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1. 发明申请

US20130256361A1 APPARATUS FOR CUTTING TRANSMISSION ELECTRON MICROSCOPE MICRO-GRIDS 有权
标题翻译：用于切割传输电子显微镜微栅的装置
公开(公告)号：US20130256361A1
公开(公告)日：2013-10-03
申请号：US13729425
申请日：2012-12-28
申请人： TSINGHUA UNIVERSITY , HON HAI PRECISION INDUSTRY CO., LTD.
发明人： CHEN FENG , XUE-WEI GUO
IPC分类号： B81C1/00
CPC分类号： B81C1/00436 , B26F1/02 , H01J37/20 , Y10T225/393
摘要： An apparatus for cutting micro-grids from a metal substrate is provided. The apparatus includes a support and a cutting module. The support includes a supporting surface, the support is configured to support a micro-grid and the metal substrate. The cutting module includes a fixing element, a spring and a cutting structure. The fixing structure and the spring are located in the cutting structure. The fixing element is configured to fix the micro-grid on the supporting surface. The cutting structure is configured to cut the micro-grid from the metal substrate.
摘要翻译：提供了一种用于从金属基板切割微格栅的设备。该装置包括支撑件和切割模块。支撑件包括支撑表面，支撑构造成支撑微格栅和金属基底。切割模块包括固定元件，弹簧和切割结构。固定结构和弹簧位于切割结构中。固定元件构造成将微格栅固定在支撑表面上。切割结构被配置为从金属基底切割微格栅。

2. 发明申请

US20180318868A1 IMPRINT APPARATUS AND METHOD OF CONTROLLING THE SAME 审中-公开
公开(公告)号：US20180318868A1
公开(公告)日：2018-11-08
申请号：US15964548
申请日：2018-04-27
申请人： CANON KABUSHIKI KAISHA
发明人： Ken Katsuta
IPC分类号： B05C11/10 , B41J2/015 , B05D1/26 , B81C1/00
CPC分类号： B05C11/10 , B05D1/26 , B41J2/015 , B41J2/04508 , B41J2/0456 , B41J2/04581 , B81C1/00436 , B81C2201/0153
摘要： An imprint apparatus, comprises: a discharge unit that discharges a liquid onto a substrate; a storage unit that stores a plurality of discharge conditions for the discharge unit; and a control unit that controls the discharge unit based on a discharge condition that is stored in the storage unit, wherein the control unit selects the discharge condition from the plurality of discharge conditions in accordance with a discharge spacing for discharging the liquid.

3. 发明申请

US20140227150A1 MICROFLUIDIC DEVICE AND METHOD FOR PRODUCING A MICROFLUIDIC DEVICE 有权
标题翻译：微流体装置和用于生产微流体装置的方法
公开(公告)号：US20140227150A1
公开(公告)日：2014-08-14
申请号：US14127045
申请日：2012-05-22
申请人： Thomas Brettschneider , Christian Dorrer
发明人： Thomas Brettschneider , Christian Dorrer
IPC分类号： B01L3/00 , B81C99/00 , B81C1/00
CPC分类号： B01L3/50273 , B01L3/502738 , B01L2200/10 , B01L2300/0874 , B01L2300/0887 , B01L2300/089 , B01L2300/12 , B01L2300/14 , B01L2400/0481 , B01L2400/0487 , B01L2400/06 , B01L2400/0638 , B29L2031/7506 , B81C1/00436 , B81C99/0085 , F16K99/0015 , F16K99/0034 , F16K2099/0084 , G01F11/086 , Y10T137/85978
摘要： A microfluidic device includes at least two layers arranged one above the other, a membrane which is arranged between the at least two layers, a cavity in one of the at least two layers, and a channel in the other of the at least two layers. The membrane is arranged so as to be expandable between the cavity and the channel. The membrane is expandable into at least one specified displacement volume.
摘要翻译：微流体装置包括一个彼此排列的至少两个层，布置在所述至少两个层之间的膜，至少两个层中的一个中的空腔和在所述至少两个层中的另一层中的通道。膜被布置成在腔和通道之间可扩张。膜可扩展至至少一个特定的位移体积。

4. 发明授权

US08865498B2 Method for manufacturing three-dimensionally shaped comb-tooth electret electrode 有权
标题翻译：制造三维形状的梳齿驻极体电极的方法
公开(公告)号：US08865498B2
公开(公告)日：2014-10-21
申请号：US13968817
申请日：2013-08-16
申请人： AOI Electronics Co., Ltd.
发明人： Masato Suzuki , Hiroki Hayashi
IPC分类号： H01L21/00 , B81C1/00 , H01G7/02
CPC分类号： B81C1/00 , B81C1/00436 , H01G7/025
摘要： A method for manufacturing a three-dimensionally shaped comb-tooth electret electrode, provided with positive ions, includes: forming a three-dimensional movable comb-tooth electrode and a three-dimensional fixed comb-tooth electrode from an Si substrate; contacting a vapor including ions thereto, and forming an oxide layer including ions upon surfaces of the comb-tooth electrodes with heat applied thereto; and applying a voltage between the movable electrode and the fixed electrode with heat applied thereto, and thereby causing the ions included in the oxide layer to shift to a surface of the oxide layer; wherein, the voltage between the movable electrode and the fixed electrode is changed, so that the operation of each of the comb-teeth of the movable electrode being alternatingly pulled in against two opposed comb-teeth of the fixed electrode is repeated, and the pulling in voltage and the pulled-in state release voltage are gradually increased.
摘要翻译：具有正离子的三维形状的梳齿驻极体电极的制造方法包括：从Si基板形成三维可动梳齿电极和三维固定梳齿电极; 使含有离子的蒸气接触，并在其上施加热量，在梳齿电极的表面上形成包含离子的氧化物层; 以及在施加到其上的热量在可动电极和固定电极之间施加电压，从而使包含在氧化物层中的离子移动到氧化物层的表面; 其中，可动电极和固定电极之间的电压发生变化，从而重复将可动电极的每个梳齿的操作交替地拉到固定电极的两个相对的梳齿上，并且拉动电压和拉入状态释放电压逐渐增加。

5. 发明申请

US20060134820A1 Process for forming microstructures 有权
标题翻译：微结构形成工艺
公开(公告)号：US20060134820A1
公开(公告)日：2006-06-22
申请号：US11102982
申请日：2005-04-11
申请人： Weilong Tang , Tseng-Yang Hsu , Salleh Ismail , Nim Tea , Melvin Khoo , Raffi Garabedian , Lakshmikanth Namburi
发明人： Weilong Tang , Tseng-Yang Hsu , Salleh Ismail , Nim Tea , Melvin Khoo , Raffi Garabedian , Lakshmikanth Namburi
IPC分类号： H01L21/00 , H01L21/44
CPC分类号： B81C1/00436 , B81C1/00666 , B81C2201/0107 , B81C2201/0197
摘要： The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.
摘要翻译：本发明涉及一种在基板上形成微观结构的方法。将电镀表面施加到基板。将第一层光致抗蚀剂施加在电镀基底上。第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。第二图案是围绕一次结构的区域，但不包含整个基板。相反，它是一个围绕着主要金属的岛屿。然后将次级金属的暴露表面加工到初级金属的期望高度。然后将二次金属蚀刻掉。

6. 发明申请

US20140065751A1 Method For Manufacturing Three-Dimensionally Shaped Comb-Tooth Electret Electrode 有权
标题翻译：制造三维梳齿驻极体电极的方法
公开(公告)号：US20140065751A1
公开(公告)日：2014-03-06
申请号：US13968817
申请日：2013-08-16
申请人： AOI Electronics Co., Ltd.
发明人： Masato SUZUKI , Hiroki HAYASHI
IPC分类号： B81C1/00
CPC分类号： B81C1/00 , B81C1/00436 , H01G7/025
摘要： A method for manufacturing a three-dimensionally shaped comb-tooth electret electrode, provided with positive ions, includes: forming a three-dimensional movable comb-tooth electrode and a three-dimensional fixed comb-tooth electrode from an Si substrate; contacting a vapor including ions thereto, and forming an oxide layer including ions upon surfaces of the comb-tooth electrodes with heat applied thereto; and applying a voltage between the movable electrode and the fixed electrode with heat applied thereto, and thereby causing the ions included in the oxide layer to shift to a surface of the oxide layer; wherein, the voltage between the movable electrode and the fixed electrode is changed, so that the operation of each of the comb-teeth of the movable electrode being alternatingly pulled in against two opposed comb-teeth of the fixed electrode is repeated, and the pulling in voltage and the pulled-in state release voltage are gradually increased.
摘要翻译：具有正离子的三维形状的梳齿驻极体电极的制造方法包括：从Si基板形成三维可动梳齿电极和三维固定梳齿电极; 使含有离子的蒸气接触，并在其上施加热量，在梳齿电极的表面上形成包含离子的氧化物层; 以及在施加到其上的热量在可动电极和固定电极之间施加电压，从而使包含在氧化物层中的离子移动到氧化物层的表面; 其中，可动电极和固定电极之间的电压发生变化，从而重复将可动电极的每个梳齿的操作交替地拉到固定电极的两个相对的梳齿上，并且拉动电压和拉入状态释放电压逐渐增加。

7. 发明授权

US6096656A Formation of microchannels from low-temperature plasma-deposited silicon oxynitride 有权
标题翻译：从低温等离子体沉积的氮氧化硅形成微通道
公开(公告)号：US6096656A
公开(公告)日：2000-08-01
申请号：US339715
申请日：1999-06-24
申请人： Carolyn M. Matzke , Carol I. H. Ashby , Monica M. Bridges , Ronald P. Manginell
发明人： Carolyn M. Matzke , Carol I. H. Ashby , Monica M. Bridges , Ronald P. Manginell
IPC分类号： B81C1/00 , H01L21/00
CPC分类号： B81C1/00071 , B81C1/00436 , G01N27/44791 , G01N30/6095 , B81B2201/058 , B81C2201/0109
摘要： A process for forming one or more fluid microchannels on a substrate is disclosed that is compatible with the formation of integrated circuitry on the substrate. The microchannels can be formed below an upper surface of the substrate, above the upper surface, or both. The microchannels are formed by depositing a covering layer of silicon oxynitride over a mold formed of a sacrificial material such as photoresist which can later be removed. The silicon oxynitride is deposited at a low temperature (.ltoreq.100.degree. C.) and preferably near room temperature using a high-density plasma (e.g. an electron-cyclotron resonance plasma or an inductively-coupled plasma). In some embodiments of the present invention, the microchannels can be completely lined with silicon oxynitride to present a uniform material composition to a fluid therein. The present invention has applications for forming microchannels for use in chromatography and electrophoresis. Additionally, the microchannels can be used for electrokinetic pumping, or for localized or global substrate cooling.
摘要翻译：公开了一种在衬底上形成一个或多个流体微通道的方法，其与在衬底上形成集成电路相兼容。微通道可以形成在衬底的上表面下方，上表面上方或两者。通过在由牺牲材料（例如光致抗蚀剂）形成的模具上沉积氮氧化硅覆盖层而形成微通道，后者可以被去除。使用高密度等离子体（例如电子回旋共振等离子体或电感耦合等离子体）在低温（<100℃），优选在室温附近沉积氧氮化硅。在本发明的一些实施例中，微通道可以用氮氧化硅完全衬里，以向其中的流体呈现均匀的材料组成。本发明具有形成用于色谱和电泳的微通道的应用。此外，微通道可用于电动泵送，也可用于局部或全局衬底冷却。

8. 发明授权

US09522823B2 Apparatus for cutting transmission electron microscope micro-grids 有权
标题翻译：用于切割透射电子显微镜微格栅的设备
公开(公告)号：US09522823B2
公开(公告)日：2016-12-20
申请号：US13729425
申请日：2012-12-28
申请人： Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
发明人： Chen Feng , Xue-Wei Guo
IPC分类号： B26F1/02 , B81C1/00 , H01J37/20
CPC分类号： B81C1/00436 , B26F1/02 , H01J37/20 , Y10T225/393
摘要： An apparatus for cutting micro-grids from a metal substrate is provided. The apparatus includes a support and a cutting module. The support includes a supporting surface, the support is configured to support a micro-grid and the metal substrate. The cutting module includes a fixing element, a spring and a cutting structure. The fixing structure and the spring are located in the cutting structure. The fixing element is configured to fix the micro-grid on the supporting surface. The cutting structure is configured to cut the micro-grid from the metal substrate.
摘要翻译：提供了一种用于从金属基板切割微格栅的设备。该装置包括支撑件和切割模块。支撑件包括支撑表面，支撑构造成支撑微格栅和金属基底。切割模块包括固定元件，弹簧和切割结构。固定结构和弹簧位于切割结构中。固定元件构造成将微格栅固定在支撑表面上。切割结构被配置为从金属基底切割微格栅。

9. 发明授权

US09149804B2 Microfluidic device and method for producing a microfluidic device 有权
标题翻译：用于生产微流体装置的微流体装置和方法
公开(公告)号：US09149804B2
公开(公告)日：2015-10-06
申请号：US14127045
申请日：2012-05-22
申请人： Thomas Brettschneider , Christian Dorrer
发明人： Thomas Brettschneider , Christian Dorrer
IPC分类号： B01L3/00 , B81C1/00 , F15C3/00 , B81C99/00 , F16K99/00 , G01F11/08 , B29L31/00
CPC分类号： B01L3/50273 , B01L3/502738 , B01L2200/10 , B01L2300/0874 , B01L2300/0887 , B01L2300/089 , B01L2300/12 , B01L2300/14 , B01L2400/0481 , B01L2400/0487 , B01L2400/06 , B01L2400/0638 , B29L2031/7506 , B81C1/00436 , B81C99/0085 , F16K99/0015 , F16K99/0034 , F16K2099/0084 , G01F11/086 , Y10T137/85978
摘要： A microfluidic device includes at least two layers arranged one above the other, a membrane which is arranged between the at least two layers, a cavity in one of the at least two layers, and a channel in the other of the at least two layers. The membrane is arranged so as to be expandable between the cavity and the channel. The membrane is expandable into at least one specified displacement volume.
摘要翻译：微流体装置包括一个彼此排列的至少两个层，布置在所述至少两个层之间的膜，至少两个层中的一个中的空腔和在所述至少两个层中的另一层中的通道。膜被布置成在腔和通道之间可扩张。膜可扩展至至少一个特定的位移体积。

10. 发明授权

US07271022B2 Process for forming microstructures 有权
标题翻译：微结构形成工艺
公开(公告)号：US07271022B2
公开(公告)日：2007-09-18
申请号：US11102982
申请日：2005-04-11
申请人： Weilong Tang , Tseng-Yang Hsu , Salleh Ismail , Nim Hak Tea , Melvin B Khoo , Raffi Garabedian , Lakshimikanth Namburi
发明人： Weilong Tang , Tseng-Yang Hsu , Salleh Ismail , Nim Hak Tea , Melvin B Khoo , Raffi Garabedian , Lakshimikanth Namburi
IPC分类号： H01L21/00 , H01L21/4763
CPC分类号： B81C1/00436 , B81C1/00666 , B81C2201/0107 , B81C2201/0197
摘要： The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.
摘要翻译：本发明涉及一种在基板上形成微观结构的方法。将电镀表面施加到基板。将第一层光致抗蚀剂施加在电镀基底上。第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。第二图案是围绕一次结构的区域，但不包含整个基板。相反，它是一个围绕着主要金属的岛屿。然后将次级金属的暴露表面加工到初级金属的期望高度。然后将二次金属蚀刻掉。

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