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    • 2. 发明授权
    • Vertical zener-triggered SCR structure for ESD protection in integrated circuits
    • 用于集成电路中ESD保护的垂直齐纳触发SCR结构
    • US06493199B1
    • 2002-12-10
    • US09697928
    • 2000-10-26
    • Kung-Yen SuChun-Mai LiuWei-Fan Chen
    • Kung-Yen SuChun-Mai LiuWei-Fan Chen
    • H02H900
    • H01L27/0262H01L29/87
    • A silicon controlled rectifier (SCR) serving as an electrostatic discharge (ESD) protection device having a vertical zener junction for triggering breakdown. The SCR includes a p-doped substrate having an n-doped well, spaced-apart p+ and n+ doped regions for cathode connection formed within the n-doped well, and spaced-apart p+ and n+ doped regions for anode connection formed with the p-substrate external to the n-doped well. The SCR further includes a vertical zener junction situated between the anode n+ doped region and the n-well. The vertical zener junction has a p+ doped region sandwiched between two n+ doped regions. The n+ doped region of the vertical zener junction closest to the n-well may extend at least partially within the n-well, or be totally outside of the n-well. The SCR may further include respective field oxides between the anode p+ and n+ doped regions, between the anode n+ doped region and the vertical zener junction, and between the vertical zener junction and the n-doped well. Also provided is an n-doped substrate version of the SCR. The SCR with the vertical zener junction is characterized as having a relatively low breakdown voltage, having improved current handling capability for more reliable and robust operations, and having a breakdown voltage dependent on the doping concentration of the lighter doped p+ or n+ doped region of the vertical zener junction.
    • 用作静电放电(ESD)保护装置的可控硅整流器(SCR),具有用于触发击穿的垂直齐纳结。 SCR包括具有n掺杂阱的p掺杂衬底,用于阴极连接的间隔开的p +和n +掺杂区域,形成在n掺杂阱内,并且间隔开的p +和n +掺杂区域用于与p形成的阳极连接 在n-掺杂阱外部的衬底。 SCR还包括位于阳极n +掺杂区域和n-阱之间的垂直齐纳点。 垂直齐纳结具有夹在两个n +掺杂区之间的p +掺杂区。 最靠近n-阱的垂直齐纳点的n +掺杂区域可以至少部分地在n阱内延伸,或者完全在n阱之外。 SCR可以进一步包括在阳极p +和n +掺杂区域之间,阳极n +掺杂区域和垂直齐纳结之间以及垂直齐纳结和n掺杂阱之间的相应场氧化物。 还提供了SCR的n掺杂衬底版本。 具有垂直齐纳结的SCR具有相对较低的击穿电压,具有改进的电流处理能力,用于更可靠和鲁棒的操作,并且具有取决于较轻掺杂的p +或n +掺杂区域的掺杂浓度的击穿电压 垂直齐纳结。
    • 3. 发明申请
    • ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE
    • 静电放电保护结构
    • US20090309182A1
    • 2009-12-17
    • US12140195
    • 2008-06-16
    • Kung-Yen SuYaw Wen HuBomy ChenKevin Gene-Wah Jew
    • Kung-Yen SuYaw Wen HuBomy ChenKevin Gene-Wah Jew
    • H01L23/62
    • H01L27/0259
    • A first embodiment of an Electrostatic Discharge (ESD) structure for an integrated circuit for protecting the integrated circuit from an ESD signal, has a substrate of a first conductivity type. The substrate has a top surface. A first region of a second conductivity type is near the top surface and receives the ESD signal. A second region of the second conductivity type is in the substrate, separated and spaced apart from the first region in a substantially vertical direction. A third region of the first conductivity type, heavier in concentration than the substrate, is immediately adjacent to and in contact with the second region, substantially beneath the second region. In a second embodiment, a well of a second conductivity type is provided in the substrate of the first conductivity type. The well has a top surface. A first region of the second conductivity type is near the top surface. A second region of the second conductivity type is in the well, substantially along the bottom of the well. A third region of the first conductivity type, is immediately adjacent to and in contact with the second region, substantially beneath the second region. A fourth region of the first conductivity type is in the well, along the top surface thereof, and spaced apart from the first region. The first region and the fourth region receive the ESD signal.
    • 用于保护集成电路免受ESD信号的集成电路的静电放电(ESD)结构的第一实施例具有第一导电类型的衬底。 衬底具有顶表面。 第二导电类型的第一区域靠近顶表面并接收ESD信号。 第二导电类型的第二区域在基板中,在基本上垂直的方向上与第一区域分离并间隔开。 第一导电类型的第三区域,其浓度比衬底更重,与第二区域紧邻并与第二区域接触,基本上在第二区域下方。 在第二实施例中,在第一导电类型的衬底中提供第二导电类型的阱。 井有顶面。 第二导电类型的第一区域靠近顶表面。 第二导电类型的第二区域在井中,基本上沿着井的底部。 第一导电类型的第三区域紧邻第二区域并与第二区域接触,基本上在第二区域下方。 第一导电类型的第四区域沿着其顶表面位于阱中并与第一区域间隔开。 第一区域和第四区域接收ESD信号。