve an effective wafer-level test on multiple image sensor chips of the integrated circuit wafer accurately and rapidly.

4. 发明申请

US20080122469A1 Probe card for testing image-sensing chips 审中-公开
标题翻译：用于测试图像感测芯片的探针卡
公开(公告)号：US20080122469A1
公开(公告)日：2008-05-29
申请号：US11604865
申请日：2006-11-28
申请人： Sheng-Feng Lu
发明人： Sheng-Feng Lu
IPC分类号： G01R1/073
CPC分类号： G01R1/07342 , G01R31/311
摘要： A probe card for testing an image-sensing chip includes a circuit board having a first surface, a second surface, and an opening cut through the first and second surfaces for the passing of a test light, a guide member, and probes. The guide member is mounted on the second surface of the circuit board and provided with through holes. The probes each have a first end respectively electrically connected to the circuit board adjacent to the opening and a second end respectively inserted through the through holes of the guide member to the outside of the guide member for electrically connecting contacts of an image-sensing chip to be tested.
摘要翻译：用于测试图像感测芯片的探针卡包括具有第一表面，第二表面和穿过第一和第二表面的开口的电路板，用于通过测试光，引导构件和探针。引导构件安装在电路板的第二表面上并设有通孔。探针各自具有分别电连接到与开口相邻的电路板的第一端和分别通过引导构件的通孔插入到引导构件的外部的第二端，用于将图像感测芯片的触点电连接到被测试。

5. 发明申请

US20120175501A1 IMAGE SENSING DEVICE AND MANUFACTURE METHOD THEREOF 有权
标题翻译：图像感测装置及其制造方法
公开(公告)号：US20120175501A1
公开(公告)日：2012-07-12
申请号：US13396545
申请日：2012-02-14
申请人： Hsiao-Wen Lee
发明人： Hsiao-Wen Lee
IPC分类号： H01L27/146 , G01J1/44
CPC分类号： H01L27/14685 , H01L27/14603 , H01L27/14621 , H01L27/14625 , H01L27/14627
摘要： An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes a micro prism and a micro lens for adjusting the incident angle and converging the incident light, respectively, a photo sensor for converting the photo signals into electronic signals, and an IC stacking layer for processing the electronic signals.
摘要翻译：提供一种用于接收具有入射角的入射光和由此形成的光信号的图像感测装置。图像感测装置包括微棱镜和微透镜，用于分别调节入射角度并会聚入射光，用于将光信号转换成电子信号的光传感器，以及用于处理电子信号的IC堆叠层。

6. 发明授权

US07433555B2 Optoelectronic device chip having a composite spacer structure and method making same 有权
标题翻译：具有复合间隔结构的光电器件芯片及其制造方法
公开(公告)号：US07433555B2
公开(公告)日：2008-10-07
申请号：US11438128
申请日：2006-05-22
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： G02B6/12 , G02B6/26
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
摘要翻译：公开了一种光电器件芯片及其制造方法。芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。

7. 发明申请

US20070279520A1 IMAGE SENSING DEVICE AND PACKAGE METHOD THEREFOR 审中-公开
标题翻译：图像感测装置及其包装方法
公开(公告)号：US20070279520A1
公开(公告)日：2007-12-06
申请号：US11676813
申请日：2007-02-20
申请人： Hsiao-Wen Lee , Chih-Kung Chang , Pai-Chun Peter Zung , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Chih-Kung Chang , Pai-Chun Peter Zung , Chien-Pang Lin
IPC分类号： H04N5/238
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H01L2224/13 , H04N5/2257
摘要： A package module for an image sensing device is provided. The package module includes a substrate having thereon a photoelectric element array, a first optical element array formed on the photoelectric element array, a package lid having thereon a second optical element array opposite to the first optical element array and having an arrangement corresponding to that of the first optical element array; and a spacer disposed on a bonding area between the package lid and the substrate for adjusting a distance between the package lid and the substrate.
摘要翻译：提供了一种用于图像感测装置的封装模块。封装模块包括其上具有光电元件阵列的基板，形成在光电元件阵列上的第一光学元件阵列，封装盖，其上具有与第一光学元件阵列相对的第二光学元件阵列，并且具有与第一光学元件阵列; 以及间隔件，设置在封装盖和基板之间的接合区域上，用于调节封装盖和基板之间的距离。

8. 发明申请

US20070069109A1 Image sensing device and manufacture method thereof 审中-公开
标题翻译：图像感测装置及其制造方法
公开(公告)号：US20070069109A1
公开(公告)日：2007-03-29
申请号：US11395046
申请日：2006-03-30
申请人： Hsiao-Wen Lee
发明人： Hsiao-Wen Lee
IPC分类号： H01L27/00
CPC分类号： H01L27/14685 , H01L27/14603 , H01L27/14621 , H01L27/14625 , H01L27/14627
摘要： An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes a micro prism and a micro lens for adjusting the incident angle and converging the incident light, respectively, a photo sensor for converting the photo signals into electronic signals, and an IC stacking layer for processing the electronic signals.
摘要翻译：提供一种用于接收具有入射角的入射光和由此形成的光信号的图像感测装置。图像感测装置包括微棱镜和微透镜，用于分别调节入射角度并会聚入射光，用于将光信号转换成电子信号的光传感器，以及用于处理电子信号的IC堆叠层。

9. 发明授权

US07860357B2 Optoelectronic device chip having a composite spacer structure and method making same 有权
标题翻译：具有复合间隔结构的光电器件芯片及其制造方法
公开(公告)号：US07860357B2
公开(公告)日：2010-12-28
申请号：US12228102
申请日：2008-08-09
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： G02B6/12
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
摘要翻译：公开了一种光电器件芯片及其制造方法。芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。

10. 发明授权

US07592680B2 Wafer level image module 有权
标题翻译：晶圆级图像模块
公开(公告)号：US07592680B2
公开(公告)日：2009-09-22
申请号：US11528461
申请日：2006-09-28
申请人： Hsiao-Wen Lee , Pai-Chun Peter Zung , Tzu-Han Lin
发明人： Hsiao-Wen Lee , Pai-Chun Peter Zung , Tzu-Han Lin
IPC分类号： H01L27/14
CPC分类号： H04N5/2254 , H04N5/2257
摘要： A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.
摘要翻译：晶片级图像模块包括用于在接收光时输出电信号的光传感器，用于将入射光聚焦到光传感器上的透镜组以及设置在光传感器和透镜组之间的调节构件，用于控制照片之间的距离传感器和透镜设置以补偿光传感器的聚焦偏移，以使透镜组能够以聚焦方式精确地将入射光聚焦到光传感器上，从而提供高图像质量。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式