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1. 发明申请

US20180263121A1 MOUNTING AID AND METHOD FOR MOUNTING ELECTRICAL COMPONENTS ON A PRINTED CIRCUIT BOARD 审中-公开
公开(公告)号：US20180263121A1
公开(公告)日：2018-09-13
申请号：US15913094
申请日：2018-03-06
申请人： BorgWarner Ludwigsburg GmbH
发明人： Sisay Tadele , Helmut Hoppe , Alexander Dauth , Gerd Bräuchle
IPC分类号： H05K3/30
CPC分类号： H05K3/306 , H01G2/06 , H01G2/106 , H01G9/06 , H01G9/08 , H01G9/26 , H05K1/18 , H05K3/301 , H05K3/3447 , H05K2201/09027 , H05K2201/10015 , H05K2201/1003 , H05K2201/10265 , H05K2201/10272 , H05K2201/10522 , H05K2201/10606 , H05K2201/10628 , H05K2201/10651 , H05K2201/10901 , H05K2201/2018 , H05K2201/2045
摘要： What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.

2. 发明申请

US20180177058A1 Electronic Module with a Component Which Can Be Flexibly Placed By Means of a Base Element, and Method for Producing Same 审中-公开
公开(公告)号：US20180177058A1
公开(公告)日：2018-06-21
申请号：US15736749
申请日：2016-06-06
申请人： Robert Bosch GmbH
发明人： Uwe Liskow
IPC分类号： H05K3/28 , H05K1/18 , H05K5/06 , H05K1/11 , H05K3/32 , H05K5/00
CPC分类号： H05K3/284 , H05K1/111 , H05K1/181 , H05K3/301 , H05K3/328 , H05K5/0082 , H05K5/065 , H05K2201/10151 , H05K2201/10189 , H05K2201/105 , H05K2201/10522 , H05K2201/10606 , H05K2201/2072 , H05K2203/1316 , H05K2203/1327
摘要： An electronic module includes a circuit board, a first component, and a socket element with a first surface and a second surface opposite the first surface. The first surface lies on a surface of the circuit board and is fixed to the circuit board. A second component is secured to the socket element and is electrically connected to the circuit board via the socket element. A protective compound is arranged on the surface of the circuit board and encapsulates the first component. The socket element is partly embedded into the protective compound such that lateral flanks of the socket element are covered by the protective compound, and the second surface of the socket element protrudes out of the protective compound. Connection elements of the socket element and connections of the second component are connected via a welding connection. Second components are attachable to the circuit board in a reliable manner.

3. 发明申请

US20170365945A1 EDGE ASSEMBLY FOR ATTACHING TO FLEXIBLE SUBSTRATES 审中-公开
公开(公告)号：US20170365945A1
公开(公告)日：2017-12-21
申请号：US15533314
申请日：2015-11-16
申请人： OSRAM SYLVANIA Inc.
发明人： Richard Speer , Kenneth Grossman
IPC分类号： H01R12/77 , F21V19/00 , H01R12/70 , F21V23/06 , F21Y2105/10 , F21Y2107/70
CPC分类号： H01R12/772 , F21S8/04 , F21V19/003 , F21V23/06 , F21Y2105/10 , F21Y2107/70 , H01R12/7011 , H01R12/714 , H01R12/777 , H01R12/79 , H05K3/365 , H05K2201/10106 , H05K2201/1059 , H05K2201/10606
摘要： There is described an edge assembly for attaching to flexible substrates. An example assembly may comprise at least a first edge component and a compression retainer component. The first edge component may include at least one conductor to mate with one or more conductors on a surface of a flexible substrate after the first edge component is affixed to an edge of the flexible substrate by the compression retainer component. The edge assembly may also comprise a second edge component, wherein the flexible substrate may be compressed between the first and second edge components and held in place by the compression retainer component. The first edge component may further comprise an extension, including the at least one conductor, that may be used to convey power from a power source to the flexible substrate. The extension is accessible from outside the flexible substrate via a port in the compression retainer component.

4. 发明授权

US09608364B2 Printed circuit board, method of manufacturing same, and method of mounting the circuit board in a connector socket 有权
公开(公告)号：US09608364B2
公开(公告)日：2017-03-28
申请号：US14060873
申请日：2013-10-23
申请人： GERMANE SYSTEMS, LC
发明人： Michael Stock , Scott Semmler
IPC分类号： H01R13/533 , H05K3/00 , H05K7/14 , H05K1/14 , H01R12/70 , H05K3/36
CPC分类号： H01R13/533 , H01R12/7029 , H05K1/141 , H05K3/00 , H05K3/366 , H05K7/1405 , H05K2201/09045 , H05K2201/09909 , H05K2201/10159 , H05K2201/10325 , H05K2201/10606 , Y10T29/49117 , Y10T156/1089
摘要： A circuit board that is to be mounted in a connector socket includes a plurality of electrical connectors located along a side edge of the circuit board. Retention bosses are formed on first and second opposite sides of the circuit board, each of the retention bosses protruding from a surface of the circuit board and extending parallel to and adjacent to the first edge of the circuit board. When the first edge of the circuit board is inserted into a slot of a connector socket, contact surfaces of the first and second retention bosses contact top surfaces of the connector socket to help immobilize the circuit board with respect to the connector socket. Adhesive layers on the contact surfaces of the first and second retention bosses may adhere to the top surfaces of the connector socket to help hold the circuit board immobile with respect to the connector socket.

5. 发明授权

US09192059B2 Battery holder for printed circuit board 有权
标题翻译：电路板用于印刷电路板
公开(公告)号：US09192059B2
公开(公告)日：2015-11-17
申请号：US13078564
申请日：2011-04-01
申请人： Thomas Blaha , Charles Engelstein
发明人： Thomas Blaha , Charles Engelstein
IPC分类号： H01M2/02 , H05K3/30 , H05K3/34
CPC分类号： H05K3/301 , H05K3/3447 , H05K2201/10037 , H05K2201/10606
摘要： A battery holder for attachment to a printed circuit board includes a base, a positive conductor, a negative conductor and a top. The base is to be fixed to the printed circuit board and the two conductors are fixed to the base. The top includes a window for viewing the polarity of the battery and is selectively attached to the base by a series of latches.
摘要翻译：用于附接到印刷电路板的电池保持器包括基座，正导体，负导体和顶部。基座固定在印刷电路板上，两根导体固定在基座上。顶部包括用于观察电池极性的窗口，并且通过一系列闩锁选择性地附接到基座。

6. 发明授权

US08717752B2 Drive enclosures for tool-less removable mounting of solid state drives onto printed circuit board devices 有权
标题翻译：驱动器外壳，可将固态驱动器无需拆卸式安装到印刷电路板上
公开(公告)号：US08717752B2
公开(公告)日：2014-05-06
申请号：US13170852
申请日：2011-06-28
申请人： John M. Dunham , Jason M. Stuhlsatz , Ron G. Duren
发明人： John M. Dunham , Jason M. Stuhlsatz , Ron G. Duren
IPC分类号： G06F1/16 , H05K7/14
CPC分类号： H05K1/141 , H05K3/368 , H05K2201/042 , H05K2201/10159 , H05K2201/10606
摘要： Methods and systems for removably mounting a Solid State Drive (SSD) to a Printed Circuit Board (PCB) device without use of a tool. An exemplary system comprises a top portion and at least two flexible legs. Each leg comprises a vertical member attached to the top portion, and a tab for insertion into the PCB, the tab restricting the motion of the drive enclosure with respect to the PCB when inserted into the PCB, thereby allowing for removable attachment of the enclosure to the PCB without use of a tool. The drive enclosure itself is adapted to receive the SSD and adapted to align the SSD for physical coupling with a connector for the PCB.
摘要翻译：将固态硬盘（SSD）可拆卸地安装到印刷电路板（PCB）设备而不使用工具的方法和系统。示例性系统包括顶部部分和至少两个柔性支腿。每个腿包括附接到顶部的垂直构件和用于插入到PCB中的突出部，该突出部在插入到PCB中时限制驱动器壳体相对于PCB的运动，从而允许将外壳可拆卸地附接到 PCB不使用工具。驱动器机箱本身适于接收SSD并适于将SSD与用于PCB的连接器进行物理耦合对准。

7. 发明授权

US08553429B2 Electrical component mounting assemblies 有权
标题翻译：电气元件安装组件
公开(公告)号：US08553429B2
公开(公告)日：2013-10-08
申请号：US12679684
申请日：2008-09-24
申请人： Niall McNamara , Brendan Maguire , Denis O'Sullivan , SeanGearoid McMahon , Colm Reidy , Michael Crampton
发明人： Niall McNamara , Brendan Maguire , Denis O'Sullivan , SeanGearoid McMahon , Colm Reidy , Michael Crampton
IPC分类号： H05K7/02 , H05K7/04
CPC分类号： H05K3/301 , H05K3/308 , H05K7/12 , H05K2201/09827 , H05K2201/10015 , H05K2201/10325 , H05K2201/10583 , H05K2201/1059 , H05K2201/10606
摘要： An electrical component mounting assembly is disclosed for attaching a cylindrical electrical component (C1) such as capacitor, diode, or resistor to a mounting member such as a printed circuit board in a horizontal or vertical orientation. The mounting assembly can have a housing (12) and a sleeve (14) placed around the electrical component which cooperates with the housing to retain the electrical component to the housing. A substantially inner cylindrical wall (32) of the housing can taper inward from an entrance (34) end to a rear wall (18) to form a tapering or narrowing chamber (30). The sleeve can have a slit that runs along the entire length of the sleeve and a tapered outer surface (28) that cooperates with the tapered chamber to clamp or compress against the electrical component as the sleeve is inserted into the housing. The lack of appreciable expansion of the housing creates a tight friction fit to secure the sleeve to the housing. The sleeve can also include a plank that is received in an opening in the housing which can be heat staked to reinforce the friction fit taper lock between the housing and sleeve. The housing can be dimensioned to mount more than one electrical component diameter size by varying the dimensions of the sleeve, and in particular the thickness of sleeve.
摘要翻译：公开了一种用于将诸如电容器，二极管或电阻器的圆柱形电气元件（C1）以水平或垂直取向附接到诸如印刷电路板的安装构件的电气部件安装组件。安装组件可以具有壳体（12）和围绕电气部件设置的套筒（14），该套件与壳体配合以将电气部件保持在壳体上。壳体的基本上内圆柱形的壁（32）可以从入口（34）端向后壁（18）向内锥形以形成锥形或变窄的腔室（30）。套筒可以具有沿套筒的整个长度延伸的狭缝和锥形外表面（28），锥形外表面（28）与套筒插入到壳体中时与锥形室配合以夹紧或压缩电气部件。外壳缺乏明显的膨胀产生紧密的摩擦配合以将套筒固定到壳体上。套筒还可以包括容纳在壳体中的开口中的板材，该板材可以被热铆接以加强壳体和套筒之间的摩擦配合锥形锁定。可以通过改变套筒的尺寸，特别是套筒的厚度来确定外壳的尺寸以安装多于一个电气部件的直径尺寸。

8. 发明申请

US20130182385A1 Subsea Control System 有权
标题翻译：海底控制系统
公开(公告)号：US20130182385A1
公开(公告)日：2013-07-18
申请号：US13876841
申请日：2011-02-04
申请人： Karstein Kristiansen , Kjetil Zsolt Volent
发明人： Karstein Kristiansen , Kjetil Zsolt Volent
IPC分类号： G06F1/16
CPC分类号： G06F1/16 , H05K1/141 , H05K3/301 , H05K7/12 , H05K2201/10159 , H05K2201/10325 , H05K2201/10409 , H05K2201/10598 , H05K2201/10606
摘要： A subsea control system may include a computer unit including a printed circuit board that contains a central processing unit, and a socket for holding at least one memory card, whereby the computer unit has a screw hole, a wedged plate is fixed above at least a part of the socket by a screw which is screwed into the screw hole for fixing the at least one memory card placed in the socket.
摘要翻译：海底控制系统可以包括包括中央处理单元的印刷电路板和用于保持至少一个存储卡的插座的计算机单元，由此计算机单元具有螺孔，楔形板固定在至少一个该插座的一部分被螺钉拧入螺钉孔中，用于固定放置在插座中的至少一个存储卡。

9. 发明授权

US08294817B2 Image pickup module having guide memeber for mechanical strength 有权
标题翻译：图像拾取模块具有用于机械强度的引导构件
公开(公告)号：US08294817B2
公开(公告)日：2012-10-23
申请号：US12850983
申请日：2010-08-05
申请人： Hiroyuki Motohara , Yoshiro Nishimura
发明人： Hiroyuki Motohara , Yoshiro Nishimura
IPC分类号： H04N5/225 , H04N9/04 , A61B1/04 , A61B1/00
CPC分类号： G03B17/02 , A61B1/00096 , A61B1/00101 , A61B1/04 , H04N5/2254 , H04N5/2257 , H04N2005/2255 , H05K1/189 , H05K3/301 , H05K2201/056 , H05K2201/10121 , H05K2201/10606
摘要： There is provided an image pickup module which can be formed by a simple process while securing the mechanical strength of an inner lead at the time of bending and when fixed, without increasing an outer dimension of the image pickup module.The image pickup module includes an image pickup element having an image pickup surface, and a flexible substrate is drawn to be directed rearward of the image pickup surface. A guide member which fixes the image pickup element and the flexible substrate is provided, and the guide member includes a portion which is extended along a rear surface of the image pickup element, and a portion which is extended along a gap between the image pickup element and the flexible substrate.
摘要翻译：提供了一种图像拾取模块，其可以通过简单的过程形成，同时在弯曲时和固定时确保内引线的机械强度，而不增加图像拾取模块的外部尺寸。图像拾取模块包括具有图像拾取表面的图像拾取元件，并且柔性基板被绘制成指向图像拾取表面的后方。提供固定图像拾取元件和柔性基板的引导构件，并且引导构件包括沿着图像拾取元件的后表面延伸的部分和沿图像拾取元件之间的间隙延伸的部分和柔性基板。

10. 发明授权

US08064191B2 Capacitor unit, and its manufacturing method 有权
标题翻译：电容器单元及其制造方法
公开(公告)号：US08064191B2
公开(公告)日：2011-11-22
申请号：US12280692
申请日：2007-03-13
申请人： Kazuki Morita , Tatehiko Inoue , Shusaku Kawasaki , Toshiyuki Kitagawa , Tooru Ninomiya
发明人： Kazuki Morita , Tatehiko Inoue , Shusaku Kawasaki , Toshiyuki Kitagawa , Tooru Ninomiya
IPC分类号： H01G2/20 , H01G5/38 , H05K7/18
CPC分类号： H01G2/06 , H01G2/106 , H01G2/12 , H01G9/008 , H01G9/08 , H01G9/26 , H05K1/18 , H05K3/284 , H05K3/301 , H05K3/3447 , H05K2201/10015 , H05K2201/10295 , H05K2201/10424 , H05K2201/10446 , H05K2201/10462 , H05K2201/10606 , H05K2201/10962 , H05K2203/1361
摘要： According to the configuration and the manufacturing method of forming a moisture proof agent on both surfaces of a circuit substrate after soldering a capacitor connection pin in a vertical direction to the circuit substrate, and electrically connecting the capacitor so as to be in a perpendicular direction to the length direction of the capacitor connection pin at the upper space of the circuit substrate, the possibility of the moisture proof agent attaching to the capacitor is eliminated, the productivity enhances since the moisture proof agent can be easily formed on both surfaces of the circuit substrate, and a capacitor unit of miniaturized and low height configuration is realized since the capacitor is mounted in the horizontal direction in the upper space with respect to the circuit substrate.
摘要翻译：根据在电容器连接引脚沿垂直方向焊接到电路基板之后，在电路基板的两面上形成防潮剂的结构和制造方法，并且将电容器电连接到与在电路基板的上部空间处的电容器连接针的长度方向，与电容器连接的防潮剂的可能性被消除，由于可以容易地在电路基板的两个表面上形成防潮剂，因此提高了生产率并且由于电容器相对于电路基板在上部空间中沿水平方向安装，所以实现了小型化和低高度配置的电容器单元。

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