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1. 发明授权

US10081170B2 Laminating apparatus 有权
公开(公告)号：US10081170B2
公开(公告)日：2018-09-25
申请号：US14462893
申请日：2014-08-19
申请人： NICHIGO-MORTON CO., LTD. , SHIN-ETSU CHEMICAL CO., LTD.
发明人： Ryoichi Yasumoto , Kazutoshi Iwata , Kinya Kodama , Grigoriy Basin
IPC分类号： B32B37/10 , B32B39/00 , B29C43/18 , B32B37/00 , H01L33/52 , H05K3/28
CPC分类号： B32B37/10 , B29C43/18 , B32B37/003 , B32B37/1009 , B32B39/00 , B32B2309/12 , B32B2309/65 , B32B2309/68 , B32B2457/08 , H01L33/52 , H05K3/284 , H05K2203/1311 , Y10T156/1744
摘要： A laminating apparatus for a provisionally laminated body is provided and is configured to form an end laminated body including one of a first resin film and a second resin film conforming to protruding and recessed portions of a substrate. The laminating apparatus may include first and second laminating mechanisms. The first laminating mechanism may include a first enclosed space forming receiver, a depressurizer, a heater, and a first pressure laminator to form an intermediate laminated body from the provisionally laminated body. The second laminating mechanism may include a second enclosed space forming receiver, and a second pressure laminator to form the end laminated body from the intermediate laminated body.

2. 发明申请

US20170223846A1 MULTI-PART FLEXIBLE ENCAPSULATION HOUSING FOR ELECTRONIC DEVICES 审中-公开
公开(公告)号：US20170223846A1
公开(公告)日：2017-08-03
申请号：US15119559
申请日：2015-03-04
申请人： MC10, INC.
发明人： Brian Elolampi , David G. Garlock , Harold Gaudette , Steven Fastert , Adam Standley , Yung-Yu Hsu
IPC分类号： H05K5/00 , H05K5/06 , H05K3/32 , H05K1/18
CPC分类号： H05K5/0034 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/32 , H05K5/0056 , H05K5/006 , H05K5/065 , H05K2201/09063 , H05K2201/09872 , H05K2201/10151 , H05K2203/1311 , H05K2203/1316
摘要： Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

3. 发明授权

US08969730B2 Printed circuit solder connections 有权
标题翻译：印刷电路焊接连接
公开(公告)号：US08969730B2
公开(公告)日：2015-03-03
申请号：US13587793
申请日：2012-08-16
申请人： Anthony S. Montevirgen , Emery A. Sanford , Stephen Brian Lynch
发明人： Anthony S. Montevirgen , Emery A. Sanford , Stephen Brian Lynch
IPC分类号： H05K1/00 , H05K1/14 , H05K1/02 , H05K3/36 , H05K1/11 , H05K3/34
CPC分类号： H05K1/14 , H05K1/0218 , H05K1/118 , H05K1/147 , H05K3/3494 , H05K3/363 , H05K2201/09481 , H05K2201/10666 , H05K2201/10977 , H05K2203/0195 , H05K2203/1147 , H05K2203/1311 , Y10T29/49121 , Y10T29/49155
摘要： Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces. A second printed circuit such as a flexible printed circuit may have openings. Solder connections may be formed in the openings to attach metal traces in the flexible printed circuit to the solder pads on the rigid printed circuit board. A ring of adhesive may surround the solder connections. The flexible printed circuit may be attached to the rigid printed circuit board using the ring of adhesive. An insulating tape may cover the solder connections. A conductive shielding layer with a conductive layer and a layer of conductive adhesive may overlap the solder joints. The conductive adhesive may connect the shielding layer to the metal traces on the rigid printed circuit board.
摘要翻译：印刷电路可以使用诸如焊料连接的连接彼此电连接和机械连接。诸如刚性印刷电路板的第一印刷电路板可以具有焊盘和其它金属迹线。诸如柔性印刷电路的第二印刷电路可以具有开口。可以在开口中形成焊接连接以将柔性印刷电路中的金属迹线附接到刚性印刷电路板上的焊盘。粘合剂环可以围绕焊料连接。柔性印刷电路可以使用粘合剂环附接到刚性印刷电路板。绝缘胶带可以覆盖焊料连接。具有导电层和导电粘合剂层的导电屏蔽层可与焊点重叠。导电粘合剂可以将屏蔽层连接到刚性印刷电路板上的金属迹线。

4. 发明申请

US20140048310A1 Printed Circuit Solder Connections 有权
标题翻译：印刷电路焊接连接
公开(公告)号：US20140048310A1
公开(公告)日：2014-02-20
申请号：US13587793
申请日：2012-08-16
申请人： Anthony S. Montevirgen , Emery A. Sanford , Stephen Brian Lynch
发明人： Anthony S. Montevirgen , Emery A. Sanford , Stephen Brian Lynch
IPC分类号： H05K1/14 , H05K1/02
CPC分类号： H05K1/14 , H05K1/0218 , H05K1/118 , H05K1/147 , H05K3/3494 , H05K3/363 , H05K2201/09481 , H05K2201/10666 , H05K2201/10977 , H05K2203/0195 , H05K2203/1147 , H05K2203/1311 , Y10T29/49121 , Y10T29/49155
摘要： Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces. A second printed circuit such as a flexible printed circuit may have openings. Solder connections may be formed in the openings to attach metal traces in the flexible printed circuit to the solder pads on the rigid printed circuit board. A ring of adhesive may surround the solder connections. The flexible printed circuit may be attached to the rigid printed circuit board using the ring of adhesive. An insulating tape may cover the solder connections. A conductive shielding layer with a conductive layer and a layer of conductive adhesive may overlap the solder joints. The conductive adhesive may connect the shielding layer to the metal traces on the rigid printed circuit board.
摘要翻译：印刷电路可以使用诸如焊料连接的连接彼此电连接和机械连接。诸如刚性印刷电路板的第一印刷电路板可以具有焊盘和其它金属迹线。诸如柔性印刷电路的第二印刷电路可以具有开口。可以在开口中形成焊接连接以将柔性印刷电路中的金属迹线附接到刚性印刷电路板上的焊盘。粘合剂环可以围绕焊料连接。柔性印刷电路可以使用粘合剂环附接到刚性印刷电路板。绝缘胶带可以覆盖焊料连接。具有导电层和导电粘合剂层的导电屏蔽层可与焊点重叠。导电粘合剂可以将屏蔽层连接到刚性印刷电路板上的金属迹线。

5. 发明申请

US20130027167A1 CIRCUIT BOARD AND METHOD FOR MOUNTING AIR CORE COIL 审中-公开
标题翻译：电路板和安装空心线圈的方法
公开(公告)号：US20130027167A1
公开(公告)日：2013-01-31
申请号：US13552021
申请日：2012-07-18
申请人： Eiichi Sano
发明人： Eiichi Sano
IPC分类号： H01F27/29 , H01R43/00
CPC分类号： H05K1/181 , H05K1/182 , H05K3/284 , H05K2201/09072 , H05K2201/1003 , H05K2203/1311 , Y02P70/611 , Y10T29/49117
摘要： Provided is a circuit board including an air core coil including a winding portion having a conductive wire wound in a helical shape, a first lead portion extending from an end of the winding portion, and a second lead portion extending from another end of the winding portion, wherein the first lead portion and the second lead portion extend in different directions from each other on a substantially same plane, and a coil mounting portion including an opening to accommodate the winding portion, a first conductive part provided on a periphery of the opening and contacting the first lead portion, and a second conductive part provided on the periphery of the opening and contacting the second lead portion.
摘要翻译：本发明提供一种电路板，其包括：空心线圈，其包括具有缠绕成螺旋形状的导线的绕组部分，从所述绕组部分的端部延伸的第一引线部分和从所述绕组部分的另一端延伸的第二引线部分，其中所述第一引线部分和所述第二引线部分在基本上相同的平面上彼此不同的方向延伸;以及线圈安装部分，其包括用于容纳所述绕组部分的开口，设置在所述开口的周边上的第一导电部分，接触所述第一引线部分，以及设置在所述开口的周边上并接触所述第二引线部分的第二导电部件。

6. 发明授权

US08226874B2 Method and apparatus for protecting an article during operation 有权
标题翻译：操作期间保护物品的方法和装置
公开(公告)号：US08226874B2
公开(公告)日：2012-07-24
申请号：US11847949
申请日：2007-08-30
申请人： Keith Wayne Huffstutler
发明人： Keith Wayne Huffstutler
IPC分类号： B29C43/02
CPC分类号： H05K3/284 , H05K1/0218 , H05K2203/085 , H05K2203/1311 , H05K2203/1383 , H05K2203/162
摘要： A process for making a protective assembly for an article, such as a circuit, includes forming a flexible layer of the protective assembly over the circuit to be protected during circuit operation, wherein said protective assembly is non-adhesive to the circuit and wherein the flexible layer is conformed to the topography of the circuit and non-adhesive to the circuit.
摘要翻译：用于制造诸如电路的制品的保护组件的方法包括在电路操作期间在待保护的电路上形成保护组件的柔性层，其中所述保护组件与电路不粘合，并且其中柔性层符合电路的形貌并且不与电路粘合。

7. 发明授权

US07959085B2 Electronic inlay module used for electronic cards and tags 有权
标题翻译：用于电子卡片和标签的电子嵌体模块
公开(公告)号：US07959085B2
公开(公告)日：2011-06-14
申请号：US11697827
申请日：2007-04-09
申请人： Robert W. Singleton
发明人： Robert W. Singleton
IPC分类号： G06K19/06
CPC分类号： G06K19/077 , G06K19/07745 , H01L2924/0002 , H05K3/284 , H05K5/064 , H05K2203/1311 , H05K2203/1322 , H01L2924/00
摘要： The disclosed electronic inlay and the method of making such an electronic inlay includes a circuit board, a plurality of circuit components attached to the circuit board, a bottom cover sheet, a top cover sheet, and a layer of thermosetting material between the bottom and top cover sheets. The electronic inlay can be used to manufacture electronic cards while using conventional equipment to apply top and bottom overlays to the electronic inlay.
摘要翻译：所公开的电子嵌体和制造这种电子嵌体的方法包括电路板，附接到电路板的多个电路部件，底盖片，顶盖片和底部和顶部之间的热固性材料层封面。电子嵌体可用于制造电子卡，同时使用常规设备将顶部和底部覆盖层应用于电子嵌体。

8. 发明申请

US20100246146A1 Electronic device and method of producing the same 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US20100246146A1
公开(公告)日：2010-09-30
申请号：US12661494
申请日：2010-03-18
申请人： Keiichi Sugimoto , Mitsuru Nakagawa
发明人： Keiichi Sugimoto , Mitsuru Nakagawa
IPC分类号： H05K5/06 , H05K3/00
CPC分类号： H05K3/284 , H05K3/281 , H05K5/0243 , H05K5/065 , H05K2201/09936 , H05K2203/1311 , H05K2203/1316 , H05K2203/1322 , Y10T29/49124 , Y10T29/49146
摘要： A method of producing an electronic device includes a holding of a circuit board and a decoration sheet in a cavity of a mold, and a filling and solidifying of thermosetting resin in the cavity. A casing is molded by the solidified thermosetting resin so as to seal electronic parts and a first face of the circuit board having the electronic parts. Further, the decoration sheet is integrated with the casing by the solidified thermosetting resin. An outer surface of the casing is defined by a second face of the circuit board opposite from the first face and the decoration sheet.
摘要翻译：电子设备的制造方法包括在模具的空腔中保持电路板和装饰片，以及在空腔中填充和固化热固性树脂。通过凝固的热固性树脂模制套管，以密封电子部件和具有电子部件的电路板的第一面。此外，装饰片通过凝固的热固性树脂与壳体一体化。壳体的外表面由电路板的与第一面和装饰片相对的第二面限定。

9. 发明申请

US20100230151A1 Circuit layout and method and device for producing a circuit pattern on a substrate 审中-公开
标题翻译：用于在基板上产生电路图案的电路布局和方法和装置
公开(公告)号：US20100230151A1
公开(公告)日：2010-09-16
申请号：US12659375
申请日：2010-03-05
申请人： Manfred Michalk
发明人： Manfred Michalk
IPC分类号： H05K1/16 , H05K3/00
CPC分类号： G06K19/077 , G06K19/073 , G06K19/0775 , G06K19/07779 , G06K19/07783 , H01F41/074 , H01F41/096 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H05K1/183 , H05K1/184 , H05K3/103 , H05K3/28 , H05K3/281 , H05K3/328 , H05K3/4084 , H05K2201/0129 , H05K2201/1028 , H05K2203/0285 , H05K2203/1311 , Y10T29/49124 , Y10T29/53174 , H01L2224/0401
摘要： A circuit layout having a substrate with at least one electronic component, wherein contacts of the electronic component are electrically connected to contacting regions of a conductor strip. Furthermore, a method for producing a circuit pattern is provided, whereby at least one conductor strip is attached onto at least one surface side of the substrate, the conductor strip being coated with a meltable insulating varnish and whereby the insulating varnish is heated and the conductor strip is pressed onto the substrate. A device is also provided for producing a circuit pattern comprising a conductor strip coil and a cylindrical or conical laying tool, which at least over a part of its length has an interior bore guiding the conductor strip and an annular active area arranged perpendicular to its longitudinal axis and merging in inner and outer radius.
摘要翻译：一种电路布局，具有具有至少一个电子部件的基板，其中电子部件的触点电连接到导体条的接触区域。此外，提供了一种制造电路图案的方法，其中至少一个导体条被附着在基板的至少一个表面侧上，导体条涂覆有可熔融的绝缘清漆，由此绝缘漆被加热，导体条被压在基底上。还提供了一种用于产生电路图案的装置，该电路图形包括导体带状线圈和圆柱形或圆锥形铺设工具，其至少在其长度的一部分上具有引导导体条的内孔和垂直于其纵向布置的环形有源区轴和内半径和外半径合并。

10. 发明授权

US07752751B2 System and method of forming a low profile conformal shield 有权
标题翻译：形成薄型共形屏蔽的系统和方法
公开(公告)号：US07752751B2
公开(公告)日：2010-07-13
申请号：US12058912
申请日：2008-03-31
申请人： Christopher James Kapusta , Donald Cunningham , Richard Joseph Saia
发明人： Christopher James Kapusta , Donald Cunningham , Richard Joseph Saia
IPC分类号： H01K3/10
CPC分类号： H05K9/0039 , C23C14/046 , H01L23/29 , H01L2224/16225 , H01L2924/0002 , H01L2924/19105 , H05K1/0204 , H05K3/284 , H05K2201/0129 , H05K2201/0133 , H05K2201/09872 , H05K2203/1311 , H05K2203/1361 , H05K2203/1366 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A system and method for providing shielding to an electrical system is disclosed. A conformal shield is formed by applying a conformal insulating coating to an electrical system. A plurality of openings are formed in the insulating coating at desired locations and a first metallic layer is deposited over the insulating coating and in each of the plurality of openings, the first metallic layer being electrically connected with the circuit board at the desired locations. A second metallic layer is then deposited onto the first metallic layer to increase a thickness of the metallic layers.
摘要翻译：公开了一种用于向电气系统提供屏蔽的系统和方法。通过将适形绝缘涂层施加到电气系统来形成保形屏蔽。在绝缘涂层中在所需位置处形成多个开口，并且第一金属层沉积在绝缘涂层上方，并且在多个开口中的每一个中，第一金属层在所需位置处与电路板电连接。然后将第二金属层沉积到第一金属层上以增加金属层的厚度。

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