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    • 6. 发明授权
    • Semiconductor laser device capable of preventing a threshold current and an operating current from increasing and manufacturing method therefor
    • 能够防止阈值电流和工作电流的半导体激光装置的增加和制造方法
    • US06999488B2
    • 2006-02-14
    • US10602827
    • 2003-06-25
    • Atsuo Tsunoda
    • Atsuo Tsunoda
    • H01S5/00
    • B82Y20/00H01S5/0421H01S5/2201H01S5/2206H01S5/2231H01S5/34326H01S2301/173H01S2304/02
    • A ridge section constructed of a p-type second AlGaInP clad layer 8, a p-type GaInP interlayer 9 and a p-type GaAs cap layer 10 is formed on an etching stop layer 7. A step of not smaller than 0.13 μm is formed between the p-type interlayer 9 and the p-type second clad layer 8 by making the p-type interlayer 9 protrude in both widthwise directions beyond the p-type second clad layer 8. With this step, AlInP layers can be formed separately from each other on both sides of the ridge section and on the ridge section. Therefore, when the AlInP layer on the ridge section is removed by etching, an AlInP current constriction layer 13 located on both sides of the ridge section is reliably protected by a resist film and not over-etched. The AlInP current constriction layer 13 effectively puts a current constriction function into effect, so that a semiconductor laser device of low-threshold current and low-power consumption is obtained.
    • 在蚀刻停止层7上形成由p型第二AlGaInP包覆层8,p型GaInP夹层9和p型GaAs覆盖层10构成的脊部。 通过使p型中间层9在宽度方向上突出超过p型第二覆盖层8,在p型中间层9和p型第二覆盖层8之间形成不小于0.13μm的台阶。 通过该步骤,AlInP层可以在脊部两侧和脊部两侧彼此分开形成。 因此,当通过蚀刻去除脊部上的AlInP层时,位于脊部两侧的AlInP电流收缩层13可靠地被抗蚀剂膜保护而不被过度蚀刻。 AlInP电流收缩层13有效地使电流收缩功能起作用,从而获得低阈值电流和低功耗的半导体激光器件。