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    • 2. 发明授权
    • Schottky device
    • 肖特基装置
    • US08766395B2
    • 2014-07-01
    • US13258720
    • 2010-03-25
    • Steven Konsek
    • Steven Konsek
    • H01L29/47
    • H01L29/872H01L29/0665H01L29/0673H01L29/0676H01L29/66143
    • A device includes a Schottky barrier formed by a metal-semiconductor junction between a semiconductor nanowire and a metal contact. The metal contact at least partly encloses a circumferential area of each nanowire along the length thereof. The nanowire includes a low doped region that is part of the metal-semiconductor junction. The device can be fabricated using a method where two different growth modes are used, the first step including axial growth from a substrate giving a suitable template for formation of the metal-semiconductor junction, and the second step including radial growth enabling control of the doping levels in the low doped region.
    • 一种器件包括由半导体纳米线和金属接触之间的金属 - 半导体结形成的肖特基势垒。 金属接触部沿着其长度至少部分地包围每个纳米线的周向区域。 纳米线包括作为金属 - 半导体结的一部分的低掺杂区域。 该器件可以使用其中使用两种不同的生长模式的方法制造,第一步包括从衬底轴向生长,给出用于形成金属 - 半导体结的合适的模板,并且第二步骤包括使径向生长能够控制掺杂 低掺杂区域的电平。
    • 3. 发明申请
    • SCHOTTKY DEVICE
    • 肖特设备
    • US20120012968A1
    • 2012-01-19
    • US13258720
    • 2010-03-25
    • Steven Konsek
    • Steven Konsek
    • H01L29/872H01L21/329B82Y99/00
    • H01L29/872H01L29/0665H01L29/0673H01L29/0676H01L29/66143
    • A device according to the invention comprises a Schottky barrier formed by a metal-semiconductor junction between a semiconductor nanowire (1) and a metal contact (5). The metal contact (5) at least partly encloses a circumferential area of each nanowire (1) along the length thereof. The nanowire (2) comprises a lowly doped region that is part of the metal-semiconductor junction. This lowly doped region can be formed by a nanowire segment, by the entire nanowire or in a core-shell configuration with a highly doped nanowire core (3) and the lowly doped region comprised in a shell (4). The device can be fabricated using a method according to the invention, where two different growth modes are used, the first comprising axial growth from a substrate (2) giving a suitable template for formation of the metal-semiconductor junction and the second step comprising radial growth enabling control of the doping levels in the lowly doped region.
    • 根据本发明的器件包括由半导体纳米线(1)和金属接触(5)之间的金属 - 半导体结形成的肖特基势垒。 金属接触件(5)沿其长度至少部分地包围每个纳米线(1)的周向区域。 纳米线(2)包括作为金属 - 半导体结的一部分的低掺杂区域。 该低掺杂区域可以由纳米线段,整个纳米线或具有高度掺杂的纳米线芯(3)的芯 - 壳配置和包含在壳(4)中的低掺杂区)形成。 该装置可以使用根据本发明的方法制造,其中使用两种不同的生长模式,第一种方法包括从衬底(2)的轴向生长,给出用于形成金属 - 半导体结的合适的模板,并且第二步骤包括径向 生长能够控制低掺杂区域中的掺杂水平。