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1. 发明授权

US10017637B2 Composition comprising a phenolic resin, composite material comprising such a composition and process for preparing a composite material 有权
公开(公告)号：US10017637B2
公开(公告)日：2018-07-10
申请号：US14896792
申请日：2013-12-17
申请人： Pascal Seguin , Jean-Loup Servouse , Hubert Bouillon
发明人： Pascal Seguin , Jean-Loup Servouse , Hubert Bouillon
IPC分类号： C08L65/02 , C08J9/42 , B32B3/12 , C08K7/28 , C08K3/00 , C08G8/00 , C08L61/04
CPC分类号： C08L65/02 , B32B3/12 , B32B2250/03 , B32B2260/046 , B32B2264/02 , B32B2264/10 , B32B2307/3065 , B32B2307/50 , B32B2605/00 , C08G8/00 , C08J9/42 , C08K3/00 , C08K7/28 , C08L61/04
摘要： The composition includes: at least one binder chosen from phenolic resins, and particles formed from at least one pulverulent solid chosen from glass, polymers and silica, and mixtures thereof, the particles having an average size of less than 1 mm, wherein the composition includes between 34% and 50% by weight of the pulverulent material relative to the total weight of the composition. A sandwich composite material including such a composition and a process for preparing such a sandwich composite material are also described.

2. 发明授权

US08993062B2 Methods for making laminated, saturated, and abrasive products 有权
标题翻译：制造层压，饱和和磨蚀性产品的方法
公开(公告)号：US08993062B2
公开(公告)日：2015-03-31
申请号：US13860036
申请日：2013-04-10
申请人： Georgia-Pacific Chemicals LLC
发明人： Kim Tutin , Benjamin D. Gapud
IPC分类号： B05D3/02 , C09J161/14 , B05D3/10 , C08G8/00 , B32B27/42 , B32B29/04 , C08G8/04 , C08G8/06 , C08G8/10 , C09J161/06
CPC分类号： C09J161/14 , B05D3/02 , B05D3/0254 , B05D3/10 , B05D3/108 , B32B27/42 , B32B29/04 , C08G8/00 , C08G8/04 , C08G8/06 , C08G8/10 , C09J161/06
摘要： Methods for making and using phenol/formaldehyde/furfural-based resins and furfural alcohol-based resins and are provided. The method for making a phenol/formaldehyde/furfural-based resin can include combining a phenol/formaldehyde-based resin with furfural to produce a phenol/formaldehyde/furfural-based resin. The phenol/formaldehyde/furfural-based resin can have a viscosity of about 1 cP to about 1,000 cP at a temperature of about 25° C.
摘要翻译：提供了制备和使用苯酚/甲醛/糠醛基树脂和糠醛醇类树脂的方法。制造苯酚/甲醛/糠醛基树脂的方法可以包括将苯酚/甲醛基树脂与糠醛组合以制备苯酚/甲醛/糠醛基树脂。苯酚/甲醛/糠醛基树脂在约25℃的温度下可以具有约1cP至约1,000cP的粘度

3. 发明授权

US08562731B2 Fungal modified chitosan adhesives and wood composites made from the adhesives 失效
标题翻译：真菌改性壳聚糖粘合剂和由粘合剂制成的木材复合材料
公开(公告)号：US08562731B2
公开(公告)日：2013-10-22
申请号：US13011337
申请日：2011-01-21
申请人： Dian-Qing Yang , Yaolin Zhang , Xiang-Ming Wang , Hui Wan , Gilles Brunette
发明人： Dian-Qing Yang , Yaolin Zhang , Xiang-Ming Wang , Hui Wan , Gilles Brunette
IPC分类号： C08L1/00 , C08L3/00 , C08L5/00 , C08G8/00 , C08B30/00 , C09D101/00 , C09D103/00 , C09D105/00 , C09J101/00 , C09J103/00 , C09J105/00
CPC分类号： C12P19/26 , C08B37/003 , C09J105/08 , C12P19/04
摘要： The present invention describes a fungal modified chitosan adhesive for binding a fibrous material and the method of producing the adhesive. The adhesive is produced by providing a chitosan containing raw material; a fungal growing medium; a fungal culture; mixing the raw material, the growing medium and the fungal culture together to produce a suspension; incubating the suspension to produce a broth comprising a modified chitosan solid, an at least partially-consumed medium liquid and a fungal residue; separating the modified chitosan solid from the liquid and the fungal residue, and dissolving the modified chitosan solid to produce the adhesive resin.
摘要翻译：本发明描述了用于粘合纤维材料的真菌改性壳聚糖粘合剂和生产粘合剂的方法。通过提供含壳聚糖的原料制造粘合剂; 真菌生长培养基; 真菌文化; 将原料，生长培养基和真菌培养物混合在一起以产生悬浮液; 孵育悬浮液以产生包含改性的壳聚糖固体，至少部分消耗的中等液体和真菌残渣的肉汤; 将改性的壳聚糖固体与液体和真菌残渣分离，并将改性的壳聚糖固体溶解以制备粘合剂树脂。

4. 发明授权

US07378484B2 Toughness-increased phenolic resin and preparation thereof 有权
标题翻译：韧性增加的酚醛树脂及其制备
公开(公告)号：US07378484B2
公开(公告)日：2008-05-27
申请号：US11094176
申请日：2005-03-31
申请人： Jeng-Chang Yang , Chen-Chi Martin Ma , Hon-Bin Chen , Chin-Yih Chen
发明人： Jeng-Chang Yang , Chen-Chi Martin Ma , Hon-Bin Chen , Chin-Yih Chen
IPC分类号： C08G8/02 , C08G8/00
CPC分类号： C08G8/28
摘要： A phenolic resin that increases its toughness by polydimethylsiloxane and a process of preparing the same is provided. Polydimethylsiloxane is added as a coupling agent in a γ-glycidoxypropyltrimethoxysilane-modified phenolic resin to improve the compatibility between polydimethylsiloxane and the phenolic resin. Then, tetraethoxysilane is added to conduct hydrolysis condensation and obtain tougher and thermally stable phenolic resin.
摘要翻译：提供了一种通过聚二甲基硅氧烷增加其韧性的酚醛树脂及其制备方法。将聚二甲基硅氧烷作为偶联剂加入到γ-环氧丙氧基丙基三甲氧基硅烷改性酚醛树脂中，以改善聚二甲基硅氧烷和酚醛树脂之间的相容性。然后加入四乙氧基硅烷进行水解缩合，得到更坚韧，热稳定的酚醛树脂。

5. 发明授权

US6166131A Highly reactive modified phenolic resin and molding material for electrical/electronic parts and semiconductor sealing material 失效
标题翻译：高反应性改性酚醛树脂和电子/电子部件和半导体密封材料的成型材料
公开(公告)号：US6166131A
公开(公告)日：2000-12-26
申请号：US401491
申请日：1999-09-22
申请人： Masao Tashima , Hiromi Miyasita , Haruhiko Takeda , Tomoaki Fujii , Tatsushi Ishizuka , Makoto Hasegawa
发明人： Masao Tashima , Hiromi Miyasita , Haruhiko Takeda , Tomoaki Fujii , Tatsushi Ishizuka , Makoto Hasegawa
IPC分类号： C08G8/00 , C08G8/28 , C08G16/00 , C08L61/06 , C08L61/14 , C08L63/00 , C08L91/00 , C08L95/00 , H01B3/36 , C08G63/48 , C08G63/91
CPC分类号： H01B3/36 , C08G8/00 , C08G8/28 , C08G16/00 , C08L61/06 , C08L61/14 , C08L63/00 , C08L91/00 , C08L95/00 , C08L2666/22 , C08L2666/02
摘要： Disclosed is a process for producing a highly reactive modified phenolic resin, which comprises mixing a heavy oil or pitch with 0.3 to 10 mol of a phenol, 0.2 to 9 mol in terms of formaldehyde, of a formaldehyde compound and 0.01 to 3.0 mol of an acid catalyst, each amount being based on 1 mol of the heavy oil or pitch calculated from an average molecular weight; and heating the resulting mixture with stirring, thereby to polycondensate the heavy oil or pitch, phenol and formaldehyde compound. According to this invention, there can be provided a process for producing simply and stably a highly reactive modified phenolic resin having low melt viscosity, excellent heat resistance and high reactivity with an epoxy resin, in one step.
摘要翻译：公开了一种制备高反应性改性酚醛树脂的方法，该方法包括将重油或沥青与0.3至10摩尔酚，0.2-9摩尔甲醛化合物和0.01至3.0摩尔的酸催化剂，每个量基于由平均分子量计算的1摩尔重油或沥青; 并在搅拌下加热所得混合物，从而使重油或沥青，苯酚和甲醛化合物缩聚。根据本发明，可以提供在一个步骤中简单且稳定地制备具有低熔体粘度，优异的耐热性和与环氧树脂的高反应性的高反应性改性酚醛树脂的方法。

6. 发明授权

US6162892A Gas barrier composition and molded resin 失效
标题翻译：气体阻隔组合物和模塑树脂
公开(公告)号：US6162892A
公开(公告)日：2000-12-19
申请号：US407499
申请日：1999-09-28
申请人： Hideki Kobayashi , Masayuki Hayashi
发明人： Hideki Kobayashi , Masayuki Hayashi
IPC分类号： B65D1/00 , B32B27/00 , C08G18/38 , C08G59/40 , C08G59/50 , C08G73/02 , C08J7/04 , C08L79/02 , C09D5/00 , C09D179/02 , C08G69/00 , C08G8/00 , C08G12/00 , C08G14/00 , C08G73/00
CPC分类号： C08G18/3893 , C08G59/4085 , C08G59/504 , Y10T428/31504
摘要： The invention relates to a gas barrier composition as well as to composite structures having at least one surface of a molded resin coated with the composition, said composition comprising:(A) an alkoxysilyl functional polyamine compound, or a hydrolyzate thereof, said polyamine compound having three or more amine groups, at least one nitrogen atom of said amine groups being bonded to a hydrogen atom and at least one nitrogen of said amine groups being bonded to an alkoxysilyl group expressed by the formula--W--SiR.sup.2.sub.3-f (OR.sup.1).sub.f wherein R.sup.1 is an alkyl group having 1 to 6 carbon atoms, R.sup.2 is a monovalent hydrocarbon group having 1 to 10 carbon atoms, W is a divalent hydrocarbon group having 2 to 10 carbon atoms, and f is an integer having a value of 1 to 3; and(B) an organic compound which is free of acrylic groups, said organic compound having an aromatic ring or an alicyclic hydrocarbon group and having per molecule at least two functional groups that are reactive with the amine groups, the alkoxy groups, or both, of component A.
摘要翻译：本发明涉及一种气体阻隔组合物以及具有涂覆有组合物的模制树脂的至少一个表面的复合结构，所述组合物包含：（A）烷氧基甲硅烷基官能多胺化合物或其水解产物，所述多胺化合物具有三个或更多个胺基团，所述胺基团的至少一个氮原子与氢原子键合，并且所述胺基团的至少一个氮键合到由式-W-SiR23-f（OR1）f表示的烷氧基甲硅烷基其中R1为碳原子数为1〜6的烷基，R2为碳原子数1〜10的一价烃基，W为碳原子数2〜10的二价烃基，f为1〜 3; 和（B）不含丙烯酸基团的有机化合物，所述有机化合物具有芳环或脂环族烃基并且每分子具有至少两个与胺基，烷氧基或两者反应的官能团，的组分A.

7. 发明授权

US6043002A Metal ion reduction in novolak resin solution using an anion exchange resin 失效
标题翻译：使用阴离子交换树脂在酚醛清漆树脂溶液中金属离子还原
公开(公告)号：US6043002A
公开(公告)日：2000-03-28
申请号：US902442
申请日：1997-07-29
申请人： M. Dalil Rahman
发明人： M. Dalil Rahman
IPC分类号： C08G8/00 , C08G8/08 , C08G8/10 , C08G8/28 , G03F7/004 , G03F7/023 , G03F7/00
CPC分类号： G03F7/004 , C08G8/00 , C08G8/10 , C08G8/28 , G03F7/0236
摘要： The present invention provides methods for producing water insoluble, aqueous alkali soluble novolak resins having a very low level of metal ions, utilizing a specially treated anion exchange resin. A method is also provided for producing photoresist composition having a very low level of metal ions from such novolak resins and for producing semiconductor devices using such photoresist compositions.
摘要翻译：本发明提供了利用特殊处理的阴离子交换树脂生产具有非常低水平金属离子的水不溶性水溶性酚醛清漆树脂的方法。还提供了一种用于生产具有来自这种酚醛清漆树脂的非常低水平的金属离子并且使用这种光致抗蚀剂组合物制造半导体器件的光致抗蚀剂组合物的方法。

8. 发明授权

US06037439A Process for continuous production of polyacetal resin 有权
标题翻译：连续生产聚缩醛树脂的方法
公开(公告)号：US06037439A
公开(公告)日：2000-03-14
申请号：US131751
申请日：1998-08-10
申请人： Hajime Serizawa , Kaoru Yamamoto , Kuniaki Kawaguchi , Yuichi Fukui , Tsugio Tenda
发明人： Hajime Serizawa , Kaoru Yamamoto , Kuniaki Kawaguchi , Yuichi Fukui , Tsugio Tenda
IPC分类号： C08G2/06 , C08G2/10 , C08G2/18 , C08G2/20 , C08G8/00
CPC分类号： C08G2/10
摘要： To provide a process for stable and continuous production of a polyacetal resin, mainly comprising a copolymer of 1,3-dioxolane and trioxane under the presence of a catalyst, in a high yield on an industrial scale for a long period of time. In the continuous production of a polyacetal resin by mixing 1,3-dioxolane with boron trifluoride and/or a coordination compound of boron trifluoride and then, mixing the obtained mixture with trioxane to conduct bulk polymerization in a polymerization machine, 1,3-dioxolane is brought into contact with boron trifluoride and/or a coordination compound of boron trifluoride while feeding both at the same direction and they are mixed together for 0.1 to 30 seconds under the condition of at least 0.1 m/sec of the linear velocity of the mixture and subsequently mixed with trioxane.
摘要翻译：为了提供在催化剂存在下主要包含1,3-二氧戊环和三恶烷的共聚物的聚缩醛树脂的稳定和连续生产方法，长期以工业规模高产率。在通过将1,3-二氧戊环与三氟化硼和/或三氟化硼的配位化合物混合来连续制备聚缩醛树脂之后，将得到的混合物与三恶烷混合以在聚合机中进行本体聚合，将1,3-二氧戊环与三氟化硼和/或三氟化硼的配位化合物接触，同时在相同方向进料，并在混合物的线速度至少为0.1m / sec的条件下混合0.1至30秒随后与三恶烷混合。

9. 发明授权

US5976761A Fractionation of phenol formaldehyde condensate and photoresist compositions produced therefrom 失效
标题翻译：分离苯酚甲醛缩合物和由其制备的光致抗蚀剂组合物
公开(公告)号：US5976761A
公开(公告)日：1999-11-02
申请号：US47571
申请日：1998-03-25
申请人： M. Dalil Rahman , Daniel P. Aubin , Dinesh N. Khanna , Sunit S. Dixit
发明人： M. Dalil Rahman , Daniel P. Aubin , Dinesh N. Khanna , Sunit S. Dixit
IPC分类号： G03F7/004 , C08G8/00 , C08G8/08 , C08L61/06 , G03F7/023 , C08J3/00
CPC分类号： C08G8/08 , G03F7/0236
摘要： A process for producing a water insoluble, aqueous alkali soluble, film forming novolak resin having low metal ions, made by the fractionation of a phenol formaldehyde condensation product, a process for producing a resin a photoresist composition of superior quality containing such novolak resin, and a method for producing a semiconductor device using such photoresist composition.
摘要翻译：通过分解苯酚甲醛缩合产物制备具有低金属离子的水不溶性水溶性成膜酚醛清漆树脂的方法，含有这种酚醛清漆树脂的具有优良品质的光致抗蚀剂组合物的方法，以及使用这种光致抗蚀剂组合物的半导体器件的制造方法。

10. 发明授权

US5910559A Fractionated novolak resin from cresol-formaldehyde reaction mixture and photoresist composition therefrom 失效
公开(公告)号：US5910559A
公开(公告)日：1999-06-08
申请号：US768541
申请日：1996-12-18
申请人： M. Dalil Rahman , Ping-Hung Lu , Michelle Cook
发明人： M. Dalil Rahman , Ping-Hung Lu , Michelle Cook
IPC分类号： C08G8/00 , C08G8/08 , C08G8/12 , C08L61/06 , G03F7/023 , C08G8/10
CPC分类号： G03F7/0236 , C08G8/08 , C08G8/12
摘要： The present invention provides a method for producing a film forming, fractionated novolak resin having consistent molecular weight and superior performance in photoresist composition, by isolating such novolak resin fractions without high temperature distillation. A method is also provided for producing photoresist composition from such a fractionated novolak resin and for producing semiconductor devices using such a photoresist composition.

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