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    • 5. 发明授权
    • Planarized microelectronic substrates
    • 平面微电子基板
    • US07771779B2
    • 2010-08-10
    • US10494240
    • 2002-11-06
    • Kenneth L. FosterMichael J. Radler
    • Kenneth L. FosterMichael J. Radler
    • C23C18/00
    • H01B3/306C08G61/10H01B3/30H01B3/441H05K3/28H05K3/4626H05K3/4676H05K2203/0759H05K2203/1105H05K2203/1476
    • The instant invention is a process for planarizing a microelectronic substrate with a cross-linked polymer dielectric layer, comprising the steps of: (a) heating such a substrate coated with a layer comprising an uncured cross-linkable polymer and a glass transition suppression modifier to a temperature greater than the glass transition temperature of the layer, the temperature being less than the curing temperature of the uncured cross-linkable polymer to form a substrate coated with a heat flowed layer; and (b) heating the substrate coated with the heat flowed layer to a curing temperature of the uncured cross-linkable polymer of the heated layer to cure the uncured cross-linkable polymer to form a planarized substrate wherein the percent planarization at 100 micrometers is greater than fifty percent. The instant invention is a microelectronic device made using the above-described process. The instant invention is a composition of matter, comprising: an essentially solvent free composition comprising an uncured cross-linkable polymer and a glass transition suppression modifier, the composition having a glass transition temperature sufficiently less than the curing temperature of the uncured composition so that if the uncured composition is heated to a temperature above its glass transition temperature but below its curing temperature, the uncured composition will flow.
    • 本发明是一种用交联聚合物电介质层平坦化微电子衬底的方法,包括以下步骤:(a)加热涂覆有包含未固化的可交联聚合物和玻璃化转变抑制改性剂的层的基材 温度大于该层的玻璃化转变温度,该温度小于未固化的可交联聚合物的固化温度,以形成涂有热流层的基材; 和(b)将涂覆有热流层的基材加热到加热层的未固化的可交联聚合物的固化温度以固化未固化的可交联聚合物以形成平面化的基材,其中在100微米处的平均化百分比更大 超过百分之五十。 本发明是使用上述方法制造的微电子器件。 本发明是一种物质组合物,其包含:基本上无溶剂的组合物,其包含未固化的可交联聚合物和玻璃化转变抑制改性剂,所述组合物的玻璃化转变温度足够小于未固化组合物的固化温度, 将未固化的组合物加热到高于其玻璃化转变温度但低于其固化温度的温度,未固化的组合物将流动。