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    • 34. 发明授权
    • Droplet ejection device and printer
    • 液滴喷射装置和打印机
    • US07914130B2
    • 2011-03-29
    • US12398351
    • 2009-03-05
    • Takeshi KijimaShoichi Iino
    • Takeshi KijimaShoichi Iino
    • B41J2/045
    • B41J2/14274B41J2202/11
    • A droplet ejection device includes: a substrate having first, second, third & fourth pressure chambers extending in a first direction; a nozzle plate below the substrate & having first, second, third & fourth nozzle apertures continuous with first, second, third & forth pressure chambers, respectively; a vibration plate above the substrate; first, second, third & fourth piezoelectric elements above the vibration plate & above first, second, third & fourth pressure chambers. wherein, viewed in a second direction orthogonal to the first direction, the first nozzle aperture positioned to overlap the third nozzle aperture & doesn't overlap the second & fourth nozzle apertures; the second nozzle aperture overlaps the fourth nozzle aperture & doesn't overlap the first & third nozzle apertures, viewed in the second direction; the first piezoelectric element positioned to overlap the third piezoelectric element & doesn't overlap the second & fourth piezoelectric elements, viewed in the second direction; & the second piezoelectric element overlaps the fourth piezoelectric element & doesn't overlap the first & third piezoelectric elements.
    • 液滴喷射装置包括:具有沿第一方向延伸的第一,第二,第三和第四压力室的基板; 位于基底下方的喷嘴板,分别具有与第一,第二,第三和第四压力室连续的第一,第二,第三和第四喷嘴孔口; 基板上方的振动板; 振动板上方的第一,第二,第三和第四压电元件以及第一,第二,第三和第四压力室之上。 其中,从与所述第一方向正交的第二方向观察,所述第一喷嘴孔定位成与所述第三喷嘴孔重叠,并且不与所述第二和第四喷嘴孔重叠; 第二喷嘴孔与第四喷嘴孔重叠,并且在第二方向上不与第一和第三喷嘴孔重叠; 第一压电元件定位成与第三压电元件重叠,并且在第二方向上不与第二和第四压电元件重叠; 并且第二压电元件与第四压电元件重叠,并且不与第一和第三压电元件重叠。
    • 37. 发明授权
    • Film forming apparatus, substrate for forming oxide thin film and production method thereof
    • 成膜装置,用于形成氧化物薄膜的基板及其制造方法
    • US07678241B2
    • 2010-03-16
    • US11071116
    • 2005-03-04
    • Takeshi KijimaEiji NatoriMitsuhiro Suzuki
    • Takeshi KijimaEiji NatoriMitsuhiro Suzuki
    • C23C14/34
    • C23C14/568C23C14/505
    • The invention provides a film forming apparatus that is capable of forming films sequentially with two types of film forming mechanisms in the same chamber. The film forming apparatus according to the present invention includes a Pt target disposed at one side within a film forming chamber, a sputtering output mechanism to supply to the Pt target, a Pt vapor deposition source disposed at an other side within the film forming chamber, a vapor deposition output mechanism to supply to the Pt vapor deposition source, a substrate holder disposed between the Pt target and the Pt vapor deposition source within the film forming chamber to mount a substrate, a rotating mechanism to move the substrate holder so that the substrate directs to the Pt target or to the Pt vapor deposition source, a heating mechanism to heat the substrate when the substrate is subjected to a sputtering film forming, and a cooling mechanism to cool the substrate when the substrate is subjected to vapor deposition film forming.
    • 本发明提供一种成膜装置,其能够在相同的室中依次用两种成膜机构形成膜。 根据本发明的成膜装置包括设置在成膜室内的一侧的Pt靶,向Pt靶供给的溅射输出机构,设置在成膜室内的另一侧的Pt蒸镀源, 蒸镀输出机构,供给Pt蒸镀源,设置在成膜室内的Pt靶和Pt蒸镀源之间的基板保持架,安装基板;旋转机构,使基板保持架移动,使基板 指向Pt靶或Pt气相沉积源,当衬底经受溅射膜形成时加热衬底的加热机构,以及当衬底经历气相沉积膜形成时冷却衬底的冷却机构。