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    • 3. 发明授权
    • Side-face incidence type photo detector
    • 侧面入射型光电检测器
    • US06617568B1
    • 2003-09-09
    • US09525837
    • 2000-03-15
    • Kenichi Matsuda
    • Kenichi Matsuda
    • H01L3100
    • H01L31/035281H01L31/109Y02E10/50
    • A photo detector includes: a semiconductor substrate having a first principal face and a second principal face; a photo detection area formed on the first principal face of the semiconductor substrate; a negative electrode electrically connected with the photo detection area; a positive electrode; a beveled face formed at least one edge portion of the first principal face of the semiconductor substrate; and a reflector formed on the second principal face of the semiconductor substrate, wherein incident light from outside of the semiconductor substrate, enters the semiconductor substrate at a side face of the photo detector while being refracted at the beveled face, and thereafter is reflected from the reflector so as to reach the photo detection area.
    • 光电检测器包括:具有第一主面和第二主面的半导体衬底; 形成在所述半导体衬底的所述第一主面上的光检测区域; 与所述光检测区域电连接的负极; 正极; 形成半导体衬底的第一主面的至少一个边缘部分的斜面; 以及形成在半导体衬底的第二主面上的反射器,其中来自半导体衬底的入射光在光电检测器的侧面进入半导体衬底,同时在斜面处被折射,然后从 反射器,以到达光检测区域。
    • 6. 发明授权
    • Electron gun and method of assembling it
    • 电子枪及其组装方法
    • US5574330A
    • 1996-11-12
    • US398807
    • 1995-03-06
    • Kenichi MatsudaTakeshi MeraSatoru Endo
    • Kenichi MatsudaTakeshi MeraSatoru Endo
    • H01J9/18H01J29/48H01J29/70H01J29/46
    • H01J29/485H01J2229/502
    • There is provided an electron gun which has an assembly precision improved by the reduction of deformation of an electrode during assembly as well as good focusing performance due to the elimination of positional deviation of electron beams. There is also provided a method of assembling such an electron gun. The electron gun comprises a composite electrode including at least two electrode elements united together and a plurality of electrodes sequentially arrayed along a single axis at predetermined intervals. In the electron gun, opposed faces of the electrode elements of the composite electrode are perpendicular to the axis and the opposed faces are provided with projections 1a and 1b which serve to constitute the composite electrode when the projections are united together in opposed relationship to each other.
    • 提供了一种电子枪,其具有通过组装期间电极的变形减小以及由于消除电子束的位置偏差而导致良好的聚焦性能而提高的组装精度。 还提供了组装这种电子枪的方法。 电子枪包括复合电极,其包括至少两个电极元件结合在一起,并且多个电极以预定间隔沿着单个轴顺序排列。 在电子枪中,复合电极的电极元件的相对面垂直于轴线,并且相对面设有突起1a和1b,当突起彼此相对关联时,它们用于构成复合电极 。
    • 7. 发明授权
    • Method for producing a surface-emitting laser
    • 表面发射激光器的制造方法
    • US5416044A
    • 1995-05-16
    • US209558
    • 1994-03-11
    • Toyoji ChinoKenichi Matsuda
    • Toyoji ChinoKenichi Matsuda
    • H01S5/183H01L21/20
    • H01S5/1838H01S2301/176H01S5/18341H01S5/18344H01S5/18352H01S5/3095H01S5/423Y10S148/012Y10S148/095
    • A method for producing a surface-emitting laser, includes the steps of: forming a mask pattern to define a top mirror on a semiconductor substrate, the semiconductor substrate having a first semiconductor multilayer formed on the semiconductor substrate, a second semiconductor multilayer formed on the first semiconductor multilayer, and a third semiconductor multilayer formed on the second semiconductor multilayer, the first semiconductor multilayer constituting a bottom mirror, the second semiconductor layer including an upper barrier layer and a lower barrier layer, and an active layer sandwiched between the upper and lower barrier layers, the third semiconductor multilayer constituting a top mirror; forming the top mirror by partially removing the third semiconductor layer by dry etching using the mask pattern as a mask until the surface of the upper barrier layer of the second semiconductor multilayer is exposed; forming an etching protective film at least on the side of the top mirror; partially removing the active layer, the upper barrier layer, and the lower barrier layer by dry etching using the mask pattern and the etching protective film as masks; and partially removing the active layer, the upper barrier layer, and the lower barrier layer by wet etching so that the active layer has an area smaller than that of the top mirror.
    • 一种表面发射激光器的制造方法,包括以下步骤:形成掩模图案,以在半导体衬底上限定顶镜,所述半导体衬底具有形成在所述半导体衬底上的第一半导体多层,形成在所述半导体衬底上的第二半导体多层 第一半导体层叠体和形成在第二半导体层叠体上的第三半导体层叠体,第一半导体层叠体构成底镜,第二半导体层包括上阻挡层和下阻挡层,以及活性层夹在上下 阻挡层,构成上反射镜的第三半导体层; 通过使用掩模图案作为掩模通过干蚀刻部分去除第三半导体层来形成顶镜,直到暴露第二半导体多层的上阻挡层的表面; 至少在上反射镜侧形成蚀刻保护膜; 通过使用掩模图案和蚀刻保护膜作为掩模的干蚀刻部分去除有源层,上阻挡层和下势垒层; 并通过湿蚀刻部分去除有源层,上阻挡层和下势垒层,使得有源层的面积小于上反射镜的面积。
    • 9. 发明授权
    • Optoelectronic memory, logic, and interconnection device including an
optical bistable circuit
    • 包括光学双稳态电路的光电存储器,逻辑和互连装置
    • US5095200A
    • 1992-03-10
    • US640278
    • 1991-01-11
    • Kenichi MatsudaJun Shibata
    • Kenichi MatsudaJun Shibata
    • G06E3/00G11C11/42H03K3/42H03K17/795
    • H03K17/7955G06E3/006G11C11/42H03K3/42
    • An optoelectronic memory, logic, and interconnection device having an optical bistable circuit as an essential element. The optical bistable circuit includes an optical bistable switch which is a light emitting device and a first phototransistor detecting the light emitted from the light emitting device, connected in series, a second phototransistor connected in parallel to the optical bistable switch which does not detect the light emitted from the light emitting device, and a load resistor connected in series to the optical bistable switch. The optoelectronic memory, logic, and interconnection device operates as an optoelectronic memory device turned on and off with the same light source, as an optoelectronic logic device executing exclusive OR operation, or as a light source for reconfigurable optical interconnection.
    • 具有光学双稳态电路作为必需元件的光电存储器,逻辑和互连器件。 光学双稳态电路包括光双稳态开关,其是发光器件和第一光电晶体管,其检测从串联连接的发光器件发射的光,并联连接到不检测光的光学双稳态开关的第二光电晶体管 从发光器件发射的负载电阻器和与光学双稳态开关串联连接的负载电阻器。 光电存储器,逻辑器件和互连器件作为光电存储器件工作,作为与执行异或运算的光电逻辑器件相同的光源,或作为用于可重构光互连的光源而导通和截止的光电存储器件。