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    • 1. 发明授权
    • Command protocol for integrated circuits
    • 集成电路命令协议
    • US07844798B2
    • 2010-11-30
    • US11955659
    • 2007-12-13
    • Andreas GärtnerGeorg BraunMaurizio SkerljJohannes Stecker
    • Andreas GärtnerGeorg BraunMaurizio SkerljJohannes Stecker
    • G06F1/32
    • G06F1/3203G06F1/3275G06F1/3287G11C8/12G11C2207/2227Y02D10/14Y02D10/171
    • A method of operating an integrated circuit involves supplying an instruction portion of a command to the integrated circuit to specify an operation to be performed by the integrated circuit. At least some types of commands also include an attributes portion that provides additional information about the operation to be performed. The attributes portion of the command is supplied to the integrated circuit with a delay relative to the instruction portion of the command. The integrated circuit selectively enables circuitry for processing the attributes portion if the integrated circuit determines from the received instruction portion that the command also includes an attributes portion. The delay between the two portions of the command provides sufficient time for the integrated circuit to enable the attributes processing circuitry, which, in a default state, can be disabled during an active mode of the integrated circuit to save power.
    • 一种操作集成电路的方法包括向集成电路提供命令的指令部分,以指定要由集成电路执行的操作。 至少一些类型的命令还包括提供关于要执行的操作的附加信息的属性部分。 命令的属性部分相对于命令的指令部分延迟地提供给集成电路。 如果集成电路从接收到的指令部分确定该命令还包括属性部分,则集成电路选择性地启用用于处理属性部分的电路。 该命令的两个部分之间的延迟为集成电路提供了足够的时间,使得能够在集成电路的活动模式期间在默认状态下禁用属性处理电路以节省功率。
    • 3. 发明授权
    • Method and circuit for allocating memory arrangement addresses
    • 分配存储器配置地址的方法和电路
    • US07149864B2
    • 2006-12-12
    • US10777992
    • 2004-02-12
    • Georg BraunAndreas Jakobs
    • Georg BraunAndreas Jakobs
    • G06F12/02
    • G06F12/0669
    • Methods and apparatus for allocating memory arrangement addresses to a buffer chip, during an initialization mode, for use in addressing one or more memory arrangements connected to the buffer chip are provided. A buffer circuit may receive first initialization data specifying a first set of available memory arrangement addresses and associate one or more of the first set of available memory arrangement addresses with the one or more memory arrangements connected to the buffer chip. The buffer circuit may also generate second initialization data specifying the set of available memory arrangement addresses available after the association. The second initialization data may be transmitted to another buffer circuit for use in address allocation or back to a memory access control unit.
    • 提供了用于在初始化模式期间将存储器布置地址分配给缓冲器芯片用于寻址连接到缓冲器芯片的一个或多个存储器配置的方法和装置。 缓冲器电路可以接收指定第一组可用存储器布置地址的第一初始化数据,并将第一组可用存储器配置地址中的一个或多个与连接到缓冲器芯片的一个或多个存储器配置相关联。 缓冲电路还可以产生指定在关联之后可用的可用存储器布置地址的集合的第二初始化数据。 第二初始化数据可以被发送到用于地址分配的另一缓冲电路或者返回到存储器访问控制单元。
    • 4. 发明申请
    • Semiconductor memory and method for adapting the phase relationship between a clock signal and strobe signal during the acceptance of write data to be transmitted
    • 半导体存储器和方法,用于在接收要发送的写入数据期间适配时钟信号和选通信号之间的相位关系
    • US20060262613A1
    • 2006-11-23
    • US11410320
    • 2006-04-24
    • Georg BraunEckehard PlaettnerChristian WeisAndreas Jakobs
    • Georg BraunEckehard PlaettnerChristian WeisAndreas Jakobs
    • G11C7/00
    • G11C7/22G11C7/222G11C11/4076
    • A method is provided for adapting the phase relationship between a clock signal and a strobe signal for accepting write data to be transmitted into a memory circuit, a write command signal being transmitted to the memory circuit in a manner synchronized with the clock signal, a write data signal being transmitted synchronously with the strobe signal, a phase offset between the transmitted clock signal and the transmitted strobe signal being set such that the write data are reliably accepted in the memory circuit. The method comprises the following acts performed in the memory circuit: generating a write acceptance signal depending on the clock signal and the write command signal with a specific pulse duration; determining the number of edges of the strobe signal with a defined edge direction during the pulse duration; comparing the number determined with a predetermined desired number of corresponding edges of the strobe signal; and providing an item of error information indicating whether the number determined matches the desired number.
    • 提供了一种适应时钟信号和选通信号之间的相位关系的方法,用于接收要发送到存储器电路的写入数据,写入命令信号以与时钟信号同步的方式发送到存储器电路,写入 数据信号与选通信号同步发送,所发送的时钟信号和发送的选通信号之间的相位偏移被设置为使得写入数据被可靠地接受在存储器电路中。 该方法包括在存储器电路中执行的以下动作:根据具有特定脉冲持续时间的时钟信号和写入命令信号产生写入验收信号; 在所述脉冲持续时间期间,确定具有限定的边缘方向的所述选通信号的边缘数; 将所选择的所述数量与所述选通信号的相应边缘的预定数量进行比较; 并提供指示所确定的数量是否匹配所需数量的错误信息项。
    • 9. 发明授权
    • Method for fabricating a ferroelectric memory configuration
    • 铁电存储器配置的制造方法
    • US06500677B2
    • 2002-12-31
    • US10027106
    • 2001-12-26
    • Renate BergmannChristine DehmThomas RoehrGeorg BraunHeinz HoenigschmidGünther Schindler
    • Renate BergmannChristine DehmThomas RoehrGeorg BraunHeinz HoenigschmidGünther Schindler
    • H01L2100
    • H01L27/11502H01L27/11507
    • The invention provides a method. In a first step of a method for fabricating a ferroelectric memory configuration, there is provided a substrate having a multiplicity of memory cells. Each of the memory cells has at least one select transistor, at least one short-circuit transistor, and at least one ferroelectric capacitor. The transistors are connected in an electrically conductive manner to a first of the electrodes of the ferroelectric capacitor. In the next step, at least one electrically insulating layer is applied. In the next step, at least one contact hole for connecting a second electrode of the ferroelectric capacitors is produced. Next, contact holes for connecting the short-circuit transistors are produced. Next, the contact holes are filled with electrically conductive material. Next, an electrically conductive layer is applied and patterned, so that the second electrodes of the ferroelectric capacitors are each conductively connected to the short-circuit transistors.
    • 本发明提供了一种方法。 在制造铁电存储器结构的方法的第一步骤中,提供了具有多个存储单元的衬底。 每个存储单元具有至少一个选择晶体管,至少一个短路晶体管和至少一个铁电电容器。 晶体管以导电方式连接到铁电电容器的第一电极。 在下一步骤中,施加至少一个电绝缘层。 在下一步骤中,产生用于连接铁电电容器的第二电极的至少一个接触孔。 接下来,制造用于连接短路晶体管的接触孔。 接下来,接触孔填充有导电材料。 接下来,施加导电层并图案化,使得强电介质电容器的第二电极分别与短路晶体管导通。