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1. 发明公开

US20240186976A1 SINGLE ANCHOR RESONATORS 审中-公开
公开(公告)号：US20240186976A1
公开(公告)日：2024-06-06
申请号：US18061252
申请日：2022-12-02
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： Amir RAHAFROOZ , Diego EMILIO SERRANO , Thomas Kieran NUNAN , Ijaz JAFRI
IPC分类号： H03H9/02 , H03H9/24
CPC分类号： H03H9/02433 , H03H9/2405 , H03H2009/0244 , H03H2009/2442
摘要： A mechanical resonator includes two identical plates, and a decoupling structure comprising at least two first connectors, each first connector connecting the decoupling structure to a respective one of the two identical plates, and an anchor disposed at a center of the decoupling structure. Each of the two identical plates may be a square plate adapted to resonate in Lamé-mode. Further, each of the two identical plates may comprise a plurality of square plates, each square plate disposed next to one another. The decoupling structure further comprises a first ring connected to each of the two identical plates via a respective one of the at least two first connectors. The decoupling structure may further comprise a second ring connected to an inside of the first ring via at least two second connectors, wherein the anchor is disposed at a center of the second ring.

2. 发明授权

US11897757B1 MEMS resonator with beam segments having predefined angular offset to each other and to resonator silicon crystal orientation 有权
公开(公告)号：US11897757B1
公开(公告)日：2024-02-13
申请号：US17384535
申请日：2021-07-23
申请人： SiTime Corporation
发明人： Renata M. Berger , Ginel C. Hill , Paul M. Hagelin , Charles I. Grosjean , Aaron Partridge , Joseph C. Doll , Markus Lutz
IPC分类号： B81B3/00 , H03H9/02 , H03H9/24
CPC分类号： B81B3/0024 , H03H9/02448 , H03H9/2405
摘要： The present inventions, in one aspect, are directed to micromachined resonator comprising: a first resonant structure extending along a first axis, wherein the first axis is different from a crystal axis of silicon, a second resonant structure extending along a second axis, wherein the second axis is different from the first axis and the crystal axis of silicon and wherein the first resonant structure is coupled to the second resonant structure, and wherein the first and second resonant structures are comprised of silicon (for example, substantially monocrystalline) and include an impurity dopant (for example, phosphorus) having a concentrations which is greater than 1019 cm−3, and preferably between 1019 cm−3 and 1021 cm−3.

3. 发明授权

US11807518B1 Multi-die integrated circuit package 有权
公开(公告)号：US11807518B1
公开(公告)日：2023-11-07
申请号：US15627049
申请日：2017-06-19
申请人： SiTime Corporation
发明人： Renata M. Berger , Ginel C. Hill , Paul M. Hagelin , Charles I. Grosjean , Aaron Partridge , Joseph C. Doll , Markus Lutz
IPC分类号： B81B3/00 , H03H9/02 , H03H9/24
CPC分类号： B81B3/0024 , H03H9/02448 , H03H9/2405
摘要： The present inventions, in one aspect, are directed to micromachined resonator comprising: a first resonant structure extending along a first axis, wherein the first axis is different from a crystal axis of silicon, a second resonant structure extending along a second axis, wherein the second axis is different from the first axis and the crystal axis of silicon and wherein the first resonant structure is coupled to the second resonant structure, and wherein the first and second resonant structures are comprised of silicon (for example, substantially monocrystalline) and include an impurity dopant (for example, phosphorus) having a concentrations which is greater than 1019 cm-3, and preferably between 1019 cm-3 and 1021 cm-3.

4. 发明授权

US11703331B2 Three dimensional microstructures with selectively removed regions for use in gyroscopes and other devices 有权
公开(公告)号：US11703331B2
公开(公告)日：2023-07-18
申请号：US17205562
申请日：2021-03-18
申请人： THE REGENTS OF THE UNIVERSITY OF MICHIGAN
发明人： Khalil Najafi , Sajal Singh , Jae Yoong Cho
IPC分类号： G01C19/5783 , G01C19/00 , H03H3/007 , G01C19/5691 , B81B3/00 , H03H9/02 , G01C19/5684 , B81C1/00 , H03H9/24
CPC分类号： G01C19/5783 , B81B3/0021 , B81C1/00444 , G01C19/005 , G01C19/5684 , G01C19/5691 , H03H3/0072 , H03H9/02259 , H03H9/2405 , B81B2201/0242 , B81B2201/0271 , B81C2201/0143 , H03H2009/02496
摘要： Three-dimensional (3D) micro-scale shells are presented with openings of various sizes and geometries on the surface. The shell consist of a suspended ring-shaped resonator, multiple support beams, a support post, and a cap region that connects the support beams to the support post. Shells with openings of various sizes and geometries allow the creation of micro electromechanical systems (MEMS) sensors and actuators with a wide range of engineered mechanical and electrical properties. The openings on the shell surface can, for example, control the mechanical quality factor (Q) and resonance frequencies of the shell when the shell is used as a suspended proof mass of a mechanical resonator of a vibratory gyroscope. The shells can also serve as mechanical supporting layers and/or an electrode connection layer for MEMS actuators and sensors that use 3D shells as proof masses.

5. 发明授权

US10505497B2 Low-power microelectromechanical system resonator based oscillator using impedance transformation 有权
公开(公告)号：US10505497B2
公开(公告)日：2019-12-10
申请号：US15726291
申请日：2017-10-05
申请人： Texas Instruments Incorporated
发明人： Bichoy Bahr , Baher Haroun , Ali Kiaei
IPC分类号： H03B5/30 , H03H9/24 , H03B5/32 , H03B5/36 , H03B5/12 , H03H9/05 , H03H9/17
CPC分类号： H03B5/30 , H03B5/1296 , H03B5/326 , H03B5/364 , H03H9/2405 , H03B2200/0086 , H03H9/0542 , H03H9/0547 , H03H9/175
摘要： An oscillator is provided with an oscillator circuit having tank circuit terminals for coupling to a tank circuit. A microelectromechanical system (MEMS) resonator serves as a tank circuit. The MEMS resonator is coupled to the oscillator circuit using a transformer with a primary coil coupled to the oscillator tank circuit terminals and a secondary coil coupled to the MEMS resonator terminals, wherein the transformer has a turns ratio of N:1 and N is greater than 1.

6. 发明申请

US20180191330A1 RESONATOR AND RESONANCE DEVICE 审中-公开
公开(公告)号：US20180191330A1
公开(公告)日：2018-07-05
申请号：US15904975
申请日：2018-02-26
申请人： Murata Manufacturing Co., Ltd.
发明人： Toshio Nishimura , Ville Kaajakari
IPC分类号： H03H9/24 , H03H9/02 , H03H9/05 , H03H9/10
CPC分类号： H03H9/2405 , H03H9/02433 , H03H9/0595 , H03H9/1057 , H03H2009/0244
摘要： A resonator that includes a piezoelectric vibrator, a frame, and a first node generator between the piezoelectric vibrator and the frame. Moreover, a first connecting arm connects the first node generator to the piezoelectric vibrator that opposes the first, and a first holding arm connects the first node generator to a part of the frame that opposes the first node generator. The first node generator includes a width extending in a second direction, which is orthogonal to a first direction of the first connecting arm, that is a maximum width where the first node generator is closer to the first connecting arm than a center of the first node generator relative to the first direction. Moreover, the width of the first node generator gradually decreases from the maximum width as the first node generator extends towards the first holding arm.

7. 发明授权

US09991869B2 Temperature compensated compound resonator 有权
公开(公告)号：US09991869B2
公开(公告)日：2018-06-05
申请号：US14874514
申请日：2015-10-05
申请人： Teknologian tutkimuskeskus VTT Oy
发明人： Antti Jaakkola , Panu Pekko , Mika Prunnila , Tuomas Pensala
IPC分类号： H03H3/013 , H03H9/02 , H03H9/05 , H03H9/24 , H03H3/007
CPC分类号： H03H9/02448 , H03H9/0538 , H03H9/2405 , H03H2009/02527 , H03H2009/241 , H03H2009/2442
摘要： The invention concerns microelectromechanical resonators. In particular, the invention provides a resonator comprising a support structure, a doped semiconductor resonator suspended to the support structure by at least one anchor, and actuator for exciting resonance into the resonator. According to the invention, the resonator comprises a base portion and at least one protrusion extending outward from the base portion and is excitable by said actuator into a compound resonance mode having temperature coefficient of frequency (TCF) characteristics, which are contributed by both the base portion and the at least one protrusion. The invention enables simple resonators, which are very well temperature compensated over a wide temperature range.

8. 发明授权

US09676617B2 Micro-electro-mechanical transducer having an optimized non-flat surface 有权
公开(公告)号：US09676617B2
公开(公告)日：2017-06-13
申请号：US14642521
申请日：2015-03-09
申请人： Kolo Technologies, Inc.
发明人： Yongli Huang
IPC分类号： B81C1/00 , H02N1/00 , H04R19/00 , B81B3/00 , H03H9/24 , H03H9/46 , H03H9/02 , H03H3/007
CPC分类号： B81C1/00626 , B81B3/0027 , B81C1/00158 , B81C1/00182 , B81C1/00357 , B81C1/00373 , B81C1/00523 , H01L2924/0002 , H02N1/006 , H03H3/0072 , H03H9/02259 , H03H9/2405 , H03H9/462 , H04R19/005 , H04R2201/003 , Y10T29/42 , Y10T29/49005 , H01L2924/00
摘要： A method for a capacitive micromachined ultrasound transducer (cMUT) is provided. The method grows and patterns a diffusion barrier layer over a surface of a base layer. The diffusion barrier layer have different areas that allow different levels of diffusion penetration. A diffusion process is performed over the diffusion barrier layer such that a diffusion reactivated material reaches different depths into the base layer below the different areas. A anchor is formed using the diffusion reactivated material. The anchor has a lower portion below a major surface of the base layer and an upper portion above the major surface of the base layer. A cover layer is placed over the anchor and the base layer. At least one of the cover layer and the base layer includes a flexible layer, such that the cMUT electrodes are movable relative to each other to cause a change of the gap width.

9. 发明授权

US09663346B1 MEMs-based resonant FinFET 有权
公开(公告)号：US09663346B1
公开(公告)日：2017-05-30
申请号：US15046245
申请日：2016-02-17
申请人： GLOBALFOUNDRIES Inc.
发明人： Bichoy Bahr , Zoran Krivokapic
IPC分类号： H03B1/00 , H03K3/00 , B81B3/00 , H03H3/007 , H03H9/24 , H01L29/78
CPC分类号： B81B3/0021 , B81B2201/0271 , H01L29/785 , H03H9/2405 , H03H2009/02314
摘要： A semiconductor structure includes a semiconductor substrate, fins coupled to the semiconductor substrate, FinFETs on the fins, a common gate for the FinFETs, a dielectric layer on the semiconductor substrate, the dielectric layer surrounding a cavity with the semiconductor substrate providing bottom confinement of the acoustic cavity by total internal reflection, and an interconnect structure above the FinFETs, the interconnect structure including phononic crystal(s) to confine acoustic energy in the cavity including the cavity and metal layer(s) sandwiched between two dielectric layers. The semiconductor structure may be realized, during FEOL fabrication of a FinFET, by forming a cavity on a surface of a semiconductor substrate. Then, after fabrication of the FinFET, forming an interconnect structure for the FinFET. During formation of the interconnect structure, materials of the interconnect structure are used to form a phononic crystal to confine the cavity between the phononic crystal and the semiconductor substrate.

10. 发明申请

US20160118954A1 COMPOUND SPRING MEMS RESONATORS FOR FREQUENCY AND TIMING GENERATION 有权
标题翻译：用于频率和时序生成的复合弹簧MEMS谐振器
公开(公告)号：US20160118954A1
公开(公告)日：2016-04-28
申请号：US14883435
申请日：2015-10-14
申请人： Micrel, Inc.
发明人： John Ryan Clark
IPC分类号： H03H9/24 , H02N1/00
CPC分类号： H03H9/2405 , H02N1/008 , H03H9/02244 , H03H9/2431 , H03H9/2452 , H03H2009/02251 , H03H2009/02283 , H03H2009/02307 , H03H2009/0233 , H03H2009/02496
摘要： A compound spring MEMS resonator includes a resonator body constructed using one or more spring unit cells forming a compound spring block and one or more compound spring blocks forming the resonator body. Each compound spring block is anchored at nodal points to ensure a high quality factor. The resonator body further includes masses attached to the open ends of the compound spring block and capacitively coupled to drive/sense electrodes. The dimensions of the spring unit cells, the number of spring unit cells for a compound spring block, the size and weight of the masses, and the length and width of the support beams are selected to realize a desired resonant frequency. Meanwhile, the number of compound spring blocks is selected to tune the desired electrical characteristics, such as impedance, of the MEMS resonator.
摘要翻译：复合弹簧MEMS谐振器包括使用形成复合弹簧块的一个或多个弹簧单元构成的谐振器主体和形成谐振器体的一个或多个复合弹簧块。每个复合弹簧块锚定在节点，以确保高品质因素。谐振器体还包括附接到复合弹簧块的开口端的质量，并且电容耦合到驱动/感测电极。选择弹簧单元的尺寸，复合弹簧块的弹簧单元的数量，质量的尺寸和重量以及支撑梁的长度和宽度以实现期望的谐振频率。同时，选择复合弹簧块的数量来调节MEMS谐振器的期望的电特性，例如阻抗。

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