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1. 发明授权

US10351461B2 Method for dividing brittle substrate 有权
公开(公告)号：US10351461B2
公开(公告)日：2019-07-16
申请号：US15312686
申请日：2015-03-31
申请人： Mitsuboshi Diamond Industrial Co., Ltd.
发明人： Hiroshi Soyama
IPC分类号： C03B33/033 , C03B33/037 , B28D5/00 , B28D1/22 , C03B33/023
摘要： A cutter edge is caused to slide to generate a plastic deformation on a first surface of a brittle substrate, thus forming a trench line. The trench line is formed so as to obtain a crack-free state in which the brittle substrate seamlessly continues in a direction intersecting the trench line directly below the trench line. The crack-free state is then maintained. A crack of the brittle substrate in its thickness direction is extended along the trench line to form a crack line. The brittle substrate is divided along the crack line.

2. 发明申请

US20170256903A1 OPTICAL FIBER DEVICE 有权
公开(公告)号：US20170256903A1
公开(公告)日：2017-09-07
申请号：US15506248
申请日：2015-07-24
申请人： Mitsuboshi Diamond Industrial Co., LTD. , OSAKA UNIVERSITY
发明人： Masanao MURAKAMI , Christian SCHAEFER , Satoshi HATTORI , Takahisa HAYASHI , Seiji SHIMIZU , Shigeki TOKITA
IPC分类号： H01S3/04 , H01S3/094 , H01S3/0941 , H01S3/067 , H01S3/08
CPC分类号： H01S3/094019 , H01S3/0405 , H01S3/042 , H01S3/067 , H01S3/06704 , H01S3/06733 , H01S3/07 , H01S3/0804 , H01S3/094007 , H01S3/094053 , H01S3/0941 , H01S3/09415 , H01S3/1608 , H01S3/173
摘要： In an optical fiber device having a configuration in which an optical fiber is joined to a side surface of another optical fiber, a joint portion is suppressed from reaching a high temperature. The optical fiber device includes a first fluoride fiber, a second fluoride fiber, and a heat dissipation member. The first fluoride fiber guides light. The second fluoride fiber has a first end on or from which light is incident or output and a second end at which an end surface of the second fluoride fiber is obliquely joined to a side surface of the first fluoride fiber.

3. 发明授权

US09425577B2 Optical fiber and laser oscillator using same 有权
标题翻译：光纤和激光振荡器使用相同
公开(公告)号：US09425577B2
公开(公告)日：2016-08-23
申请号：US14774135
申请日：2014-03-20
申请人： Mitsuboshi Diamond Industrial Co., LTD.
发明人： Christian Schaefer , Masanao Murakami
IPC分类号： H01S3/042 , H01S3/067 , H01S3/091 , H01S3/16 , H01S3/17 , H01S3/00 , H01S3/04
CPC分类号： H01S3/042 , H01S3/005 , H01S3/0071 , H01S3/0405 , H01S3/0407 , H01S3/06704 , H01S3/06708 , H01S3/06716 , H01S3/06745 , H01S3/06754 , H01S3/091 , H01S3/1608 , H01S3/173
摘要： An optical fiber includes a first optical fiber body, a second optical fiber body and a first end cap. The first optical fiber body includes a first core and a first cladding. The second optical fiber body includes a second core and a second cladding, and is joined at a first end surface thereof to a first end surface of the first optical fiber body. The first end cap has light permeability and is joined to a second end surface of the second optical fiber body. The first core is doped with a laser medium. A mass content of the laser medium in the second core is lower than that of the laser medium in the first core.
摘要翻译：光纤包括第一光纤体，第二光纤体和第一端盖。第一光纤体包括第一芯和第一包层。第二光纤体包括第二芯和第二包层，并且在其第一端面处连接到第一光纤体的第一端面。第一端盖具有透光性并且连接到第二光纤体的第二端面。第一芯掺杂有激光介质。第二芯中的激光介质的质量含量低于第一芯中的激光介质的质量含量。

4. 发明申请

US20150273730A1 MACHINING HEAD AND GROOVE MACHINING APPARATUS 审中-公开
标题翻译：加工头和机床加工设备
公开(公告)号：US20150273730A1
公开(公告)日：2015-10-01
申请号：US14663894
申请日：2015-03-20
申请人： MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
发明人： Naoki KATAGIRI
IPC分类号： B28D5/00 , H01L31/18 , B26D3/06
CPC分类号： B28D5/00 , B26D3/06 , H01L31/18 , Y10T83/0304
摘要： A first head unit 31A has a tool holder 44 movably in a z axis direction on a base 42 through a linear guide 43. Similarly, a second head unit 31B has a tool holder 48 movably in the z axis direction on a base 46 through a linear guide 47. The interval Wa2 in an x axis direction between the tool and the linear guide of the head unit 31A and the interval Wb2 in the x axis direction between the tool and the linear guide of the head unit 31B are different from each other. When alternately arranging the head units 31A and 31B, displacing the positions of the linear guides 43 and 47 from each other to prevent interference makes it possible to narrow a pitch between the head units.
摘要翻译：第一头单元31A具有通过线性引导件43在基座42上沿z轴方向可移动的工具保持器44.类似地，第二头单元31B具有工具保持器48，其在z轴方向上在基部46上通过线性工具与头单元31A的直线引导件之间的x轴方向上的间隔Wa2与头单元31B的直线引导件之间的x轴方向上的间隔Wb2彼此不同。当交替地布置头单元31A和31B时，使线性引导件43和47的位置彼此偏移以防止干扰，使得可以缩小头单元之间的间距。

5. 发明申请

US20170044046A1 METHOD FOR FUSING GLASS SUBSTRATES USING LASER BEAM AND LASER PROCESSING APPARATUS 审中-公开
标题翻译：使用激光束和激光加工装置熔化玻璃基板的方法
公开(公告)号：US20170044046A1
公开(公告)日：2017-02-16
申请号：US15307379
申请日：2015-04-17
申请人： MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
发明人： Yuhan MIYAZAKI , Tokutake SASHIMA , Koji YAMAMOTO , Seiji SHIMIZU
IPC分类号： C03B23/203 , B23K26/082 , B23K26/324
CPC分类号： C03B23/203 , B23K26/00 , B23K26/082 , B23K26/21 , B23K26/324 , B23K2103/54
摘要： Two glass substrates are fused using a simple method and a simple apparatus configuration without deformation of processed end surfaces. This method for fusing glass substrates is a method in which two glass substrates in close contact are irradiated with a laser beam and fused together, and includes a first step and a second step. In the first step, a first glass substrate and a second glass substrate are brought into close contact. In the second step, the first glass substrate and the second glass substrate are melted and fused together by scanning a laser beam having a wavelength of 2.7 μm or more and 6.0 μm or less along a portion where the first and second glass substrates are in close contact.
摘要翻译：使用简单的方法和简单的装置配置熔化两个玻璃基板，而不会使加工的端面变形。用于熔融玻璃基板的方法是将两个紧密接触的玻璃基板用激光束照射并熔合在一起的方法，并且包括第一步骤和第二步骤。在第一步骤中，使第一玻璃基板和第二玻璃基板紧密接触。在第二步骤中，第一玻璃基板和第二玻璃基板通过沿着第一和第二玻璃基板接近的部分扫描波长为2.7μm以上且6.0μm以下的激光的方式熔融并熔合在一起联系。

6. 发明申请

US20140353296A1 SUBSTRATE CUTTING DEVICE USING LASER BEAM 审中-公开
标题翻译：使用激光束的基板切割装置
公开(公告)号：US20140353296A1
公开(公告)日：2014-12-04
申请号：US14258856
申请日：2014-04-22
申请人： Mitsuboshi Diamond Industrial Co., LTD.
发明人： Kenji FUKUHARA
IPC分类号： B23K26/38 , B23K26/06 , B23K26/40
CPC分类号： B23K26/06 , B23K26/082 , B23K26/38 , B23K26/382 , B23K26/40 , B23K2103/30 , B23K2103/50 , B23K2103/52
摘要： It is intended to enable a substrate made of a thick plate material with a high laser beam absorption rate to be easily processed by means of boring or so forth in a short time. The present device includes a work table (2) on which a substrate is disposed, a laser beam output section (15), a rotation unit, a beam focusing unit and a scan unit. The laser beam output section (15) is configured to output a laser beam, having a wavelength with an absorption rate of 50% or greater, onto the substrate. The rotation unit is configured to rotate the laser beam emitted from the laser beam output section (15) with a predetermined rotation radius. The beam focusing unit is configured to focus the laser beam from the rotating unit onto a depth position included within the substrate, the depth position is located closer to one substrate surface disposed on a laser beam irradiation side than to the other substrate surface. The scan unit is configured to scan the focused and rotated laser beam along a processing line, and is also configured to repeatedly execute the scanning so as to process the substrate.
摘要翻译：旨在使得由具有高激光束吸收速率的厚板材制成的基板能够在短时间内容易地通过镗孔等进行加工。本装置包括其上设置有基板的工作台（2），激光束输出部（15），旋转单元，光束聚焦单元和扫描单元。激光束输出部（15）被配置为将具有50％以上的吸收率的波长的激光束输出到基板上。旋转单元被配置为以预定的旋转半径旋转从激光束输出部（15）发射的激光束。光束聚焦单元被配置为将来自旋转单元的激光束聚焦到包括在基板内的深度位置，深度位置更靠近设置在激光束照射侧上的一个基板表面而不是另一个基板表面。扫描单元被配置为沿着处理线扫描聚焦和旋转的激光束，并且还被配置为重复地执行扫描以处理基板。

7. 发明授权

US10927031B2 Method for dividing brittle-material substrate 有权
公开(公告)号：US10927031B2
公开(公告)日：2021-02-23
申请号：US15127052
申请日：2015-03-12
申请人： Mitsuboshi Diamond Industrial Co., Ltd.
发明人： Hiroshi Soyama
IPC分类号： C03B33/10 , B28D1/22 , B28D5/00
摘要： A cutter edge is pressed against a brittle-material substrate so that a protruding portion of the cutter edge is positioned between a first edge of the brittle-material substrate and a side portion of the cutter edge and that a side portion of the cutter edge is positioned between the protruding portion of the cutter edge and a second edge of the brittle-material substrate. A scribe line is formed by a scratch between a first position closer to the first edge of the first and second edges and a second position closer to the second edge of the first and second edges. After the formation of the scribe line, a crack is extended in a thickness direction from the second position toward the first position along the scribe line, thus forming a crack line.

8. 发明申请

US20200381302A1 METHOD OF SEGMENTING SUBSTRATE WITH METAL FILM 审中-公开
公开(公告)号：US20200381302A1
公开(公告)日：2020-12-03
申请号：US16758068
申请日：2018-10-16
申请人： Mitsuboshi Diamond Industrial Co., Ltd.
发明人： Kenji MURAKAMI
IPC分类号： H01L21/78 , H01L21/04 , H01L21/304
摘要： A method that is capable of preferably segmenting a substrate with a metal film. A method of segmenting a substrate with a metal film includes steps of: scribing a predetermined segment position in a first main surface on which a metal film is provided to form a scribe line and segmenting the metal film, and extending a vertical crack along the predetermined segment position toward an inner side of the substrate; and making a breaking bar have direct contact with the substrate with the metal film from a side of a second main surface on which the metal film is not provided to further extend the vertical crack, thereby segmenting the substrate with the metal film in the predetermined segment position.

9. 发明申请

US20170183250A1 METHOD FOR DIVIDING BRITTLE SUBSTRATE 审中-公开
公开(公告)号：US20170183250A1
公开(公告)日：2017-06-29
申请号：US15312686
申请日：2015-03-31
申请人： Mitsuboshi Diamond Industrial Co., Ltd.
发明人： Hiroshi SOYAMA
IPC分类号： C03B33/033 , C03B33/023 , B28D1/22
CPC分类号： C03B33/033 , B28D1/225 , B28D5/00 , B28D5/0011 , C03B33/023 , C03B33/037 , Y10T225/12 , Y10T225/325
摘要： A cutter edge is caused to slide to generate a plastic deformation on a first surface of a brittle substrate, thus forming a trench line. The trench line is formed so as to obtain a crack-free state in which the brittle substrate seamlessly continues in a direction intersecting the trench line directly below the trench line. The crack-free state is then maintained. A crack of the brittle substrate in its thickness direction is extended along the trench line to form a crack line. The brittle substrate is divided along the crack line.

10. 发明申请

US20170113960A1 METHOD FOR DIVIDING BRITTLE-MATERIAL SUBSTRATE 审中-公开
公开(公告)号：US20170113960A1
公开(公告)日：2017-04-27
申请号：US15127052
申请日：2015-03-12
申请人： Mitsuboshi Diamond Industrial Co., Ltd.
发明人： Hiroshi SOYAMA
IPC分类号： C03B33/10 , B28D1/22 , B28D5/00
CPC分类号： C03B33/105 , B28D1/225 , B28D5/0011
摘要： A cutter edge is pressed against a brittle-material substrate so that a protruding portion of the cutter edge is positioned between a first edge of the brittle-material substrate and a side portion of the cutter edge and that a side portion of the cutter edge is positioned between the protruding portion of the cutter edge and a second edge of the brittle-material substrate. A scribe line is formed by a scratch between a first position closer to the first edge of the first and second edges and a second position closer to the second edge of the first and second edges. After the formation of the scribe line, a crack is extended in a thickness direction from the second position toward the first position along the scribe line, thus forming a crack line.

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