专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060216532A1 METHODS AND APPARATUS FOR DEVICES HAVING IMPROVED CAPACITANCE 审中-公开
公开(公告)号：US20060216532A1
公开(公告)日：2006-09-28
申请号：US11383715
申请日：2006-05-16
申请人： Karl Robinson
发明人： Karl Robinson
IPC分类号： B32B15/04 , H01L29/00
CPC分类号： H01L21/02244 , H01G4/10 , H01G9/042 , H01L21/02186 , H01L21/02197 , H01L21/02258 , H01L21/2885 , H01L21/31687 , H01L27/10811 , H01L27/1085 , H01L27/10852 , H01L28/40 , H01L28/55 , H01L28/91
摘要： Some embodiments of the invention include a capacitor in which a dielectric of the capacitor is formed by oxidizing at least a portion of a metal layer. Other embodiments are described and claimed.

2. 发明申请

US20050037592A1 Devices having improved capacitance and methods of their fabrication 有权
标题翻译：具有改进电容的器件及其制造方法
公开(公告)号：US20050037592A1
公开(公告)日：2005-02-17
申请号：US10946770
申请日：2004-09-22
申请人： Karl Robinson
发明人： Karl Robinson
IPC分类号： H01L21/02 , H01L21/288 , H01L21/316 , H01L21/8242 , H01L27/108 , H01L21/20
CPC分类号： H01L21/02244 , H01G4/10 , H01G9/042 , H01L21/02186 , H01L21/02197 , H01L21/02258 , H01L21/2885 , H01L21/31687 , H01L27/10811 , H01L27/1085 , H01L27/10852 , H01L28/40 , H01L28/55 , H01L28/91 , Y10T29/417
摘要： A capacitor formed by a process using only two deposition steps and a dielectric formed by oxidizing a metal layer in an electrolytic solution. The capacitor has first and second conductive plates and a dielectric is formed from the first conductive plate.
摘要翻译：通过仅使用两个沉积步骤的工艺形成的电容器和通过氧化电解溶液中的金属层而形成的电介质。电容器具有第一和第二导电板，并且由第一导电板形成电介质。

3. 发明授权

US6054172A Copper electroless deposition on a titanium-containing surface 有权
公开(公告)号：US6054172A
公开(公告)日：2000-04-25
申请号：US257854
申请日：1999-02-25
申请人： Karl Robinson , Ted Taylor
发明人： Karl Robinson , Ted Taylor
IPC分类号： C23C18/18 , C23C18/40 , H01L21/288 , H01L21/3205 , H01L21/768 , H01L23/52 , B05D5/12
CPC分类号： H01L21/76838 , H01L21/288 , H01L21/76879 , H01L21/76885 , Y10S438/903 , Y10S438/945 , Y10S438/976
摘要： A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.

4. 发明授权

US08469298B2 Crushing machines 有权
标题翻译：破碎机
公开(公告)号：US08469298B2
公开(公告)日：2013-06-25
申请号：US12596943
申请日：2008-04-21
申请人： Karl Robinson , Jonathan Nevin , Anthony Devlin
发明人： Karl Robinson , Jonathan Nevin , Anthony Devlin
IPC分类号： B02C21/02
CPC分类号： B02C23/04 , B02C2/007 , B02C21/026 , B02C23/02 , B02C23/08 , Y10T29/49826
摘要： A crushing machine including a crushing means, a feed conveyor for feeding material to the crushing means, a detector for detecting metal in the material on the feed conveyor, and a bypass chute for the crushing means, the feed conveyor being movable between a normal operating position in which the material is fed to the crushing means and a bypass position in which the material is fed to the bypass chute, the arrangement being such that on detection of metal in the material, the feed conveyor is stopped and moved from the normal operating position to the bypass position so that the material with the metal is discharged into the bypass chute.
摘要翻译：一种破碎机，包括破碎装置，用于将材料供给到破碎装置的进料输送机，用于检测进料输送机上的材料中的金属的检测器和用于破碎装置的旁通斜槽，进料输送机可在正常操作其中材料被供给到破碎装置的位置和其中材料被供给到旁路滑槽的旁路位置，该布置使得在检测到材料中的金属时，进给输送机停止并从正常操作位置到旁路位置，使得具有金属的材料被排放到旁路斜槽中。

5. 发明授权

US06326303B1 Copper electroless deposition on a titanium-containing surface 失效
标题翻译：在含钛表面上的铜无电沉积
公开(公告)号：US06326303B1
公开(公告)日：2001-12-04
申请号：US09503593
申请日：2000-02-11
申请人： Karl Robinson , Ted Taylor
发明人： Karl Robinson , Ted Taylor
IPC分类号： H01L2144
CPC分类号： H01L21/76838 , H01L21/288 , H01L21/76879 , H01L21/76885 , Y10S438/903 , Y10S438/945 , Y10S438/976
摘要： A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.
摘要翻译：提供了一种在基板的含钛表面上沉积铜的方法。该方法包括在衬底上形成图案化的催化剂材料，使得含钛表面在选定的区域中暴露。催化剂材料具有氧化半反应势，其量值大于二氧化钛的还原半反应电位的量级。然后将铜从无电溶液沉积到含钛表面的暴露区域上。

6. 发明授权

US09422651B2 Methods for arranging nanoscopic elements within networks, fabrics, and films 有权
标题翻译：在网络，织物和薄膜中布置纳米级元件的方法
公开(公告)号：US09422651B2
公开(公告)日：2016-08-23
申请号：US13076152
申请日：2011-03-30
申请人： David A. Roberts , Hao-Yu Lin , Thomas R. Bengtson , Thomas Rueckes , Karl Robinson , H. Montgomery Manning , Rahul Sen , Michel Monteiro
发明人： David A. Roberts , Hao-Yu Lin , Thomas R. Bengtson , Thomas Rueckes , Karl Robinson , H. Montgomery Manning , Rahul Sen , Michel Monteiro
IPC分类号： D04H1/4382 , C01B31/02 , B82Y30/00 , B82Y40/00 , D04H1/4242 , D04H1/4391 , D04H1/74 , D01G19/00
CPC分类号： B05D1/40 , B05D1/005 , B05D1/02 , B05D1/18 , B05D1/28 , B05D1/32 , B82Y30/00 , B82Y40/00 , C01B32/168 , D04H1/4242 , D04H1/4382 , D04H1/4391 , D04H1/74
摘要： A method for arranging nanotube elements within nanotube fabric layers and films is disclosed. A directional force is applied over a nanotube fabric layer to render the fabric layer into an ordered network of nanotube elements. That is, a network of nanotube elements drawn together along their sidewalls and substantially oriented in a uniform direction. In some embodiments this directional force is applied by rolling a cylindrical element over the fabric layer. In other embodiments this directional force is applied by passing a rubbing material over the surface of a nanotube fabric layer. In other embodiments this directional force is applied by running a polishing material over the nanotube fabric layer for a predetermined time. Exemplary rolling, rubbing, and polishing apparatuses are also disclosed.
摘要翻译：公开了一种在纳米管织物层和膜内布置纳米管元件的方法。在纳米管织物层上施加定向力以使织物层成为纳米管元件的有序网络。也就是说，一个纳米管元件的网络沿其侧壁一起拉伸并且基本上沿均匀的方向取向。在一些实施例中，通过将圆柱形元件滚动在织物层上而施加该定向力。在其它实施例中，通过将摩擦材料通过纳米管织物层的表面来施加该定向力。在其他实施例中，通过在纳米管织物层上运行抛光材料预定时间来施加该定向力。还公开了示例性的滚动，摩擦和抛光装置。

7. 发明申请

US20110291315A1 METHODS FOR ARRANGING NANOSCOPIC ELEMENTS WITHIN NETWORKS, FABRICS, AND FILMS 有权
标题翻译：在网络，织物和膜片中安装纳米元素的方法
公开(公告)号：US20110291315A1
公开(公告)日：2011-12-01
申请号：US13076152
申请日：2011-03-30
申请人： David A. ROBERTS , Hao-Yu LIN , Thomas R. BENGTSON , Thomas RUECKES , Karl ROBINSON , H. Montgomery MANNING , Rahul SEN , Michel MONTEIRO
发明人： David A. ROBERTS , Hao-Yu LIN , Thomas R. BENGTSON , Thomas RUECKES , Karl ROBINSON , H. Montgomery MANNING , Rahul SEN , Michel MONTEIRO
IPC分类号： B29C55/00 , B82Y40/00
CPC分类号： B05D1/40 , B05D1/005 , B05D1/02 , B05D1/18 , B05D1/28 , B05D1/32 , B82Y30/00 , B82Y40/00 , C01B32/168 , D04H1/4242 , D04H1/4382 , D04H1/4391 , D04H1/74
摘要： A method for arranging nanotube elements within nanotube fabric layers and films is disclosed. A directional force is applied over a nanotube fabric layer to render the fabric layer into an ordered network of nanotube elements. That is, a network of nanotube elements drawn together along their sidewalls and substantially oriented in a uniform direction. In some embodiments this directional force is applied by rolling a cylindrical element over the fabric layer. In other embodiments this directional force is applied by passing a rubbing material over the surface of a nanotube fabric layer. In other embodiments this directional force is applied by running a polishing material over the nanotube fabric layer for a predetermined time. Exemplary rolling, rubbing, and polishing apparatuses are also disclosed.
摘要翻译：公开了一种在纳米管织物层和膜内布置纳米管元件的方法。在纳米管织物层上施加定向力以使织物层成为纳米管元件的有序网络。也就是说，一个纳米管元件的网络沿其侧壁一起拉伸并且基本上沿均匀的方向取向。在一些实施例中，通过将圆柱形元件滚动在织物层上而施加该定向力。在其它实施例中，通过将摩擦材料通过纳米管织物层的表面来施加该定向力。在其他实施例中，通过在纳米管织物层上运行抛光材料预定时间来施加该定向力。还公开了示例性的滚动，摩擦和抛光装置。

8. 发明申请

US20110244121A1 METHODS FOR ARRANGING NANOTUBE ELEMENTS WITHIN NANOTUBE FABRICS AND FILMS 有权
标题翻译：在纳米管织物和薄膜中安装纳米元素的方法
公开(公告)号：US20110244121A1
公开(公告)日：2011-10-06
申请号：US12945501
申请日：2010-11-12
申请人： David A. Roberts , Hao-Yu Lin , Thomas R. Bengtson , Thomas Rueckes , Karl Robinson , H. Montgomery Manning , Rahul Sen , Michel Pires Monteiro
发明人： David A. Roberts , Hao-Yu Lin , Thomas R. Bengtson , Thomas Rueckes , Karl Robinson , H. Montgomery Manning , Rahul Sen , Michel Pires Monteiro
IPC分类号： B05D3/12 , B05D1/40 , B05D3/00 , B05D3/04 , B05D1/32 , B05D1/12 , B05D5/00
CPC分类号： D04H1/4382 , B05D3/007 , B05D3/12 , B82Y30/00 , B82Y40/00 , C01B32/168
摘要： A method for arranging nanotube elements within nanotube fabric layers and films is disclosed. A directional force is applied over a nanotube fabric layer to render the fabric layer into an ordered network of nanotube elements. That is, a network of nanotube elements drawn together along their sidewalls and substantially oriented in a uniform direction. In some embodiments this directional force is applied by rolling a cylindrical element over the fabric layer. In other embodiments this directional force is applied by passing a rubbing material over the surface of a nanotube fabric layer. In other embodiments this directional force is applied by running a polishing material over the nanotube fabric layer for a predetermined time. Exemplary rolling, rubbing, and polishing apparatuses are also disclosed.
摘要翻译：公开了一种在纳米管织物层和膜内布置纳米管元件的方法。在纳米管织物层上施加定向力以使织物层成为纳米管元件的有序网络。也就是说，一个纳米管元件的网络沿其侧壁一起拉伸并且基本上沿均匀的方向取向。在一些实施例中，通过将圆柱形元件滚动在织物层上而施加该定向力。在其它实施例中，通过将摩擦材料通过纳米管织物层的表面来施加该定向力。在其他实施例中，通过在纳米管织物层上运行抛光材料预定时间来施加该定向力。还公开了示例性的滚动，摩擦和抛光装置。

9. 发明申请

US20060113576A1 Sacrificial self-aligned interconnect structure 有权
标题翻译：牺牲自对准互连结构
公开(公告)号：US20060113576A1
公开(公告)日：2006-06-01
申请号：US11329739
申请日：2006-01-11
申请人： Michael Walker , Karl Robinson
发明人： Michael Walker , Karl Robinson
IPC分类号： H01L29/94 , H01L29/00
CPC分类号： H01L21/76895 , H01L21/743 , H01L21/76897 , H01L23/535 , H01L27/10855 , H01L28/60 , H01L2924/0002 , H01L2924/00
摘要： A sacrificial, self-aligned polysilicon interconnect structure is formed in a region of insulating material to the side of an active region location and underlying a semiconductor device of a substrate assembly in order to electrically connect the active region and the semiconductor device. A method for making the interconnect structure maintains a preexisting geometry of the active region during etching of an interconnect structure hole in which the interconnect structure is formed and saves process steps. Under the method, a region of insulating material is formed immediately adjacent the active region location. A nitride layer is formed over the active region and protects the active region while an interconnect structure hole is etched partially into the region of insulating material adjacent the active region location with an etching process that is selective to the nitride layer. The interconnect structure hole is filled with polysilicon, the surface of the substrate assembly is planarized, and the nitride layer is removed.
摘要翻译：牺牲的自对准多晶硅互连结构形成在绝缘材料的区域到有源区位置的侧面并且位于衬底组件的半导体器件的下方，以便电连接有源区域和半导体器件。用于制造互连结构的方法在蚀刻形成互连结构的互连结构孔期间保持有源区的预先存在的几何形状，并且节省了工艺步骤。在该方法下，绝缘材料的区域紧邻有源区位置形成。在有源区上形成氮化物层并保护有源区，同时利用对氮化物层有选择性的蚀刻工艺将互连结构孔部分地蚀刻到与有源区位置相邻的绝缘材料区域内。互连结构孔填充有多晶硅，衬底组件的表面被平坦化，并且氮化物层被去除。

10. 发明授权

US6126989A Copper electroless deposition on a titanium-containing surface 有权
公开(公告)号：US6126989A
公开(公告)日：2000-10-03
申请号：US140701
申请日：1998-08-26
申请人： Karl Robinson , Ted Taylor
发明人： Karl Robinson , Ted Taylor
IPC分类号： C23C18/18 , C23C18/40 , H01L21/288 , H01L21/3205 , H01L21/768 , H01L23/52 , B05D5/12 , H01L21/4763
CPC分类号： H01L21/76838 , H01L21/288 , H01L21/76879 , H01L21/76885 , Y10S438/903 , Y10S438/945 , Y10S438/976
摘要： A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式