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    • 5. 发明申请
    • Semiconductor Memory Devices Including Offset Bit Lines
    • 包括偏移位线的半导体存储器件
    • US20090218609A1
    • 2009-09-03
    • US12465202
    • 2009-05-13
    • Doo-Hoon GooHan-Ku ChoJoo-Tae MoonSang-Gyun WooGi-Sung YeoKyoung-Yun Baek
    • Doo-Hoon GooHan-Ku ChoJoo-Tae MoonSang-Gyun WooGi-Sung YeoKyoung-Yun Baek
    • H01L27/108
    • H01L27/10814H01L27/0207H01L27/10882H01L27/11502
    • A semiconductor memory device may include a substrate having a plurality of active regions wherein each active region has a length in a direction of a first axis and a width in a direction of a second axis. The length may be greater than the width, and the plurality of active regions may be provided in a plurality of columns of active regions in the direction of the second axis. A plurality of wordline pairs may be provided on the substrate, with each wordline pair crossing active regions of a respective column of active regions defining a drain portion of each active region between wordlines of the respective wordline pair. A plurality of bitlines on the substrate may cross the plurality of wordline pairs, with each bitline being electrically coupled to a respective drain portion of an active region of each column, and with each bitline being arranged between the respective drain portion and another drain portion of an adjacent active region of the same column.
    • 半导体存储器件可以包括具有多个有源区的衬底,其中每个有源区具有在第一轴的方向上的长度和在第二轴的方向上的宽度。 长度可以大于宽度,并且多个有源区可以在第二轴的方向上设置在多个有效区列中。 可以在衬底上提供多个字线对,其中每个字线对跨越相应的有效区域列的有源区域,在相应字线对的字线之间限定每个有效区域的漏极部分。 衬底上的多个位线可以跨过多个字线对,每个位线电耦合到每个列的有源区的相应漏极部分,并且每个位线布置在相应的漏极部分和另一个漏极部分的另一个漏极部分之间 相同列的相邻有效区域。
    • 6. 发明授权
    • Method of manufacturing mask for correcting optical proximity effect
    • 制造用于校正光学邻近效应的掩模的方法
    • US07378196B2
    • 2008-05-27
    • US10982813
    • 2004-11-08
    • Byeong-Soo KimHan-ku Cho
    • Byeong-Soo KimHan-ku Cho
    • G03F1/00
    • G03F1/34G03F1/29G03F1/36G03F7/70441
    • A mask corrects for an optical proximity effect (OPE). A dummy pattern having a phase-edge effect is formed on a mask substrate. The phase-edge effect reduces the intensity of light at the boundary of two transmitting regions from through transmitted light has a phase difference. A pattern can then be formed in a photolithographic process using the phase-edge effect. A difference between “isolated” and “dense” patterns formed on a wafer can be reduced by forming a dummy pattern in an isolated pattern region of the mask and making the diffraction pattern of the isolated pattern the same as that of the dense pattern, thereby improving the total focus margin. Because the intensity of light is reduced at the boundary between a first region in which the phase of the transmitted light is 0° and a second region in which the phase of the transmitted light is 180°, for example, a photoresist layer is not photosensitized.
    • 掩模校正光学邻近效应(OPE)。 在掩模基板上形成具有相边效应的虚设图案。 相位效应通过透射光降低两个透射区域的边界处的光强度,具有相位差。 然后可以使用相缘效应在光刻工艺中形成图案。 可以通过在掩模的隔离图案区域中形成虚设图案并使孤立图案的衍射图案与致密图案相同,从而可以减小在晶片上形成的“隔离”和“密集”图案之间的差异,由此 提高总焦距。 因为在透射光的相位为0°的第一区域和透射光的相位为180°的第二区域之间的边界处的光的强度例如光致抗蚀剂层不被光敏化 。
    • 7. 发明授权
    • Method for cleaning substrate having exposed silicon and silicon germanium layers and related method for fabricating semiconductor device
    • 用于清洁具有暴露的硅和锗锗层的衬底的方法和用于制造半导体器件的相关方法
    • US07344999B2
    • 2008-03-18
    • US11527473
    • 2006-09-27
    • Chang-Sup MunWoo-Gwan ShimHan-Ku ChoChang-Ki HongDoo-Won Kwon
    • Chang-Sup MunWoo-Gwan ShimHan-Ku ChoChang-Ki HongDoo-Won Kwon
    • H01L21/302
    • H01L21/02057H01L21/02082
    • A method for cleaning a substrate on which a silicon layer and a silicon germanium layer are formed and exposed, and method for fabricating a semiconductor device using the cleaning method are disclosed. The cleaning method comprises preparing a semiconductor substrate on which a silicon layer and a silicon germanium layer are formed and exposed; and performing a first cleaning sub-process that uses a first cleaning solution to remove a native oxide layer from the semiconductor substrate. The cleaning method further comprises performing a second cleaning sub-process on the semiconductor substrate after performing the first cleaning sub-process, wherein the second cleaning sub-process comprises using a second cleaning solution. In addition, the second cleaning solution comprises ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), and deionized water (H2O), and the second cleaning solution comprises at least 200 times more deionized water (H2O) than ammonium hydroxide (NH4OH) by volume.
    • 公开了一种用于清洁其上形成和暴露硅层和硅锗层的衬底的方法,以及使用该清洁方法制造半导体器件的方法。 该清洗方法包括:制备半导体衬底,在其上形成和暴露硅层和硅锗层; 以及执行使用第一清洁溶液以从半导体衬底去除自然氧化物层的第一清洁子过程。 清洁方法还包括在执行第一清洁子过程之后在半导体衬底上执行第二清洁子处理,其中第二清洁子处理包括使用第二清洁溶液。 此外,第二清洗溶液包括氢氧化铵(NH 4 OH),过氧化氢(H 2 O 2 O 2)和去离子水( H 2 O),并且第二清洁溶液包含比氢氧化铵(NH 4 O 2)少至少200倍的去离子水(H 2 O 2 O) OH)。
    • 9. 发明申请
    • Optical proximity correction system and methods thereof
    • 光学邻近校正系统及其方法
    • US20070094635A1
    • 2007-04-26
    • US11585086
    • 2006-10-24
    • Sung-Soo SuhYoung-Seog KangHan-Ku ChoSang-Gyun Woo
    • Sung-Soo SuhYoung-Seog KangHan-Ku ChoSang-Gyun Woo
    • G06F17/50
    • G03F1/36
    • An optical proximity correction (OPC) system and methods thereof are provided. The example OPC system may include an integrated circuit (IC) layout generation unit generating an IC layout, a database unit storing a first plurality of OPC models, each of the first plurality of OPC models associated with one of a plurality of target specific characteristics and a mask layout generation unit including a model selector selecting a second plurality of OPC models based on a comparison between the target specific characteristics associated with the plurality of OPC models and the generated IC layout, the mask layout generation unit generating a mask layout based on the IC layout and the selected second plurality of OPC models. A first example method may include storing a first plurality OPC models, each of the first plurality of OPC models associated with one of a plurality of target specific characteristics, generating an IC layout, selecting a second plurality of OPC models based on a comparison between the target specific characteristics associated with the first plurality of OPC models and the generated IC layout and generating a mask layout based on the generated IC layout and the selected second plurality of OPC models. A second example method may include applying a first OPC model to a first portion of a generated integrated circuit (IC) layout, applying a second OPC model to a second portion of the generated IC layout and generating a mask layout based on the generated IC layout after the application of the first and second OPC models.
    • 提供光学邻近校正(OPC)系统及其方法。 示例性OPC系统可以包括产生IC布局的集成电路(IC)布局生成单元,存储第一多个OPC模型的数据库单元,与多个目标特定特征之一相关联的第一多个OPC模型中的每一个,以及 掩模布局生成单元,其包括基于与所述多个OPC模型相关联的目标特定特性与所生成的IC布局之间的比较来选择第二多个OPC模型的模型选择器,所述掩模布局生成单元基于所述多个OPC模型生成掩模布局 IC布局和所选择的第二批OPC模型。 第一示例性方法可以包括存储第一多个OPC模型,所述第一多个OPC模型中的每一个与多个目标特定特征中的一个相关联,生成IC布局,基于所述多个OPC模型之间的比较来选择第二多个OPC模型 与第一多个OPC模型相关联的目标特定特征和所生成的IC布局,并且基于所生成的IC布局和所选择的第二多个OPC模型生成掩模布局。 第二示例性方法可以包括将第一OPC模型应用于所生成的集成电路(IC)布局的第一部分,将第二OPC模型应用于所生成的IC布局的第二部分,并且基于所生成的IC布局生成掩模布局 之后应用了第一个和第二个OPC模型。
    • 10. 发明授权
    • Method for manufacturing semiconductor device with contact body extended in direction of bit line
    • 具有沿位线方向延伸的接触体的半导体器件的制造方法
    • US07205241B2
    • 2007-04-17
    • US10731931
    • 2003-12-10
    • Chang-min ParkJung-hyeon LeeHan-ku ChoJoon-soo Park
    • Chang-min ParkJung-hyeon LeeHan-ku ChoJoon-soo Park
    • H01L21/302
    • H01L21/76897H01L21/76895H01L27/10855H01L27/10894H01L28/91Y10S438/942
    • Methods for manufacturing semiconductor devices with contact bodies extended in a direction of a bit line to increase the contact area between a contact body and a storage electrode is provided. In one aspect a method includes forming gate lines on a semiconductor substrate, forming a first insulating layer to cover the gate lines, forming first contact pads and second contact pads, which are electrically connected to the semiconductor substrate between the gate lines, by penetrating the first insulating layer. Further, a second insulating layer is formed to cover the first contact pads and the second contact pads, and bit lines are formed across over the gate lines and are electrically connected to the second contact pads by penetrating the second insulating layer. In addition, a third insulating layer is formed to cover the bit lines and is selectively etched to form a band-type opening that crosses the bit lines and exposes the first contact pads.
    • 提供了制造具有沿位线方向延伸的接触体以增加接触体与存储电极之间的接触面积的半导体器件的方法。 在一个方面,一种方法包括在半导体衬底上形成栅极线,形成第一绝缘层以覆盖栅极线,形成第一接触焊盘和第二接触焊盘,这些接触焊盘和第二接触焊盘通过穿透栅极线与半导体衬底电连接 第一绝缘层。 此外,形成第二绝缘层以覆盖第一接触焊盘和第二接触焊盘,并且位线横跨栅极线形成,并且通过穿透第二绝缘层而电连接到第二接触焊盘。 此外,形成第三绝缘层以覆盖位线,并且被选择性地蚀刻以形成穿过位线并暴露第一接触焊盘的带状开口。