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    • 63. 发明申请
    • RERAM FORMING WITH RESET AND ILOAD COMPENSATION
    • RERAM与复制和国际劳工组织的赔偿
    • US20140241035A1
    • 2014-08-28
    • US13781503
    • 2013-02-28
    • SANDISK 3D LLC
    • Chang Siau
    • G11C13/00
    • G11C13/0002G11C7/20G11C13/0064G11C13/0069G11C29/028G11C2013/0083G11C2013/0088
    • FORMING reversible resistivity-switching elements is described herein. The FORMING voltage may be halted if the current through the memory cell reaches some reference current. The reference current may depend on how many groups of memory cells have been FORMED. This can help to increase the accuracy of determining when to halt the FORMING voltage. After the FORMING voltage is applied, a RESET voltage may be applied to those memory cells that have a resistance that is lower than a reference resistance to raise the resistance of those memory cells. By raising the resistance, the leakage current of these memory cells when other groups are programmed may be less. This, in turn, helps to prevent FORMING of the other groups from slowing down. A reason why this helps to prevent the slowdown is that the FORMING voltage may be kept near a desired level.
    • 这里描述了形成可逆电阻率开关元件。 如果通过存储单元的电流达到某个参考电流,则可能会停止FORMING电压。 参考电流可能取决于已经形成了多少组存储器单元。 这有助于提高确定何时停止FORMING电压的准确性。 在施加FORMING电压之后,可以将RESET电压施加到具有低于参考电阻的电阻的那些存储单元,以提高那些存储单元的电阻。 通过提高电阻,当其他组被编程时,这些存储器单元的漏电流可能较小。 这反过来又有助于防止其他群体的形成减慢。 为什么这有助于防止减速的原因是,FORMING电压可能保持在所需的水平附近。
    • 65. 发明授权
    • Radiation enhanced resistive switching layers
    • 辐射增强电阻开关层
    • US08809159B2
    • 2014-08-19
    • US13722155
    • 2012-12-20
    • Intermolecular Inc.Kabushiki Kaisha ToshibaSanDisk 3D LLC
    • Yun WangTony P. ChiangTim MinvielleTakeshi Yamaguchi
    • H01L21/20
    • H01L45/1253H01L27/2463H01L45/08H01L45/146H01L45/1641
    • Provided are radiation enhanced resistive switching layers, resistive random access memory (ReRAM) cells including these layers, as well as methods of forming these layers and cells. Radiation creates defects in resistive switching materials that allow forming and breaking conductive paths in these materials thereby improving their resistive switching characteristics. For example, ionizing radiation may break chemical bonds in various materials used for such a layer, while non-ionizing radiation may form electronic traps. Radiation power, dozing, and other processing characteristics can be controlled to generate a distribution of defects within the resistive switching layer. For example, an uneven distribution of defects through the thickness of a layer may help with lowering switching voltages and/or currents. Radiation may be performed before or after thermal annealing, which may be used to control distribution of radiation created defects and other types of defects in resistive switching layers.
    • 提供了辐射增强的电阻式开关层,包括这些层的电阻随机存取存储器(ReRAM)单元,以及形成这些层和单元的方法。 辐射在电阻开关材料中产生缺陷,允许在这些材料中形成和断开导电路径,从而提高其电阻开关特性。 例如,电离辐射可以破坏用于这种层的各种材料中的化学键,而非电离辐射可以形成电子陷阱。 可以控制辐射功率,打盹等处理特性,以产生电阻式开关层内的缺陷分布。 例如,通过层的厚度的缺陷的不均匀分布可能有助于降低开关电压和/或电流。 可以在热退火之前或之后进行辐射,其可以用于控制电阻开关层中辐射产生的缺陷和其他类型的缺陷的分布。
    • 68. 发明授权
    • Forming nonvolatile memory elements by diffusing oxygen into electrodes
    • 通过将氧气扩散到电极中形成非易失性存储元件
    • US08796103B2
    • 2014-08-05
    • US13721476
    • 2012-12-20
    • Intermolecular Inc.Kabushiki Kaisha ToshibaSanDisk 3D LLC
    • Mihir TendulkarTim MinvielleYun WangTakeshi Yamaguchi
    • H01L21/16
    • H01L45/08H01L27/2463H01L45/1266H01L45/146H01L45/1633
    • Provided are methods of forming nonvolatile memory elements including resistance switching layers. A method involves diffusing oxygen from a precursor layer to one or more reactive electrodes by annealing. At least one electrode in a memory element is reactive, while another may be inert. The precursor layer is converted into a resistance switching layer as a result of this diffusion. The precursor layer may initially include a stoichiometric oxide that generally does not exhibit resistance switching characteristics until oxygen vacancies are created. Metals forming such oxides may be more electronegative than metals forming a reactive electrode. The reactive electrode may have substantially no oxygen at least prior to annealing. Annealing may be performed at 250-400° C. in the presence of hydrogen. These methods simplify process control and may be used to form nonvolatile memory elements including resistance switching layers less than 20 Angstroms thick.
    • 提供了形成包括电阻切换层的非易失性存储元件的方法。 一种方法包括通过退火将氧从前体层扩散到一个或多个反应电极。 存储元件中的至少一个电极是反应性的,而另一个电极可能是惰性的。 作为该扩散的结果,前体层被转换成电阻切换层。 前体层可以最初包括化学计量的氧化物,其通常在氧空位产生之前不表现出电阻转换特性。 形成这种氧化物的金属可能比形成反应性电极的金属更具电负性。 至少在退火之前,反应电极可以基本上不含氧。 在氢气存在下,可以在250-400℃下进行退火。 这些方法简化了过程控制,并且可以用于形成包括小于20埃厚的电阻开关层的非易失性存储元件。
    • 70. 发明授权
    • Methods and apparatus for reducing programming time of a memory cell
    • 减少存储单元编程时间的方法和装置
    • US08773898B2
    • 2014-07-08
    • US13890622
    • 2013-05-09
    • SanDisk 3D LLC
    • Tyler J. ThorpRoy E. Scheuerlein
    • G11C13/00
    • G11C7/12G11C7/065G11C8/08G11C13/0004G11C13/0023G11C13/0061G11C13/0069
    • A method is provided for programming a memory cell having a first terminal coupled to a word line and a second terminal coupled to a bit line. During a first predetermined time interval, the word line is switched from a first standby voltage to a first voltage, the bit line is switched from a second standby voltage to a predetermined voltage, and a voltage drop across the first and second terminals is a safe voltage that does not program the memory cell. During a second predetermined time interval, the word line is switched from the first voltage to a second voltage, and a voltage drop across the first and second terminals is a programming voltage that is sufficient to program the memory cell. Numerous other aspects are provided.
    • 提供了一种用于对具有耦合到字线的第一端子和耦合到位线的第二端子的存储单元进行编程的方法。 在第一预定时间间隔期间,字线从第一备用电压切换到第一电压,位线从第二待机电压切换到预定电压,并且跨第一和第二端子的电压降是安全的 不对存储单元进行编程的电压。 在第二预定时间间隔期间,字线从第一电压切换到第二电压,并且跨越第一和第二端子的电压降是足以编程存储器单元的编程电压。 提供了许多其他方面。