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    • 8. 发明授权
    • Built-in self-test method and structure
    • 内置自检方法和结构
    • US08890557B2
    • 2014-11-18
    • US13443450
    • 2012-04-10
    • Yoba AmoahJohn J. Ellis-MonaghanRoger C. KuoMolly J. LeitchZhihong Zhang
    • Yoba AmoahJohn J. Ellis-MonaghanRoger C. KuoMolly J. LeitchZhihong Zhang
    • G01R31/3187
    • G01R31/318511G01R31/2856G11C29/006G11C29/12G11C2029/1206
    • A method of testing a semiconductor wafer and a related structure. In various embodiments, a method includes: placing a probe on a first chip on the semiconductor wafer; testing a scribe line automatic built-in self-test (ABIST) for the first chip to search for a fault; progressively testing a subsequent scribe line ABIST for a subsequent chip on the semiconductor wafer in response to determining the ABIST for the first chip does not indicate the fault; moving the probe point to the subsequent chip and retesting the subsequent scribe line ABIST in response to determining the ABIST for the subsequent chip indicates a fault; and testing a further subsequent scribe line ABIST for a further subsequent chip on the semiconductor wafer in response to determining the retesting of the subsequent scribiline ABIST does not indicate a fault in the subsequent scribe line ABIST.
    • 一种半导体晶片的测试方法及相关结构。 在各种实施例中,一种方法包括:将探针放置在半导体晶片上的第一芯片上; 测试划线自动内置自检(ABIST)为第一芯片寻找故障; 响应于确定第一芯片的ABIST而对半导体晶片上的后续芯片进行随后的划线ABIST的逐步测试不表示故障; 将探针点移动到随后的芯片,并且响应于确定随后芯片的ABIST指示故障,重新测试随后的划线ABIST; 以及响应于确定随后的scribiline的重新测试,测试另一后续划线ABIST用于半导体晶片上的另外的后续芯片,ABIST不指示后续划线ABIST中的故障。