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    • 2. 发明申请
    • III-NITRIDE LIGHT-EMITTING DEVICES WITH IMPROVED HIGH-CURRENT EFFICIENCY
    • 具有改善的高效率的III-NITRIDE发光装置
    • US20050167690A1
    • 2005-08-04
    • US10769590
    • 2004-01-30
    • Nathan GardnerChristopher KocotStephen Stockman
    • Nathan GardnerChristopher KocotStephen Stockman
    • H01L33/00H01L33/32H01L29/24
    • H01L33/32
    • A light-emitting semiconductor device comprises a III-Nitride active region and a III-Nitride layer formed proximate to the active region and having a thickness that exceeds a critical thickness for relaxation of strain in the III-Nitride layer. The III-Nitride layer may be a carrier confinement layer, for example. In another aspect of the invention, a light-emitting semiconductor device comprises a III-Nitride light emitting layer, an InxAlyGa1-x-yN (0≦x≦1, 0≦y≦1, x+y≦1), and a spacer layer interposing the light emitting layer and the InxAlyGa1-x-yN layer. The spacer layer may advantageously space the InxAlyGa1-x-yN layer and any contaminants therein apart from the light emitting layer. The composition of the III-Nitride layer may be advantageously selected to determine a strength of an electric field in the III-Nitride layer and thereby increase the efficiency with which the device emits light.
    • 发光半导体器件包括在有源区附近形成的III-氮化物有源区和III-氮化物层,其厚度超过III-氮化物层中的应变松弛的临界厚度。 例如,III-氮化物层可以是载流子限制层。 在本发明的另一方面中,一种发光半导体器件包括III族氮化物发光层,In-Al 2 O 3,Ga 1-xy, SUB> N(0 <= x <= 1,0,0 <= y <= 1,x + y <= 1),以及插入发光层和In < 1&lt; 1&gt; Ga 1-xy N层。 间隔层可以有利地将In和/或Al 2 Y 1 Ga 1-x-y N N层及其中的任何污染物与发光层隔开。 可以有利地选择III-氮化物层的组成以确定III-氮化物层中的电场的强度,从而提高器件发光的效率。
    • 5. 发明申请
    • A1lnGaP LED having reduced temperature dependence
    • AlInGaP LED具有降低的温度依赖性
    • US20060220031A1
    • 2006-10-05
    • US11100080
    • 2005-04-05
    • Michael KramesNathan GardnerFrank Steranka
    • Michael KramesNathan GardnerFrank Steranka
    • H01L33/00
    • H01L33/30H01L2224/13H01L2924/00011H01L2924/00014H01L2224/0401
    • To increase the lattice constant of AlInGaP LED layers to greater than the lattice constant of GaAs for reduced temperature sensitivity, an engineered growth layer is formed over a substrate, where the growth layer has a lattice constant equal to or approximately equal to that of the desired AlInGaP layers. In one embodiment, a graded InGaAs or InGaP layer is grown over a GaAs substrate. The amount of indium is increased during growth of the layer such that the final lattice constant is equal to that of the desired AlInGaP active layer. In another embodiment, a very thin InGaP, InGaAs, or AlInGaP layer is grown on a GaAs substrate, where the InGaP, InGaAs, or AlInGaP layer is strained (compressed). The InGaP, InGaAs, or AlInGaP thin layer is then delaminated from the GaAs and relaxed, causing the lattice constant of the thin layer to increase to the lattice constant of the desired overlying AlInGaP LED layers. The LED layers are then grown over the thin InGaP, InGaAs, or AlInGaP layer.
    • 为了将AlInGaP LED层的晶格常数提高到大于GaAs的晶格常数以降低温度敏感性,在衬底上形成工程化生长层,其中生长层具有等于或近似等于所需的晶格常数的晶格常数 AlInGaP层。 在一个实施例中,在GaAs衬底上生长渐变的InGaAs或InGaP层。 在层的生长期间铟的量增加,使得最终晶格常数等于所需的AlInGaP活性层的量。 在另一实施例中,在GaAs衬底上生长非常薄的InGaP,InGaAs或AlInGaP层,其中InGaP,InGaAs或AlInGaP层被应变(压缩)。 然后,InGaP,InGaAs或AlInGaP薄层从GaAs分层并且弛豫,导致薄层的晶格常数增加到期望的上覆AlInGaP LED层的晶格常数。 然后在薄的InGaP,InGaAs或AlInGaP层上生长LED层。
    • 7. 发明申请
    • AlInGaP LED Having Reduced Temperature Dependence
    • 具有降低温度依赖性的AlInGaP LED
    • US20070131961A1
    • 2007-06-14
    • US11672003
    • 2007-02-06
    • Michael KramesNathan GardnerFrank Steranka
    • Michael KramesNathan GardnerFrank Steranka
    • H01L33/00H01L21/00
    • H01L33/30H01L2224/13H01L2924/00011H01L2924/00014H01L2224/0401
    • To increase the lattice constant of AlInGaP LED layers to greater than the lattice constant of GaAs for reduced temperature sensitivity, an engineered growth layer is formed over a substrate, where the growth layer has a lattice constant equal to or approximately equal to that of the desired AlInGaP layers. In one embodiment, a graded InGaAs or InGaP layer is grown over a GaAs substrate. The amount of indium is increased during growth of the layer such that the final lattice constant is equal to that of the desired AlInGaP active layer. In another embodiment, a very thin InGaP, InGaAs, or AlInGaP layer is grown on a GaAs substrate, where the InGaP, InGaAs, or AlInGaP layer is strained (compressed). The InGaP, InGaAs, or AlInGaP thin layer is then delaminated from the GaAs and relaxed, causing the lattice constant of the thin layer to increase to the lattice constant of the desired overlying AlInGaP LED layers. The LED layers are then grown over the thin InGaP, InGaAs, or AlInGaP layer.
    • 为了将AlInGaP LED层的晶格常数提高到大于GaAs的晶格常数以降低温度敏感性,在衬底上形成工程化生长层,其中生长层具有等于或近似等于所需的晶格常数的晶格常数 AlInGaP层。 在一个实施例中,在GaAs衬底上生长渐变的InGaAs或InGaP层。 在层的生长期间铟的量增加,使得最终晶格常数等于所需的AlInGaP活性层的量。 在另一实施例中,在GaAs衬底上生长非常薄的InGaP,InGaAs或AlInGaP层,其中InGaP,InGaAs或AlInGaP层被应变(压缩)。 然后,InGaP,InGaAs或AlInGaP薄层从GaAs分层并且弛豫,导致薄层的晶格常数增加到期望的上覆AlInGaP LED层的晶格常数。 然后在薄的InGaP,InGaAs或AlInGaP层上生长LED层。
    • 8. 发明申请
    • III-V light emitting device
    • III-V发光装置
    • US20070069225A1
    • 2007-03-29
    • US11237215
    • 2005-09-27
    • Michael KramesNathan GardnerJohn Epler
    • Michael KramesNathan GardnerJohn Epler
    • H01L33/00H01L29/22
    • H01L21/2654H01L21/76254H01L33/0075H01L33/0079H01S5/32341H01S2304/12
    • A semiconductor structure includes an n-type region, a p-type region, and a III-nitride light emitting layer disposed between the n-type region and the p-type region. The III-nitride light emitting layer has a lattice constant greater than 3.19 Å. Such a semiconductor structure may be grown on a substrate including a host and a seed layer bonded to the host. In some embodiments, a bonding layer bonds the host to the seed layer. The seed layer may be thinner than a critical thickness for relaxation of strain in the semiconductor structure, such that strain in the semiconductor structure is relieved by dislocations formed in the seed layer, or by gliding between the seed layer and the bonding layer an interface between the two layers. In some embodiments, the host may be separated from the semiconductor structure and seed layer by etching away the bonding layer.
    • 半导体结构包括设置在n型区域和p型区域之间的n型区域,p型区域和III族氮化物发光层。 III族氮化物发光层的晶格常数大于3.19埃。 这样的半导体结构可以在包含与主体结合的主体和种子层的基板上生长。 在一些实施方案中,结合层将主体结合到种子层。 种子层可以比用于缓和半导体结构中的应变的临界厚度薄,使得半导体结构中的应变由种子层中形成的位错或通过在种子层和结合层之间滑动而消除, 两层。 在一些实施例中,可以通过蚀刻掉粘合层来将主体与半导体结构和种子层分离。