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11. 发明申请

US20100140734A1 Electronic Device and Method for Manufacturing Thereof 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20100140734A1
公开(公告)日：2010-06-10
申请号：US12707943
申请日：2010-02-18
申请人： Akira SATO , Toru WATANABE , Shogo INABA , Takeshi MORI
发明人： Akira SATO , Toru WATANABE , Shogo INABA , Takeshi MORI
IPC分类号： H01L29/06
CPC分类号： B81C1/00246 , B81B2207/015 , B81B2207/07 , B81C2203/0136 , B81C2203/0714 , B81C2203/0735 , H01L21/7682 , H01L24/05 , H01L2924/14 , H01L2924/00
摘要： An electronic device, including a substrate, a functional structure constituting a functional element formed on the substrate, and a cover structure forming a cavity portion in which the functional structure is disposed, is disclosed. In the electronic device, the cover structure includes a laminated structure of an interlayer insulating film and a wiring layer, the laminated structure being formed on the substrate in such a way that it surrounds the cavity portion, and the cover structure has an upside cover portion covering the cavity portion from above, the upside cover portion being formed with part of the wiring layer that is disposed above the functional structure.
摘要翻译：公开了一种电子设备，包括基板，构成在基板上形成的功能元件的功能结构，以及形成其中设置有功能结构的空腔部分的盖结构。在电子设备中，盖结构包括层间绝缘膜和布线层的叠层结构，层叠结构以包围空腔部分的方式形成在基板上，并且盖结构具有上侧盖部分从上方覆盖空腔部分，上侧盖部分形成有设置在功能结构上方的布线层的一部分。

12. 发明申请

US20100109815A1 MEMS RESONATOR AND MANUFACTURING METHOD OF THE SAME 有权
标题翻译： MEMS谐振器及其制造方法
公开(公告)号：US20100109815A1
公开(公告)日：2010-05-06
申请号：US12684336
申请日：2010-01-08
申请人： Shogo INABA , Akira SATO , Toru WATANABE , Takeshi MORI
发明人： Shogo INABA , Akira SATO , Toru WATANABE , Takeshi MORI
IPC分类号： H01P7/00
CPC分类号： H03H3/0073 , H03H9/1057 , Y10S977/721
摘要： A method is for manufacturing a microelectromechanical system resonator having a semiconductor device and a microelectromechanical system structure unit formed on a substrate. The method includes: forming a lower electrode of an oxide-nitride-oxide capacitor unit included in the semiconductor device using a first silicon layer; forming, using a second silicon layer, a substructure of the microelectromechanical system structure unit and an upper electrode of the oxide-nitride-oxide capacitor unit included in the semiconductor device; and forming, using a third silicon layer, a superstructure of the microelectromechanical system structure unit and a gate electrode of a complementary metal oxide semiconductor circuit unit included in the semiconductor device.
摘要翻译：一种用于制造具有形成在基板上的半导体器件和微机电系统结构单元的微机电系统谐振器的方法。该方法包括：使用第一硅层形成包括在半导体器件中的氧化物 - 氮化物 - 氧化物电容器单元的下电极; 使用第二硅层形成微机电系统结构单元的子结构和包括在半导体器件中的氧化物 - 氮化物 - 氧化物电容器单元的上电极; 以及使用第三硅层形成所述微机电系统结构单元的上部结构和包括在所述半导体器件中的互补金属氧化物半导体电路单元的栅电极。

13. 发明授权

US07671430B2 MEMS resonator and manufacturing method of the same 有权
标题翻译： MEMS谐振器及其制造方法相同
公开(公告)号：US07671430B2
公开(公告)日：2010-03-02
申请号：US11928519
申请日：2007-10-30
申请人： Shogo Inaba , Akira Sato , Toru Watanabe , Takeshi Mori
发明人： Shogo Inaba , Akira Sato , Toru Watanabe , Takeshi Mori
IPC分类号： H01L21/66
CPC分类号： H03H3/0073 , H03H9/1057 , Y10S977/721
摘要： A method is for manufacturing a microeletromechanical system resonator having a semiconductor device and a microelectromechanical system structure unit formed on a substrate. The method includes: forming a lower electrode of an oxide-nitride-oxide capacitor unit included in the semiconductor device using a first silicon layer; forming, using a second silicon layer, a substructure of the microelectromechanical system structure unit and an upper electrode of the oxide-nitride-oxide capacitor unit included in the semiconductor device; and forming, using a third silicon layer, a superstructure of the microelectromechanical system structure unit and a gate electrode of a complementary metal oxide semiconductor circuit unit included in the semiconductor device.
摘要翻译：一种用于制造具有半导体器件和形成在衬底上的微机电系统结构单元的微机械系统谐振器的方法。该方法包括：使用第一硅层形成包括在半导体器件中的氧化物 - 氮化物 - 氧化物电容器单元的下电极; 使用第二硅层形成微机电系统结构单元的子结构和包括在半导体器件中的氧化物 - 氮化物 - 氧化物电容器单元的上电极; 以及使用第三硅层形成所述微机电系统结构单元的上部结构和包括在所述半导体器件中的互补金属氧化物半导体电路单元的栅电极。

14. 发明申请

US20080093684A1 MEMS DEVICE AND FABRICATION METHOD THEREOF 有权
标题翻译： MEMS器件及其制造方法
公开(公告)号：US20080093684A1
公开(公告)日：2008-04-24
申请号：US11872351
申请日：2007-10-15
申请人： Shogo INABA , Akira SATO , Toru WATANABE , Takeshi MORI
发明人： Shogo INABA , Akira SATO , Toru WATANABE , Takeshi MORI
IPC分类号： H01L29/84 , H01L21/44
CPC分类号： B81B3/0086
摘要： A micro electro mechanical system (MEMS) device includes: a fixed electrode made of silicon and provided above a semiconductor substrate; a movable electrode made of silicon and arranged in a mechanically movable manner by having a gap from the semiconductor substrate; and a wiring layered part that is provided around the movable electrode, covers a portion of the fixed electrode and includes wiring. One of the fixed electrode and the movable electrode is implanted with an impurity ion and at least a part of the portion of the fixed electrode covered by the wiring layered part is silicidized.
摘要翻译：微电子机械系统（MEMS）装置包括：由硅制成并设置在半导体衬底之上的固定电极; 由硅制成的可移动电极，通过与半导体衬底有间隙以机械可移动的方式布置; 以及设置在可动电极周围的布线层叠部，覆盖固定电极的一部分并且包括布线。固定电极和可动电极之一注入杂质离子，被布线层叠部覆盖的固定电极的部分的至少一部分被硅化。

15. 发明授权

US06479342B1 Semiconductor devices and manufacturing methods thereof 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US06479342B1
公开(公告)日：2002-11-12
申请号：US09491760
申请日：2000-01-27
申请人： Shogo Inaba
发明人： Shogo Inaba
IPC分类号： H01L218242
CPC分类号： H01L27/0805 , H01L23/5222 , H01L23/552 , H01L27/0203 , H01L28/40 , H01L28/60 , H01L2924/0002 , H01L2924/3011 , Y10S257/908 , H01L2924/00
摘要： Embodiments include semiconductor devices and methods of manufacture, one of which includes a capacitor unit formed on a silicon substrate. The capacitor unit is divided into a plurality of capacitor subunits which are partitioned from each other by a separating insulation layer. Each of the capacitor subunits includes a first electrode layer composed of an impurity diffusion layer formed in the silicon substrate, a second electrode layer composed of a conductive polysilicon layer and a dielectric layer composed of a silicon oxide layer interposed between the first electrode layer and the second electrode layer. The respective capacitor subunits are connected in parallel to each other through a connector.
摘要翻译：实施例包括半导体器件和制造方法，其中之一包括形成在硅衬底上的电容器单元。电容器单元被分成多个电容器子单元，它们通过分离绝缘层彼此分隔开。每个电容器子单元包括由在硅衬底中形成的杂质扩散层构成的第一电极层，由导电多晶硅层构成的第二电极层和介于第一电极层和第二电极层之间的氧化硅层构成的电介质层第二电极层。相应的电容器子单元通过连接器彼此并联连接。

16. 发明授权

US08760234B2 MEMS vibrator and oscillator 有权
标题翻译： MEMS振动器和振荡器
公开(公告)号：US08760234B2
公开(公告)日：2014-06-24
申请号：US13550950
申请日：2012-07-17
申请人： Shogo Inaba
发明人： Shogo Inaba
IPC分类号： H03B5/30
CPC分类号： H03H9/2457 , B81B3/007 , B81B2201/014 , H03H3/0072 , H03H2009/02283 , H03H2009/02456 , H03H2009/02511
摘要： A MEMS vibrator includes: a substrate; a first electrode disposed above the substrate; and a second electrode disposed in a state where at least one portion of the second electrode has a space between the first electrode and the second electrode, and having a beam portion capable of vibrating, in the thickness direction of the substrate, with electrostatic force and a supporting portion supporting one edge of the beam portion and disposed above the substrate, wherein a supporting side face of the supporting portion supporting the one edge has a bending portion which bends in plan view from the thickness direction of the substrate, and the one edge is supported by the supporting side face including the bending portion.
摘要翻译： MEMS振动器包括：基板; 设置在所述基板上方的第一电极; 以及第二电极，其设置在所述第二电极的至少一部分具有在所述第一电极和所述第二电极之间的空间的状态下，并且具有能够在所述基板的厚度方向上以静电力振动的光束部分，支撑部分，其支撑梁部分的一个边缘并且设置在基板上方，其中支撑所述一个边缘的支撑部分的支撑侧面具有从基板的厚度方向在平面图中弯曲的弯曲部分，并且所述一个边缘由包括弯曲部的支撑侧面支撑。

17. 发明授权

US08410561B2 Electronic device and method for manufacturing thereof 有权
标题翻译：电子装置及其制造方法
公开(公告)号：US08410561B2
公开(公告)日：2013-04-02
申请号：US12975065
申请日：2010-12-21
申请人： Akira Sato , Toru Watanabe , Shogo Inaba , Takeshi Mori
发明人： Akira Sato , Toru Watanabe , Shogo Inaba , Takeshi Mori
IPC分类号： H01L31/00
CPC分类号： B81C1/00246 , B81B2207/015 , B81B2207/07 , B81C2203/0136 , B81C2203/0714 , B81C2203/0735 , H01L21/7682 , H01L24/05 , H01L2924/14 , H01L2924/00
摘要： An electronic device, including a substrate, a functional structure constituting a functional element formed on the substrate, and a cover structure forming a cavity portion in which the functional structure is disposed, is disclosed. In the electronic device, the cover structure includes a laminated structure of an interlayer insulating film and a wiring layer, the laminated structure being formed on the substrate in such a way that it surrounds the cavity portion, and the cover structure has an upside cover portion covering the cavity portion from above, the upside cover portion being formed with part of the wiring layer that is disposed above the functional structure.
摘要翻译：公开了一种电子设备，包括基板，构成在基板上形成的功能元件的功能结构，以及形成其中设置有功能结构的空腔部分的盖结构。在电子设备中，盖结构包括层间绝缘膜和布线层的叠层结构，层叠结构以包围空腔部分的方式形成在基板上，盖结构具有上侧盖部分从上方覆盖空腔部分，上侧盖部分形成有设置在功能结构上方的布线层的一部分。

18. 发明授权

US08198957B2 Micro-electro-mechanical-system (MEMS) resonator and manufacturing method thereof 有权
标题翻译：微机电系统（MEMS）谐振器及其制造方法
公开(公告)号：US08198957B2
公开(公告)日：2012-06-12
申请号：US13270868
申请日：2011-10-11
申请人： Shogo Inaba , Akira Sato
发明人： Shogo Inaba , Akira Sato
IPC分类号： H03H9/00 , H03H3/007
CPC分类号： H03H9/2457 , H03H3/0072 , H03H9/02433 , H03H2009/02511
摘要： A micro-electro-mechanical-system resonator, includes: a substrate; a fixed electrode formed on the substrate; and a movable electrode, arranged facing the fixed electrode and driven by an electrostatic attracting force or an electrostatic repulsion force that acts on a gap between the fixed electrode and the movable electrode. An internal surface of a support beam of the movable electrode facing the fixed electrode has an inclined surface.
摘要翻译：一种微电子机械系统谐振器，包括：基板; 形成在基板上的固定电极; 以及可动电极，其布置成面对固定电极并且通过作用在固定电极和可动电极之间的间隙的静电吸引力或静电排斥力驱动。面对固定电极的可动电极的支撑梁的内表面具有倾斜表面。

19. 发明申请

US20110306153A1 METHOD OF MANUFACTURING MEMS DEVICE 审中-公开
标题翻译：制造MEMS器件的方法
公开(公告)号：US20110306153A1
公开(公告)日：2011-12-15
申请号：US13215468
申请日：2011-08-23
申请人： Ryuji KIHARA , Shogo INABA
发明人： Ryuji KIHARA , Shogo INABA
IPC分类号： H01L21/66 , H01L21/00
CPC分类号： H03H3/0077 , H03H9/2457 , H03H2009/02496 , H03H2009/02511
摘要： A method of manufacturing an MEMS device includes: forming a covering structure having an MEMS structure and a hollow portion, which is located on a periphery of the MEMS structure and is opened to an outside, on a substrate; and performing surface etching for the MEMS structure in a gas phase by supplying an etching gas to the periphery of the MEMS structure from the outside.
摘要翻译：一种制造MEMS器件的方法包括：在基板上形成具有MEMS结构的覆盖结构和位于MEMS结构的外围并向外部敞开的中空部分; 并且通过从外部向MEMS结构的外围提供蚀刻气体，在气相中对MEMS结构进行表面蚀刻。

20. 发明授权

US08018302B2 Micro-electro-mechanical-system (MEMS) resonator and manufacturing method thereof 有权
公开(公告)号：US08018302B2
公开(公告)日：2011-09-13
申请号：US12534468
申请日：2009-08-03
申请人： Shogo Inaba , Akira Sato
发明人： Shogo Inaba , Akira Sato
IPC分类号： H03H9/00 , H03H3/007
CPC分类号： H03H9/2457 , H03H3/0072 , H03H9/02433 , H03H2009/02511
摘要： A micro-electro-mechanical-system resonator, includes: a substrate; a fixed electrode formed on the substrate; and a movable electrode, arranged facing the fixed electrode and driven by an electrostatic attracting force or an electrostatic repulsion force that acts on a gap between the fixed electrode and the movable electrode. An internal surface of a support beam of the movable electrode facing the fixed electrode has an inclined surface.

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