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    • 8. 发明授权
    • Probe card for semiconductor wafers having mounting plate and socket
    • 带安装板和插座的半导体晶圆探头卡
    • US07250780B2
    • 2007-07-31
    • US10742729
    • 2003-12-19
    • David R. HembreeWarren M. FarnworthSalman AkramAlan G. WoodC. Patrick DohertyAndrew J. Krivy
    • David R. HembreeWarren M. FarnworthSalman AkramAlan G. WoodC. Patrick DohertyAndrew J. Krivy
    • G01R1/073G01R31/28
    • G01R31/2886
    • A probe card for testing semiconductor wafers, and a method and system for testing wafers using the probe card are provided. The probe card is configured for use with a conventional testing apparatus, such as a wafer probe handler, in electrical communication with test circuitry. The probe card includes an interconnect substrate having contact members for establishing electrical communication with contact locations on the wafer. The probe card also includes a membrane for physically and electrically connecting the interconnect substrate to the testing apparatus, and a compressible member for cushioning the pressure exerted on the interconnect substrate by the testing apparatus. The interconnect substrate can be formed of silicon with raised contact members having penetrating projections. Alternately the contact members can be formed as indentations for testing bumped wafers. The membrane can be similar to multi layered TAB tape including metal foil conductors attached to a flexible, electrically-insulating, elastomeric tape. The probe card can be configured to contact all of the dice on the wafer at the same time, so that test signals can be electronically applied to selected dice as required.
    • 提供了用于测试半导体晶片的探针卡,以及使用探针卡测试晶片的方法和系统。 探针卡被配置用于与测试电路电气通信的常规测试装置,例如晶片探测器处理器。 探针卡包括具有用于与晶片上的接触位置建立电连通的接触构件的互连基板。 探针卡还包括用于将互连基板物理和电连接到测试装置的膜,以及用于缓冲由测试装置施加在互连基板上的压力的可压缩构件。 互连衬底可以由具有穿透突起的凸起接触构件的硅形成。 或者,接触构件可以形成为用于测试凸起的晶片的凹陷。 膜可以类似于多层TAB带,其包括附接到柔性,电绝缘的弹性体带的金属箔导体。 探针卡可以配置为同时接触晶片上的所有骰子,以便测试信号可以根据需要以电子方式应用于选定的骰子。