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1. 发明授权

US06858526B2 Methods of forming materials between conductive electrical components, and insulating materials 失效
标题翻译：在导电电气部件和绝缘材料之间形成材料的方法
公开(公告)号：US06858526B2
公开(公告)日：2005-02-22
申请号：US09820468
申请日：2001-03-28
申请人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
发明人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
IPC分类号： H01L21/316 , H01L21/768 , H01L23/522 , H01L23/532 , H01L21/4763 , H01L21/302
CPC分类号： H01L23/5222 , H01L21/02115 , H01L21/02118 , H01L21/02203 , H01L21/02274 , H01L21/02282 , H01L21/02337 , H01L21/02362 , H01L21/31695 , H01L21/7682 , H01L21/76826 , H01L21/76828 , H01L21/76829 , H01L21/76834 , H01L23/5329 , H01L2221/1047 , H01L2924/0002 , H01L2924/00
摘要： The invention encompasses methods of forming insulating materials between conductive elements. In one aspect, the invention includes a method of forming a material adjacent a conductive electrical component comprising: a) partially vaporizing a mass to form a matrix adjacent the conductive electrical component, the matrix having at least one void within it. In another aspect, the invention includes a method of forming a material between a pair of conductive electrical components comprising the following steps: a) forming a pair of conductive electrical components within a mass and separated by an expanse of the mass; b) forming at least one support member within the expanse of the mass, the support member not comprising a conductive interconnect; and c) vaporizing the expanse of the mass to a degree effective to form at least one void between the support member and each of the pair of conductive electrical components. In another aspect, the invention includes an insulating material adjacent a conductive electrical component, the insulating material comprising a matrix and at least one void within the matrix. In another aspect, the invention includes an insulating region between a pair of conductive electrical components comprising: a) a support member between the conductive electrical components, the support member not comprising a conductive interconnect; and b) at least one void between the support member and each of the pair of conductive electrical components.
摘要翻译：本发明包括在导电元件之间形成绝缘材料的方法。在一个方面，本发明包括形成邻近导电电气部件的材料的方法，该方法包括：a）部分蒸发物质以形成邻近导电电气部件的基体，所述基质在其内具有至少一个空隙。另一方面，本发明包括一种在一对导电电气部件之间形成材料的方法，包括以下步骤：a）在质量体内形成一对导电的电气部件，并由质量块的一部分分隔; b）在所述物体的宽度内形成至少一个支撑构件，所述支撑构件不包括导电互连; 以及c）将所述物质的所述膨胀物蒸发至有效地在所述支撑构件和所述一对导电电气部件中的每一个之间形成至少一个空隙的程度。在另一方面，本发明包括与导电电气部件相邻的绝缘材料，所述绝缘材料包含基体和所述基体内的至少一个空隙。在另一方面，本发明包括在一对导电电气部件之间的绝缘区域，包括：a）导电电气部件之间的支撑部件，所述支撑部件不包括导电互连; 以及b）所述支撑构件和所述一对导电电气部件中的每一个之间的至少一个空隙。

2. 发明授权

US07112542B2 Methods of forming materials between conductive electrical components, and insulating materials 有权
标题翻译：在导电电气部件和绝缘材料之间形成材料的方法
公开(公告)号：US07112542B2
公开(公告)日：2006-09-26
申请号：US10330719
申请日：2002-12-27
申请人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
发明人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
IPC分类号： H01L21/31 , H01L21/469 , H01L21/76
CPC分类号： H01L21/7682 , H01L21/02115 , H01L21/02118 , H01L21/02167 , H01L21/02203 , H01L21/02274 , H01L21/02282 , H01L21/02362 , H01L21/31695 , H01L21/76826 , H01L21/76828 , H01L21/76829 , H01L21/76834 , H01L23/5222 , H01L23/5329 , H01L2221/1047 , H01L2924/0002 , Y10T428/12014 , Y10T428/24149 , Y10T428/249921 , Y10T428/25 , Y10T428/259 , H01L2924/00
摘要： Methods of forming insulating materials between conductive elements include forming a material adjacent a conductive electrical component comprising: partially vaporizing a mass to form a matrix adjacent the conductive electrical component, the matrix having at least one void within it. Other methods include forming a material between a pair of conductive electrical components comprising: forming a pair of conductive electrical components within a mass and separated by an expanse of the mass; forming at least one support member within the expanse of the mass, the support member not comprising a conductive interconnect; and vaporizing the expanse of the mass to a degree effective to form at least one void between the support member and each of the pair of conductive electrical components. Some embodiments include an insulating material adjacent a conductive electrical component, such material comprising a matrix and at least one void within the matrix.
摘要翻译：在导电元件之间形成绝缘材料的方法包括形成邻近导电电气部件的材料，该材料包括：部分蒸发物质以形成邻近导电电气部件的基体，所述基体在其内具有至少一个空隙。其他方法包括在一对导电电气部件之间形成材料，包括：在一个质量块内形成一对导电的电气部件，并由该质量块的一大片分隔; 在所述物体的宽度内形成至少一个支撑构件，所述支撑构件不包括导电互连; 以及使所述质量块的膨胀程度有效地在所述支撑构件和所述一对导电电气部件中的每一个之间形成至少一个空隙。一些实施例包括邻近导电电气部件的绝缘材料，这种材料包括基质和基质内的至少一个空隙。

3. 发明授权

US07262503B2 Semiconductor constructions 有权
标题翻译：半导体结构
公开(公告)号：US07262503B2
公开(公告)日：2007-08-28
申请号：US11026822
申请日：2004-12-29
申请人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
发明人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
IPC分类号： H01L23/48
CPC分类号： H01L23/5222 , H01L21/02115 , H01L21/02118 , H01L21/02203 , H01L21/02274 , H01L21/02282 , H01L21/02337 , H01L21/02362 , H01L21/31695 , H01L21/7682 , H01L21/76826 , H01L21/76828 , H01L21/76829 , H01L21/76834 , H01L23/5329 , H01L2221/1047 , H01L2924/0002 , H01L2924/00
摘要： The invention encompasses methods of forming insulating materials between conductive elements. In one aspect, the invention includes a method of forming a material adjacent a conductive electrical component comprising: a) partially vaporizing a mass to form a matrix adjacent the conductive electrical component, the matrix having at least one void within it. In another aspect, the invention includes a method of forming a material between a pair of conductive electrical components comprising the following steps: a) forming a pair of conductive electrical components within a mass and separated by an expanse of the mass; b) forming at least one support member within the expanse of the mass, the support member not comprising a conductive interconnect; and c) vaporizing the expanse of the mass to a degree effective to form at least one void between the support member and each of the pair of conductive electrical components. In another aspect, the invention includes an insulating material adjacent a conductive electrical component, the insulating material comprising a matrix and at least one void within the matrix. In another aspect, the invention includes an insulating region between a pair of conductive electrical components comprising: a) a support member between the conductive electrical components, the support member not comprising a conductive interconnect; and b) at least one void between the support member and each of the pair of conductive electrical components.
摘要翻译：本发明包括在导电元件之间形成绝缘材料的方法。在一个方面，本发明包括形成邻近导电电气部件的材料的方法，该方法包括：a）部分蒸发物质以形成邻近导电电气部件的基体，所述基质在其内具有至少一个空隙。另一方面，本发明包括一种在一对导电电气部件之间形成材料的方法，包括以下步骤：a）在质量体内形成一对导电的电气部件，并由质量块的一部分分隔; b）在所述物体的宽度内形成至少一个支撑构件，所述支撑构件不包括导电互连; 以及c）将所述物质的所述膨胀物蒸发至有效地在所述支撑构件和所述一对导电电气部件中的每一个之间形成至少一个空隙的程度。在另一方面，本发明包括与导电电气部件相邻的绝缘材料，所述绝缘材料包含基体和所述基体内的至少一个空隙。在另一方面，本发明包括在一对导电电气部件之间的绝缘区域，包括：a）导电电气部件之间的支撑部件，所述支撑部件不包括导电互连; 以及b）所述支撑构件和所述一对导电电气部件中的每一个之间的至少一个空隙。

4. 发明授权

US06501179B2 Constructions comprising insulative materials 有权
标题翻译：建筑物包括绝缘材料
公开(公告)号：US06501179B2
公开(公告)日：2002-12-31
申请号：US09921861
申请日：2001-08-02
申请人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
发明人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
IPC分类号： H01L23485
CPC分类号： H01L21/7682 , H01L21/02115 , H01L21/02118 , H01L21/02167 , H01L21/02203 , H01L21/02274 , H01L21/02282 , H01L21/02362 , H01L21/31695 , H01L21/76826 , H01L21/76828 , H01L21/76829 , H01L21/76834 , H01L23/5222 , H01L23/5329 , H01L2221/1047 , H01L2924/0002 , Y10T428/12014 , Y10T428/24149 , Y10T428/249921 , Y10T428/25 , Y10T428/259 , H01L2924/00
摘要： The invention encompasses methods of forming insulating materials between conductive elements. In one aspect, the invention includes a method of forming a material adjacent a conductive electrical component comprising: a) partially vaporizing a mass to form a matrix adjacent the conductive electrical component, the matrix having at least one void within it. In another aspect, the invention includes a method of forming a material between a pair of conductive electrical components comprising the following steps: a) forming a pair of conductive electrical components within a mass and separated by an expanse of the mass; b) forming at least one support member within the expanse of the mass, the support member not comprising a conductive interconnect; and c) vaporizing the expanse of the mass to a degree effective to form at least one void between the support member and each of the pair of conductive electrical components. In another aspect, the invention includes an insulating material adjacent a conductive electrical component, the insulating material comprising a matrix and at least one void within the matrix. In another aspect, the invention includes an insulating region between a pair of conductive electrical components comprising: a) a support member between the conductive electrical components, the support member not comprising a conductive interconnect; and b) at least one void between the support member and each of the pair of conductive electrical components.
摘要翻译：本发明包括在导电元件之间形成绝缘材料的方法。在一个方面，本发明包括形成邻近导电电气部件的材料的方法，该方法包括：a）部分蒸发物质以形成邻近导电电气部件的基体，所述基质在其内具有至少一个空隙。另一方面，本发明包括一种在一对导电电气部件之间形成材料的方法，包括以下步骤：a）在质量体内形成一对导电的电气部件，并由质量块的一部分分隔; b）在所述物体的宽度内形成至少一个支撑构件，所述支撑构件不包括导电互连; 以及c）将所述物质的所述膨胀物蒸发至有效地在所述支撑构件和所述一对导电电气部件中的每一个之间形成至少一个空隙的程度。在另一方面，本发明包括与导电电气部件相邻的绝缘材料，所述绝缘材料包含基体和所述基体内的至少一个空隙。在另一方面，本发明包括在一对导电电气部件之间的绝缘区域，包括：a）导电电气部件之间的支撑部件，所述支撑部件不包括导电互连; 以及b）所述支撑构件和所述一对导电电气部件中的每一个之间的至少一个空隙。

5. 发明授权

US06812160B2 Methods of forming materials between conductive electrical components, and insulating materials 失效
标题翻译：在导电电气部件和绝缘材料之间形成材料的方法
公开(公告)号：US06812160B2
公开(公告)日：2004-11-02
申请号：US09976624
申请日：2001-10-12
申请人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
发明人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
IPC分类号： H01L2131
CPC分类号： H01L21/7682 , H01L21/02115 , H01L21/02118 , H01L21/02167 , H01L21/02203 , H01L21/02274 , H01L21/02282 , H01L21/02362 , H01L21/31695 , H01L21/76826 , H01L21/76828 , H01L21/76829 , H01L21/76834 , H01L23/5222 , H01L23/5329 , H01L2221/1047 , H01L2924/0002 , Y10T428/12014 , Y10T428/24149 , Y10T428/249921 , Y10T428/25 , Y10T428/259 , H01L2924/00
摘要： Methods of forming insulating materials between conductive elements include forming a material adjacent a conductive electrical component comprising: partially vaporizing a mass to form a matrix adjacent the conductive electrical component, the matrix having at least one void within it. Other methods include forming a material between a pair of conductive electrical components comprising: forming a pair of conductive electrical components within a mass and separated by an expanse of the mass; forming at least one support member within the expanse of the mass, the support member not comprising a conductive interconnect; and vaporizing the expanse of the mass to a degree effective to form at least one void between the support member and each of the pair of conductive electrical components. Some embodiments include an insulating material adjacent a conductive electrical component, such material comprising a matrix and at least one void within the matrix.
摘要翻译：在导电元件之间形成绝缘材料的方法包括形成邻近导电电气部件的材料，该材料包括：部分蒸发物质以形成邻近导电电气部件的基体，所述基体在其内具有至少一个空隙。其他方法包括在一对导电电气部件之间形成材料，包括：在一个质量块内形成一对导电的电气部件，并由该质量块的一大片分隔; 在所述物体的宽度内形成至少一个支撑构件，所述支撑构件不包括导电互连; 以及使所述质量块的膨胀程度有效地在所述支撑构件和所述一对导电电气部件中的每一个之间形成至少一个空隙。一些实施例包括邻近导电电气部件的绝缘材料，这种材料包括基质和基质内的至少一个空隙。

6. 发明授权

US06333556B1 Insulating materials 失效
标题翻译：绝缘材料
公开(公告)号：US06333556B1
公开(公告)日：2001-12-25
申请号：US08947847
申请日：1997-10-09
申请人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
发明人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
IPC分类号： H01L23485
CPC分类号： H01L21/7682 , H01L21/02115 , H01L21/02118 , H01L21/02167 , H01L21/02203 , H01L21/02274 , H01L21/02282 , H01L21/02362 , H01L21/31695 , H01L21/76826 , H01L21/76828 , H01L21/76829 , H01L21/76834 , H01L23/5222 , H01L23/5329 , H01L2221/1047 , H01L2924/0002 , Y10T428/12014 , Y10T428/24149 , Y10T428/249921 , Y10T428/25 , Y10T428/259 , H01L2924/00
摘要： The invention encompasses methods of forming insulating materials between conductive elements. In one aspect, the invention includes a method of forming a material adjacent a conductive electrical component comprising: a) partially vaporizing a mass to form a matrix adjacent the conductive electrical component, the matrix having at least one void within it. In another aspect, the invention includes a method of forming a material between a pair of conductive electrical components comprising the following steps: a) forming a pair of conductive electrical components within a mass and separated by an expanse of the mass; b) forming at least one support member within the expanse of the mass, the support member not comprising a conductive interconnect; and c) vaporizing the expanse of the mass to a degree effective to form at least one void between the support member and each of the pair of conductive electrical components. In another aspect, the invention includes an insulating material adjacent a conductive electrical component, the insulating material comprising a matrix and at least one void within the matrix. In another aspect, the invention includes an insulating region between a pair of conductive electrical components comprising: a) a support member between the conductive electrical components, the support member not comprising a conductive interconnect; and b) at least one void between the support member and each of the pair of conductive electrical components.
摘要翻译：本发明包括在导电元件之间形成绝缘材料的方法。在一个方面，本发明包括形成邻近导电电气部件的材料的方法，该方法包括：a）部分蒸发物质以形成邻近导电电气部件的基体，所述基质在其内具有至少一个空隙。另一方面，本发明包括一种在一对导电电气部件之间形成材料的方法，包括以下步骤：a）在质量体内形成一对导电的电气部件，并由质量块的一部分分隔; b）在所述物体的宽度内形成至少一个支撑构件，所述支撑构件不包括导电互连; 以及c）将所述物质的所述膨胀物蒸发至有效地在所述支撑构件和所述一对导电电气部件中的每一个之间形成至少一个空隙的程度。在另一方面，本发明包括与导电电气部件相邻的绝缘材料，所述绝缘材料包含基体和所述基体内的至少一个空隙。在另一方面，本发明包括在一对导电电气部件之间的绝缘区域，包括：a）导电电气部件之间的支撑部件，所述支撑部件不包括导电互连; 以及b）所述支撑构件和所述一对导电电气部件中的每一个之间的至少一个空隙。

7. 发明授权

US06313046B1 Method of forming materials between conductive electrical components, and insulating materials 失效
标题翻译：在导电电气部件和绝缘材料之间形成材料的方法
公开(公告)号：US06313046B1
公开(公告)日：2001-11-06
申请号：US09115339
申请日：1998-07-14
申请人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
发明人： Werner Juengling , Kirk D. Prall , Ravi Iyer , Gurtej S. Sandhu , Guy Blalock
IPC分类号： H01L2131
CPC分类号： H01L21/7682 , H01L21/02115 , H01L21/02118 , H01L21/02167 , H01L21/02203 , H01L21/02274 , H01L21/02282 , H01L21/02362 , H01L21/31695 , H01L21/76826 , H01L21/76828 , H01L21/76829 , H01L21/76834 , H01L23/5222 , H01L23/5329 , H01L2221/1047 , H01L2924/0002 , Y10T428/12014 , Y10T428/24149 , Y10T428/249921 , Y10T428/25 , Y10T428/259 , H01L2924/00
摘要： The invention encompasses methods of forming insulating materials between conductive elements. In one aspect, the invention includes a method of forming a material adjacent a conductive electrical component comprising: a) partially vaporizing a mass to form a matrix adjacent the conductive electrical component, the matrix having at least one void within it. In another aspect, the invention includes a method of forming a material between a pair of conductive electrical components comprising the following steps: a) forming a pair of conductive electrical components within a mass and separated by an expanse of the mass; b) forming at least one support member within the expanse of the mass, the support member not comprising a conductive interconnect; and c) vaporizing the expanse of the mass to a degree effective to form at least one void between the support member and each of the pair of conductive electrical components. In another aspect, the invention includes an insulating material adjacent a conductive electrical component, the insulating material comprising a matrix and at least one void within the matrix. In another aspect, the invention includes an insulating region between a pair of conductive electrical components comprising: a) a support member between the conductive electrical components, the support member not comprising a conductive interconnect; and b) at least one void between the support member and each of the pair of conductive electrical components.
摘要翻译：本发明涵盖在导电元件之间形成绝缘材料的方法。在一个方面，本发明包括形成邻近导电电气部件的材料的方法，该方法包括：a）部分蒸发物质以形成邻近导电电气部件的基体，所述基质在其内具有至少一个空隙。另一方面，本发明包括一种在一对导电电气部件之间形成材料的方法，包括以下步骤：a）在质量体内形成一对导电的电气部件，并由质量块的一部分分隔; b）在所述物体的宽度内形成至少一个支撑构件，所述支撑构件不包括导电互连; 以及c）将所述物质的所述膨胀物蒸发至有效地在所述支撑构件和所述一对导电电气部件中的每一个之间形成至少一个空隙的程度。在另一方面，本发明包括与导电电气部件相邻的绝缘材料，所述绝缘材料包含基体和所述基体内的至少一个空隙。在另一方面，本发明包括在一对导电电气部件之间的绝缘区域，包括：a）导电电气部件之间的支撑部件，所述支撑部件不包括导电互连; 以及b）所述支撑构件和所述一对导电电气部件中的每一个之间的至少一个空隙。

8. 发明申请

US20050121794A1 Semiconductor constructions 有权
标题翻译：半导体结构
公开(公告)号：US20050121794A1
公开(公告)日：2005-06-09
申请号：US11026822
申请日：2004-12-29
申请人： Werner Juengling , Kirk Prall , Ravi Iyer , Gurtej Sandhu , Guy Blalock
发明人： Werner Juengling , Kirk Prall , Ravi Iyer , Gurtej Sandhu , Guy Blalock
IPC分类号： H01L21/316 , H01L21/768 , H01L23/522 , H01L23/532 , H01L29/40
CPC分类号： H01L23/5222 , H01L21/02115 , H01L21/02118 , H01L21/02203 , H01L21/02274 , H01L21/02282 , H01L21/02337 , H01L21/02362 , H01L21/31695 , H01L21/7682 , H01L21/76826 , H01L21/76828 , H01L21/76829 , H01L21/76834 , H01L23/5329 , H01L2221/1047 , H01L2924/0002 , H01L2924/00
摘要： The invention encompasses methods of forming insulating materials between conductive elements. In one aspect, the invention includes a method of forming a material adjacent a conductive electrical component comprising: a) partially vaporizing a mass to form a matrix adjacent the conductive electrical component, the matrix having at least one void within it. In another aspect, the invention includes a method of forming a material between a pair of conductive electrical components comprising the following steps: a) forming a pair of conductive electrical components within a mass and separated by an expanse of the mass; b) forming at least one support member within the expanse of the mass, the support member not comprising a conductive interconnect; and c) vaporizing the expanse of the mass to a degree effective to form at least one void between the support member and each of the pair of conductive electrical components. In another aspect, the invention includes an insulating material adjacent a conductive electrical component, the insulating material comprising a matrix and at least one void within the matrix. In another aspect, the invention includes an insulating region between a pair of conductive electrical components comprising: a) a support member between the conductive electrical components, the support member not comprising a conductive interconnect; and b) at least one void between the support member and each of the pair of conductive electrical components.
摘要翻译：本发明包括在导电元件之间形成绝缘材料的方法。在一个方面，本发明包括形成邻近导电电气部件的材料的方法，该方法包括：a）部分蒸发物质以形成邻近导电电气部件的基体，所述基质在其内具有至少一个空隙。另一方面，本发明包括一种在一对导电电气部件之间形成材料的方法，包括以下步骤：a）在质量体内形成一对导电的电气部件，并由质量块的一部分分隔; b）在所述物体的宽度内形成至少一个支撑构件，所述支撑构件不包括导电互连; 以及c）将所述物质的所述膨胀物蒸发至有效地在所述支撑构件和所述一对导电电气部件中的每一个之间形成至少一个空隙的程度。在另一方面，本发明包括与导电电气部件相邻的绝缘材料，所述绝缘材料包含基体和所述基体内的至少一个空隙。在另一方面，本发明包括在一对导电电气部件之间的绝缘区域，包括：a）导电电气部件之间的支撑部件，所述支撑部件不包括导电互连; 以及b）所述支撑构件和所述一对导电电气部件中的每一个之间的至少一个空隙。

9. 发明授权

US09190494B2 Systems and devices including fin field-effect transistors each having U-shaped semiconductor fin 有权
标题翻译：包括翅片场效应晶体管的系统和器件均具有U形半导体鳍片
公开(公告)号：US09190494B2
公开(公告)日：2015-11-17
申请号：US12033799
申请日：2008-02-19
申请人： Werner Juengling
发明人： Werner Juengling
IPC分类号： H01L29/76 , H01L29/66 , H01L21/8234 , H01L27/088 , H01L27/108 , H01L29/78 , H01L21/336 , H01L21/76
CPC分类号： H01L29/66795 , H01L21/823431 , H01L27/0886 , H01L27/10876 , H01L27/10879 , H01L29/7851
摘要： Disclosed are methods, systems and devices, including a system, having a memory device. In some embodiments, the memory device includes a plurality of fin field-effect transistors disposed in rows, a plurality of insulating fins each disposed between the rows, and a plurality of memory elements each coupled to a terminal of a fin field-effect transistor among the plurality of fin field-effect transistors.
摘要翻译：公开了包括具有存储器装置的系统的方法，系统和装置。在一些实施例中，存储器件包括排列成行的多个鳍状场效应晶体管，各排设置在各行之间的多个绝缘鳍片，以及多个存储元件，每个存储器元件耦合到鳍状场效应晶体管的端子，多个鳍状场效应晶体管。

10. 发明授权

US08962401B2 Double gated 4F2 dram CHC cell and methods of fabricating the same 有权
标题翻译：双门控4F2二极管CHC电池及其制造方法
公开(公告)号：US08962401B2
公开(公告)日：2015-02-24
申请号：US13455956
申请日：2012-04-25
申请人： Werner Juengling , Howard C. Kirsch
发明人： Werner Juengling , Howard C. Kirsch
IPC分类号： H01L21/00 , H01L27/108 , H01L21/8234 , H01L27/088 , H01L29/10 , H01L29/423 , H01L29/66 , H01L29/78
CPC分类号： H01L21/823481 , H01L21/76224 , H01L21/823431 , H01L21/823437 , H01L27/0886 , H01L27/10823 , H01L27/10826 , H01L27/10876 , H01L27/10879 , H01L27/10891 , H01L29/0847 , H01L29/1037 , H01L29/4236 , H01L29/66484 , H01L29/66787 , H01L29/7855
摘要： A semiconductor device is provided that includes a fin having a first gate and a second gate formed on a first sidewall of the fin in a first trench, wherein the first gate is formed above the second gate. The device includes a third gate and a fourth gate formed on a second sidewall of the fin in a second trench, wherein the third gate is formed above the fourth gate. Methods of manufacturing and operating the device are also included. A method of operation may include biasing the first gate and the fourth gate to create a current path across the fin.
摘要翻译：提供一种半导体器件，其包括在第一沟槽中形成有鳍状物的第一侧壁上的第一栅极和第二栅极的鳍片，其中第一栅极形成在第二栅极之上。该器件包括在第二沟槽中形成在鳍片的第二侧壁上的第三栅极和第四栅极，其中第三栅极形成在第四栅极之上。还包括制造和操作设备的方法。一种操作方法可以包括偏置第一栅极和第四栅极以产生穿过散热片的电流路径。

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