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    • 2. 发明授权
    • Method of optimizing design for manufacturing (DFM)
    • 优化制造设计(DFM)的方法
    • US08793638B2
    • 2014-07-29
    • US13559081
    • 2012-07-26
    • Keuing HuiYen-Wei ChengYen-Di TsenJong-I MouChin-Hsiang Lin
    • Keuing HuiYen-Wei ChengYen-Di TsenJong-I MouChin-Hsiang Lin
    • G06F17/50
    • G06F17/5068G06F2217/12Y02P90/265
    • The present disclosure describes a method of optimizing a design for manufacture (DFM) simulation. The method includes receiving an integrated circuit (IC) design data having a feature, receiving a process data having a parameter or a plurality of parameters, performing the DFM simulation, and optimizing the DFM simulation. The performing the DFM simulation includes generating a simulation output data using the IC design data and the process data. The optimizing the DFM simulation includes generating a performance index of the parameter or the plurality of parameters by the DFM simulation. The optimizing the DFM simulation includes adjusting the parameter or the plurality of parameters at outer loop, middle loop, and the inner loop. The optimizing the DFM simulation also includes locating a nadir of the performance index of the parameter or the plurality of parameters over a range of the parameter or the plurality of parameters.
    • 本公开描述了优化用于制造(DFM)仿真的设计的方法。 该方法包括接收具有特征的集成电路(IC)设计数据,接收具有参数或多个参数的处理数据,执行DFM仿真和优化DFM仿真。 执行DFM模拟包括使用IC设计数据和过程数据生成模拟输出数据。 优化DFM模拟包括通过DFM仿真生成参数或多个参数的性能指标。 优化DFM模拟包括调整外循环,中间循环和内循环的参数或多个参数。 优化DFM模拟还包括在参数或多个参数的范围内定位参数或多个参数的性能指标的最低点。
    • 3. 发明授权
    • Two-dimensional multi-products multi-tools advanced process control
    • 二维多产品多工具高级过程控制
    • US08406904B2
    • 2013-03-26
    • US13033413
    • 2011-02-23
    • Chih-Wei HsuYen-Di TsenJong-I Mou
    • Chih-Wei HsuYen-Di TsenJong-I Mou
    • G05B13/02G06F19/00
    • G05B19/41865G05B2219/32135G05B2219/32267G05B2219/45031Y02P90/20Y02P90/265
    • The present disclosure provides a method. The method includes gathering advanced process control (APC) data from a subset of available wafers and a subset of available processing chambers. The method includes establishing a matrix that contains a plurality of cells. The cells each correspond to one of the available wafers and one of the available processing chambers. The matrix is partially filled by populating cells for which the APC data has been gathered. The method includes determining a plurality of chamber-coverage-rate (CCR) parameters associated with the matrix. The method includes optimizing the CCR parameters through an iteration process to obtain optimized CCR parameters. The method includes predicting an APC data value for a designated cell of the matrix based on the optimized CCR parameters. The designated cell is an empty cell before the predicting and is populated by the predicting.
    • 本公开提供了一种方法。 该方法包括从可用晶片的子集和可用处理室的子集中收集先进的过程控制(APC)数据。 该方法包括建立包含多个单元的矩阵。 每个单元对应于可用晶片之一和可用处理室之一。 通过填充已经收集了APC数据的单元格来部分填充矩阵。 该方法包括确定与矩阵相关联的多个腔室覆盖率(CCR)参数。 该方法包括通过迭代过程优化CCR参数以获得优化的CCR参数。 该方法包括基于优化的CCR参数预测矩阵的指定小区的APC数据值。 指定的单元格是在预测之前的空单元格,并由预测填充。
    • 5. 发明授权
    • Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processes
    • 自动检测半导体晶片制造工艺的故障模式的系统和方法
    • US08627251B2
    • 2014-01-07
    • US13455186
    • 2012-04-25
    • Jui-Long ChenHui-Yun ChaoYen-Di TsenJong-I Mou
    • Jui-Long ChenHui-Yun ChaoYen-Di TsenJong-I Mou
    • G06F17/50
    • H01L22/20H01L22/10H01L22/12H01L22/14H01L2924/0002Y10T29/41H01L2924/00
    • A system and method of automatically detecting failure patterns for a semiconductor wafer process is provided. The method includes receiving a test data set collected from testing a plurality of semiconductor wafers, forming a respective wafer map for each of the wafers, determining whether each respective wafer map comprises one or more respective objects, selecting the wafer maps that are determined to comprise one or more respective objects, selecting one or more object indices for selecting a respective object in each respective selected wafer map, determining a plurality of object index values in each respective selected wafer map, selecting an object in each respective selected wafer map, determining a respective feature in each of the respective selected wafer, classifying a respective pattern for each of the respective selected wafer maps and using the respective wafer fingerprints to adjust one or more parameters of the semiconductor fabrication process.
    • 提供了一种自动检测半导体晶片工艺的故障模式的系统和方法。 该方法包括接收从测试多个半导体晶片收集的测试数据集,为每个晶片形成相应的晶片图,确定每个相应的晶片图是否包括一个或多个相应的对象,选择被确定为包括的晶片图 一个或多个相应的对象,选择一个或多个对象索引,用于在每个相应的选定的晶片图中选择相应的对象,确定每个相应选择的晶片图中的多个对象索引值,在每个相应选定的晶片图中选择一个对象, 各个所选晶片中的每一个的相应特征,对各个所选晶片图中的每一个分类各自的图案,并使用相应的晶片指纹来调整半导体制造工艺的一个或多个参数。
    • 8. 发明申请
    • Method of Optimizing Design for Manufacturing (DFM)
    • 优化制造设计的方法(DFM)
    • US20140033159A1
    • 2014-01-30
    • US13559081
    • 2012-07-26
    • Keuing HuiYen-Wei ChengYen-Di TsenJong-I MouChin-Hsiang Lin
    • Keuing HuiYen-Wei ChengYen-Di TsenJong-I MouChin-Hsiang Lin
    • G06F17/50
    • G06F17/5068G06F2217/12Y02P90/265
    • The present disclosure describes a method of optimizing a design for manufacture (DFM) simulation. The method includes receiving an integrated circuit (IC) design data having a feature, receiving a process data having a parameter or a plurality of parameters, performing the DFM simulation, and optimizing the DFM simulation. The performing the DFM simulation includes generating a simulation output data using the IC design data and the process data. The optimizing the DFM simulation includes generating a performance index of the parameter or the plurality of parameters by the DFM simulation. The optimizing the DFM simulation includes adjusting the parameter or the plurality of parameters at outer loop, middle loop, and the inner loop. The optimizing the DFM simulation also includes locating a nadir of the performance index of the parameter or the plurality of parameters over a range of the parameter or the plurality of parameters.
    • 本公开描述了优化用于制造(DFM)仿真的设计的方法。 该方法包括接收具有特征的集成电路(IC)设计数据,接收具有参数或多个参数的处理数据,执行DFM仿真和优化DFM仿真。 执行DFM模拟包括使用IC设计数据和过程数据生成模拟输出数据。 优化DFM模拟包括通过DFM仿真生成参数或多个参数的性能指标。 优化DFM模拟包括调整外循环,中间循环和内循环的参数或多个参数。 优化DFM模拟还包括在参数或多个参数的范围内定位参数或多个参数的性能指标的最低点。