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1. 发明授权

US07826148B2 Aspheric lens structures and fabrication methods thereof 有权
标题翻译：非球面透镜结构及其制造方法
公开(公告)号：US07826148B2
公开(公告)日：2010-11-02
申请号：US11706192
申请日：2007-02-15
申请人： Pai-Chun Peter Zung , Shin-Chang Shiung , Wei-Ko Wang , Chia-Yang Chang , Chien-Pang Lin
发明人： Pai-Chun Peter Zung , Shin-Chang Shiung , Wei-Ko Wang , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： G02B13/18 , G02B3/02 , G02B3/00 , G02B9/00
CPC分类号： B29D11/00019 , B29D11/00375
摘要： Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
摘要翻译：公开了具有双非球面表面的非球面透镜结构及其制造方法。非球面透镜结构包括具有设置在第二透镜部件上的非球面顶表面的第一透镜部件，其中第一透镜部件和第二透镜部件之间的界面是球形的。第二透镜部件包括非球面后表面，其中第一透镜部件的非球面上表面的曲率半径不同于第二透镜部件的非球面后表面的曲率半径。第二透镜部件还可以包括平面后表面，其中第三透镜部件设置在第二部件的平面后表面上。第三透镜部件包括非球面后表面，其中第一透镜部件的非球面顶表面的曲率半径不同于第三透镜部件的非球面后表面的曲率半径。

2. 发明申请

US20080198481A1 Aspheric lens structures and fabrication methods thereof 有权
标题翻译：非球面透镜结构及其制造方法
公开(公告)号：US20080198481A1
公开(公告)日：2008-08-21
申请号：US11706192
申请日：2007-02-15
申请人： Pai-Chun Peter Zung , Shin-Chang Shiung , Wei-Ko Wang , Chia-Yang Chang , Chien-Pang Lin
发明人： Pai-Chun Peter Zung , Shin-Chang Shiung , Wei-Ko Wang , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： G02B3/02 , B05D5/06
CPC分类号： B29D11/00019 , B29D11/00375
摘要： Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
摘要翻译：公开了具有双非球面表面的非球面透镜结构及其制造方法。非球面透镜结构包括具有设置在第二透镜部件上的非球面顶表面的第一透镜部件，其中第一透镜部件和第二透镜部件之间的界面是球形的。第二透镜部件包括非球面后表面，其中第一透镜部件的非球面上表面的曲率半径不同于第二透镜部件的非球面后表面的曲率半径。第二透镜部件还可以包括平面后表面，其中第三透镜部件设置在第二部件的平面后表面上。第三透镜部件包括非球面后表面，其中第一透镜部件的非球面顶表面的曲率半径不同于第三透镜部件的非球面后表面的曲率半径。

3. 发明授权

US07679167B2 Electronic assembly for image sensor device and fabrication method thereof 有权
标题翻译：图像传感器装置用电子装配及其制造方法
公开(公告)号：US07679167B2
公开(公告)日：2010-03-16
申请号：US11707110
申请日：2007-02-16
申请人： Teng-Sheng Chen , Pai-Chun Peter Zung , Tzu-Han Lin , Shin-Chang Shiung
发明人： Teng-Sheng Chen , Pai-Chun Peter Zung , Tzu-Han Lin , Shin-Chang Shiung
IPC分类号： H01L23/552
CPC分类号： H04N5/335 , H01L27/14618 , H01L27/14683 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05569 , H01L2224/10 , H01L2924/00014 , H04N5/2254 , H04N5/2257 , H01L2224/05599 , H01L2224/05099
摘要： A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.
摘要翻译：公开了一种用于图像传感器装置的封装模块。封装模块包括设置在下基板和上基板之间的器件芯片。第一导电层在下基板的第一侧壁上方并且与器件芯片绝缘。第一保护层在第一导电层上，并且将第一导电层的一部分暴露在下基板的第一侧壁上。第一焊盘在下基板的底表面上并且电连接到第一导电层。本发明还公开了一种用于图像传感器装置的电子组件及其制造方法。

4. 发明申请

US20070279520A1 IMAGE SENSING DEVICE AND PACKAGE METHOD THEREFOR 审中-公开
标题翻译：图像感测装置及其包装方法
公开(公告)号：US20070279520A1
公开(公告)日：2007-12-06
申请号：US11676813
申请日：2007-02-20
申请人： Hsiao-Wen Lee , Chih-Kung Chang , Pai-Chun Peter Zung , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Chih-Kung Chang , Pai-Chun Peter Zung , Chien-Pang Lin
IPC分类号： H04N5/238
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H01L2224/13 , H04N5/2257
摘要： A package module for an image sensing device is provided. The package module includes a substrate having thereon a photoelectric element array, a first optical element array formed on the photoelectric element array, a package lid having thereon a second optical element array opposite to the first optical element array and having an arrangement corresponding to that of the first optical element array; and a spacer disposed on a bonding area between the package lid and the substrate for adjusting a distance between the package lid and the substrate.
摘要翻译：提供了一种用于图像感测装置的封装模块。封装模块包括其上具有光电元件阵列的基板，形成在光电元件阵列上的第一光学元件阵列，封装盖，其上具有与第一光学元件阵列相对的第二光学元件阵列，并且具有与第一光学元件阵列; 以及间隔件，设置在封装盖和基板之间的接合区域上，用于调节封装盖和基板之间的距离。

5. 发明授权

US07703997B2 Image sensor module having precise image-projection control 有权
标题翻译：图像传感器模块具有精确的图像投影控制
公开(公告)号：US07703997B2
公开(公告)日：2010-04-27
申请号：US11653297
申请日：2007-01-16
申请人： Hsiao-Wen Lee , Tzu-Han Lin , Pai-Chun Peter Zung , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Tzu-Han Lin , Pai-Chun Peter Zung , Chien-Pang Lin
IPC分类号： G03B17/00 , H04N5/335 , H04N5/225 , G02B7/02
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/1469 , H01L2924/16195 , H04N5/2257
摘要： An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.
摘要翻译：图像传感器模块包括图像传感器芯片，至少一个透镜层和至少一个结合层。图像传感器芯片具有由图像捕获元件制造的图像捕获区域和围绕图像捕获区域的分隔区域。至少一个透镜层堆叠在图像传感器芯片上，具有透明基板和安装在透明基板上的透镜，并且适于将投影图像聚焦到图像传感器芯片的图像捕获区域上。所述至少一个接合层被布置成对应于图像传感器芯片的分隔区并且结合在图像传感器芯片和至少一个透镜层之间，胶粘剂与多个间隔元件的混合，每个间隔元件被确定为接合层的高度。

6. 发明申请

US20080164550A1 Electronic assembly for image sensor device and fabrication method thereof 有权
标题翻译：图像传感器装置用电子装配及其制造方法
公开(公告)号：US20080164550A1
公开(公告)日：2008-07-10
申请号：US11707110
申请日：2007-02-16
申请人： Teng-Sheng Chen , Pai-Chun Peter Zung , Tzu-Han Lin , Shin-Chang Shiung
发明人： Teng-Sheng Chen , Pai-Chun Peter Zung , Tzu-Han Lin , Shin-Chang Shiung
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H04N5/335 , H01L27/14618 , H01L27/14683 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05569 , H01L2224/10 , H01L2924/00014 , H04N5/2254 , H04N5/2257 , H01L2224/05599 , H01L2224/05099
摘要： A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.
摘要翻译：公开了一种用于图像传感器装置的封装模块。封装模块包括设置在下基板和上基板之间的器件芯片。第一导电层在下基板的第一侧壁上方并且与器件芯片绝缘。第一保护层在第一导电层上，并且将第一导电层的一部分暴露在下基板的第一侧壁上。第一焊盘位于下基板的底表面上并与第一导电层电连接。本发明还公开了一种用于图像传感器装置的电子组件及其制造方法。

7. 发明申请

US20070166029A1 Image sensor module having precise image-projection control 有权
标题翻译：图像传感器模块具有精确的图像投影控制
公开(公告)号：US20070166029A1
公开(公告)日：2007-07-19
申请号：US11653297
申请日：2007-01-16
申请人： Hsiao-Wen Lee , Tzu-Han Lin , Pai-Chun Peter Zung , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Tzu-Han Lin , Pai-Chun Peter Zung , Chien-Pang Lin
IPC分类号： G03B17/00
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/1469 , H01L2924/16195 , H04N5/2257
摘要： An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.
摘要翻译：图像传感器模块包括图像传感器芯片，至少一个透镜层和至少一个结合层。图像传感器芯片具有由图像捕获元件制造的图像捕获区域和围绕图像捕获区域的分隔区域。至少一个透镜层堆叠在图像传感器芯片上，具有透明基板和安装在透明基板上的透镜，并且适于将投影图像聚焦到图像传感器芯片的图像捕获区域上。所述至少一个接合层被布置成对应于图像传感器芯片的分隔区并且结合在图像传感器芯片和至少一个透镜层之间，胶粘剂与多个间隔元件的混合，每个间隔元件被确定为接合层的高度。

8. 发明授权

US07732244B2 Method for forming light-transmitting regions 有权
标题翻译：形成透光区域的方法
公开(公告)号：US07732244B2
公开(公告)日：2010-06-08
申请号：US12003186
申请日：2007-12-20
申请人： Chieh-Yuan Cheng , Tzu-Han Lin , Pai-Chun Peter Zung
发明人： Chieh-Yuan Cheng , Tzu-Han Lin , Pai-Chun Peter Zung
IPC分类号： H01L21/00
CPC分类号： H01L27/14623 , H01L27/14627 , H01L27/14685 , H01L27/14818
摘要： A method for forming a light-transmitting region comprises providing a support feature. A sacrificial layer is formed over a portion of the support feature, wherein the sacrificial layer comprises an energy-induced swelling material. A light-blocking layer is conformably formed over the support feature to cover the sacrificial layer and the support feature. The support feature, the sacrificial layer, and the light-blocking layer are subjected to an energy source to swell the sacrificial layer until bursting to thereby delaminate a portion of the light-blocking layer from the support feature and leave a light-transmitting region exposed with a portion of the support feature in the light-blocking layer. A gas flow or scrub cleaning force is provided to clean up the light-transmitting region and a top surface of the light-blocking layer remains over the support feature.
摘要翻译：形成透光区域的方法包括提供支撑特征。在支撑特征的一部分上形成牺牲层，其中牺牲层包括能量引起的膨胀材料。在支撑特征上顺应地形成遮光层以覆盖牺牲层和支撑特征。支撑特征，牺牲层和遮光层经受能量源以使牺牲层溶胀直到爆裂，从而使遮光层的一部分与支撑特征分层，并使透光区域暴露其中一部分支撑特征在遮光层中。提供气流或洗涤清洁力以清洁透光区域，并且遮光层的顶表面保留在支撑特征上。

9. 发明申请

US20090001495A1 Image sensor package and fabrication method thereof 有权
公开(公告)号：US20090001495A1
公开(公告)日：2009-01-01
申请号：US11822011
申请日：2007-06-29
申请人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
发明人： Jui-Ping Weng , Jang-Cheng Hsieh , Tzu-Han Lin , Pai-Chun Peter Zung
IPC分类号： H01L31/00 , H01L21/00
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/10
摘要： The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.

10. 发明授权

US08153458B2 Image sensing devices and methods for fabricating the same 有权
标题翻译：图像感测装置及其制造方法
公开(公告)号：US08153458B2
公开(公告)日：2012-04-10
申请号：US12407115
申请日：2009-03-19
申请人： Jui-Ping Weng , Tzu-Han Lin , Pai-Chun Peter Zung
发明人： Jui-Ping Weng , Tzu-Han Lin , Pai-Chun Peter Zung
IPC分类号： H01L21/70 , H01L31/0232 , H01L31/14
CPC分类号： H01L27/14687 , H01L27/14618 , H01L2224/05001 , H01L2224/05009 , H01L2224/05147 , H01L2224/05184 , H01L2224/05548 , H01L2224/0557 , H01L2224/10 , H01L2924/00014 , Y10S257/911 , H01L2224/05599
摘要： Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.
摘要翻译：提供了图像感测装置及其制造方法。示例性图像感测装置包括具有彼此相对的第一侧和第二侧的第一基板。在第一侧的第一基板中形成多个图像感测元件。通过第一基板形成导电通孔，其具有在第一侧被第一基板暴露的第一表面和在第二侧被第一基板暴露的第二表面。导电焊盘在第一侧覆盖导电通孔并且电连接图像感测元件。导电层位于第二侧的导电通孔上，并与导电焊盘电连接。在导电层的一部分上形成导电凸块。第二衬底在第一侧与第一衬底结合。

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