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    • 4. 发明授权
    • Vertical zener-triggered SCR structure for ESD protection in integrated circuits
    • 用于集成电路中ESD保护的垂直齐纳触发SCR结构
    • US06493199B1
    • 2002-12-10
    • US09697928
    • 2000-10-26
    • Kung-Yen SuChun-Mai LiuWei-Fan Chen
    • Kung-Yen SuChun-Mai LiuWei-Fan Chen
    • H02H900
    • H01L27/0262H01L29/87
    • A silicon controlled rectifier (SCR) serving as an electrostatic discharge (ESD) protection device having a vertical zener junction for triggering breakdown. The SCR includes a p-doped substrate having an n-doped well, spaced-apart p+ and n+ doped regions for cathode connection formed within the n-doped well, and spaced-apart p+ and n+ doped regions for anode connection formed with the p-substrate external to the n-doped well. The SCR further includes a vertical zener junction situated between the anode n+ doped region and the n-well. The vertical zener junction has a p+ doped region sandwiched between two n+ doped regions. The n+ doped region of the vertical zener junction closest to the n-well may extend at least partially within the n-well, or be totally outside of the n-well. The SCR may further include respective field oxides between the anode p+ and n+ doped regions, between the anode n+ doped region and the vertical zener junction, and between the vertical zener junction and the n-doped well. Also provided is an n-doped substrate version of the SCR. The SCR with the vertical zener junction is characterized as having a relatively low breakdown voltage, having improved current handling capability for more reliable and robust operations, and having a breakdown voltage dependent on the doping concentration of the lighter doped p+ or n+ doped region of the vertical zener junction.
    • 用作静电放电(ESD)保护装置的可控硅整流器(SCR),具有用于触发击穿的垂直齐纳结。 SCR包括具有n掺杂阱的p掺杂衬底,用于阴极连接的间隔开的p +和n +掺杂区域,形成在n掺杂阱内,并且间隔开的p +和n +掺杂区域用于与p形成的阳极连接 在n-掺杂阱外部的衬底。 SCR还包括位于阳极n +掺杂区域和n-阱之间的垂直齐纳点。 垂直齐纳结具有夹在两个n +掺杂区之间的p +掺杂区。 最靠近n-阱的垂直齐纳点的n +掺杂区域可以至少部分地在n阱内延伸,或者完全在n阱之外。 SCR可以进一步包括在阳极p +和n +掺杂区域之间,阳极n +掺杂区域和垂直齐纳结之间以及垂直齐纳结和n掺杂阱之间的相应场氧化物。 还提供了SCR的n掺杂衬底版本。 具有垂直齐纳结的SCR具有相对较低的击穿电压,具有改进的电流处理能力,用于更可靠和鲁棒的操作,并且具有取决于较轻掺杂的p +或n +掺杂区域的掺杂浓度的击穿电压 垂直齐纳结。
    • 5. 发明授权
    • Memory array architectures based on a triple-polysilicon source-side injection non-volatile memory cell
    • 基于三重多晶硅源侧注入非易失性存储单元的存储器阵列架构
    • US06563733B2
    • 2003-05-13
    • US09866537
    • 2001-05-24
    • Chun-Mai LiuAlbert KordeschMing-Bing Chang
    • Chun-Mai LiuAlbert KordeschMing-Bing Chang
    • G11C1604
    • H01L29/511G11C16/0425H01L27/115H01L29/42328H01L29/7885
    • A semiconductor memory includes a plurality of memory cells arranged along rows and columns, each cell having a floating gate, a drain region, a source region, a program gate terminal, and a select gate terminal. The program gate terminals of the cells along each row of cells are connected together forming a continuous program gate line. The select gate terminals of the cells along each row of cells are connected together forming a continuous select gate line. The source regions of the cells along each row of cells are connected together forming a continuous source line. The cells along each column are divided into a predesignated number of groups, and the drain regions of the cells in each group are connected to a local bitline extending across the cells in the group of cells. A global bitline extends along every two columns of cells, and is configured to selectively provide electrical connection to the local bitlines along the corresponding two columns of cells. The floating gate of each cell is from a first layer polysilicon, the program gate lines are from a second polysilicon layer, the select gate lines are from a third polysilicon layer, and the source lines are diffusion lines.
    • 半导体存储器包括沿行和列布置的多个存储单元,每个单元具有浮置栅极,漏极区域,源极区域,程序栅极端子和选择栅极端子。 沿着每行单元的单元的程序栅极端子连接在一起形成连续的程序栅极线。 沿着每行单元的单元的选择栅极端子连接在一起形成连续的选择栅极线。 沿着每行单元格的单元格的源区域连接在一起形成连续的源极线。 沿着每列的单元被分成预定数量的组,并且每个组中的单元的漏极区域连接到跨越单元组中的单元格延伸的局部位线。 全局位线沿着每两列单元格延伸,并且被配置为选择性地提供沿着相应的两列单元格的本地位线的电连接。 每个单元的浮置栅极来自第一层多晶硅,编程栅极线来自第二多晶硅层,选择栅极线来自第三多晶硅层,源极线是扩散线。