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    • 2. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08886893B2
    • 2014-11-11
    • US12597097
    • 2008-04-25
    • Seiji MiuraYoshinori HaraguchiKazuhiko AbeShoji Kaneko
    • Seiji MiuraYoshinori HaraguchiKazuhiko AbeShoji Kaneko
    • G06F12/00G11C7/00G06F13/42
    • G11C14/00G06F13/4243G11C16/30
    • The present invention has an object of providing a high-speed, low-cost, and user-friendly information processing system that can ensure scalability of memory capacity. The information processing system is configured to include an information processing device, a volatile memory, and a nonvolatile memory. By serially connecting the information processing device, the volatile memory, and the nonvolatile memory and reducing the number of connection signals, processing speed is increased while maintaining the scalability of memory capacity. When transferring data of the nonvolatile memory to the volatile memory, error correction is performed, thereby improving reliability. The information processing system including the plurality of chips is configured as an information-processing system module in which the chips are alternately stacked and arranged, and wired by a ball grid array (BGA) or by bonding between the chips.
    • 本发明的目的是提供一种高速,低成本和用户友好的信息处理系统,其可以确保存储器容量的可扩展性。 信息处理系统被配置为包括信息处理设备,易失性存储器和非易失性存储器。 通过串行连接信息处理装置,易失性存储器和非易失性存储器并减少连接信号的数量,提高处理速度,同时保持存储容量的可扩展性。 当将非易失性存储器的数据传送到易失性存储器时,执行错误校正,从而提高可靠性。 包括多个芯片的信息处理系统被配置为信息处理系统模块,其中芯片被交替堆叠和布置,并且由球栅阵列(BGA)或芯片之间的接合进行布线。
    • 3. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20100131724A1
    • 2010-05-27
    • US12597097
    • 2008-04-25
    • Seiji MiuraYoshinori HaraguchiKazuhiko AbeShoji Kaneko
    • Seiji MiuraYoshinori HaraguchiKazuhiko AbeShoji Kaneko
    • G06F12/00G11C7/00G11C8/16
    • G11C14/00G06F13/4243G11C16/30
    • The present invention has an object of providing a high-speed, low-cost, and user-friendly information processing system that can ensure scalability of memory capacity. The information processing system is configured to include an information processing device, a volatile memory, and a nonvolatile memory. By serially connecting the information processing device, the volatile memory, and the nonvolatile memory and reducing the number of connection signals, processing speed is increased while maintaining the scalability of memory capacity. When transferring data of the nonvolatile memory to the volatile memory, error correction is performed, thereby improving reliability. The information processing system including the plurality of chips is configured as an information-processing system module in which the chips are alternately stacked and arranged, and wired by a ball grid array (BGA) or by bonding between the chips.
    • 本发明的目的是提供一种高速,低成本和用户友好的信息处理系统,其可以确保存储器容量的可扩展性。 信息处理系统被配置为包括信息处理设备,易失性存储器和非易失性存储器。 通过串行连接信息处理装置,易失性存储器和非易失性存储器并减少连接信号的数量,提高处理速度,同时保持存储容量的可扩展性。 当将非易失性存储器的数据传送到易失性存储器时,执行错误校正,从而提高可靠性。 包括多个芯片的信息处理系统被配置为信息处理系统模块,其中芯片被交替堆叠和布置,并且由球栅阵列(BGA)或芯片之间的接合进行布线。
    • 4. 发明申请
    • MEMORY MODULE, MEMORY SYSTEM, AND DATA PROCESSING SYSTEM
    • 存储器模块,存储器系统和数据处理系统
    • US20070271409A1
    • 2007-11-22
    • US11748936
    • 2007-05-15
    • Seiji MiuraAkira YabuYoshinori Haraguchi
    • Seiji MiuraAkira YabuYoshinori Haraguchi
    • G06F12/06
    • G06F12/0623Y02D10/13
    • A user-friendly data processing system apparatus which ensures the expandability of memory capacity and high speed processing with low cost is provided. The data processing system is composed of a data processing unit, a volatile memory and a nonvolatile memory. The data processing unit, the volatile memory and the nonvolatile memory are connected in series and by reducing the number of connection signals fast processing is realized while maintaining the memory capacity expandability. Upon transferring a data of the nonvolatile memory to the volatile memory, an error correction is executed, therefore, the reliability is improved. The data processing system composed of the plurality of memory chips is formed as a data processing system module in which the each chips are stacked and arranged, and wiring is formed by ball grid array (BGA) and bonding between the chips.
    • 提供一种用户友好的数据处理系统装置,其确保存储容量的可扩展性和低成本的高速处理。 数据处理系统由数据处理单元,易失性存储器和非易失性存储器组成。 数据处理单元,易失性存储器和非易失性存储器被串联连接,并且通过减少在保持存储器容量扩展性的同时实现快速处理的连接信号的数量。 在将非易失性存储器的数据传送到易失性存储器时,执行错误校正,因此提高了可靠性。 由多个存储器芯片组成的数据处理系统形成为数据处理系统模块,其中每个芯片被堆叠和布置,并且布线由球栅阵列(BGA)形成并且芯片之间的结合。
    • 5. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20090003026A1
    • 2009-01-01
    • US12137802
    • 2008-06-12
    • Yoshiro RihoHayato OishiYoshinori HaraguchiYoshinori Matsui
    • Yoshiro RihoHayato OishiYoshinori HaraguchiYoshinori Matsui
    • G11C5/02G11C8/00
    • G11C5/025G11C29/1201G11C29/26G11C29/48
    • A semiconductor memory device includes a plurality of banks, each of which is constituted of a plurality of memory cell arrays that are aligned in series in the longitudinal direction, wherein each memory cell array includes a plurality of memory cells, and wherein memory cell arrays of banks are collectively aggregated into a plurality of blocks, each of which includes memory cell arrays aligned in the perpendicular direction, in connection with a plurality of DQ pads. DQ pads are arranged in proximity to blocks. Substantially the same distance is set between memory cells and DQ pads so as to reduce dispersions in access times with respect to all DQ pads, thus achieving high-speed access in the semiconductor memory device. The wiring region of IO lines is reduced in the center area of the chip.
    • 半导体存储器件包括多个存储体,每个存储体由在纵向方向上串联排列的多个存储单元阵列构成,其中每个存储单元阵列包括多个存储单元,并且其中存储单元阵列 银行被集体地聚集成多个块,每个块包括与多个DQ焊盘相关联的在垂直方向上排列的存储单元阵列。 DQ垫布置在块附近。 在存储单元和DQ垫之间基本上设置相同的距离,以便相对于所有DQ焊盘减少访问时间的分散,从而实现半导体存储器件中的高速访问。 在芯片的中心区域,IO线的布线区域减小。
    • 6. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US07864618B2
    • 2011-01-04
    • US12137802
    • 2008-06-12
    • Yoshiro RihoHayato OishiYoshinori HaraguchiYoshinori Matsui
    • Yoshiro RihoHayato OishiYoshinori HaraguchiYoshinori Matsui
    • G11C8/00
    • G11C5/025G11C29/1201G11C29/26G11C29/48
    • A semiconductor memory device includes a plurality of banks, each of which is constituted of a plurality of memory cell arrays that are aligned in series in the longitudinal direction, wherein each memory cell array includes a plurality of memory cells, and wherein memory cell arrays of banks are collectively aggregated into a plurality of blocks, each of which includes memory cell arrays aligned in the perpendicular direction, in connection with a plurality of DQ pads. DQ pads are arranged in proximity to blocks. Substantially the same distance is set between memory cells and DQ pads so as to reduce dispersions in access times with respect to all DQ pads, thus achieving high-speed access in the semiconductor memory device. The wiring region of IO lines is reduced in the center area of the chip.
    • 半导体存储器件包括多个存储体,每个存储体由在纵向方向上串联排列的多个存储单元阵列构成,其中每个存储单元阵列包括多个存储单元,并且其中存储单元阵列 银行被集体地聚集成多个块,每个块包括与多个DQ焊盘相关联的在垂直方向上排列的存储单元阵列。 DQ垫布置在块附近。 在存储单元和DQ垫之间基本上设置相同的距离,以便相对于所有DQ焊盘减少访问时间的分散,从而实现半导体存储器件中的高速访问。 在芯片的中心区域,IO线的布线区域减小。
    • 8. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07796453B2
    • 2010-09-14
    • US12145240
    • 2008-06-24
    • Yoshiro RihoHayato OishiYoshinori HaraguchiYoshinori Matsui
    • Yoshiro RihoHayato OishiYoshinori HaraguchiYoshinori Matsui
    • G11C11/00
    • G11C7/1048G11C7/1051G11C7/1069
    • A semiconductor device includes a column decoder that generates a column selecting signal that selects any of a plurality of bit line pairs to which memory cells are connected according to a column address that is input; a bit line selecting switch that connects by the column selecting signal any of a plurality of bit line pairs and a data I/O line pair that outputs data that has been read from a memory cell to the outside; a data amplifier that amplifies a voltage differential of a data I/O line pair and outputs data that has been read to an output buffer; a data I/O line switch that is provided in the data I/O lines; an I/O line precharge circuit that precharges a data I/O line pair that is not on the side of the data amplifier; and an amplifier precharge circuit that precharges a data I/O line pair that is on the side of the data amplifier.
    • 半导体器件包括:列解码器,根据输入的列地址,生成列选择信号,该列选择信号选择存储单元连接到的多个位线对; 通过列选择信号连接多个位线对的位线选择开关和将从存储单元读出的数据输出到外部的数据I / O线对; 数据放大器,其放大数据I / O线对的电压差,并将已读取的数据输出到输出缓冲器; 在数据I / O线路中提供的数据I / O线路开关; 对不在数据放大器一侧的数据I / O线对进行预充电的I / O线路预充电电路; 以及对数据放大器侧面的数据I / O线对进行预充电的放大器预充电电路。
    • 9. 发明授权
    • Semiconductor integrated circuit device with built-in test circuit for
applying stress to timing generator in burn-in test
    • 具有内置测试电路的半导体集成电路器件,用于在老化测试中对定时发生器施加应力
    • US6034907A
    • 2000-03-07
    • US273561
    • 1999-03-22
    • Yoshinori Haraguchi
    • Yoshinori Haraguchi
    • G01R31/28G06F11/22G11C29/02G11C29/06G11C29/50G11C7/00
    • G11C29/50G11C29/02
    • A semiconductor memory device has a device identification code to see whether or not a packet signal is addressed thereto, and a timing generator starts a control sequence for a data access in response to a hit signal representative of the consistency between the stored device identification code and an input device identification code incorporated in the packet signal, wherein a signal receiving circuit is shared between the packet signal and a test signal representative of instructions for burn-in test, and a logic gate is provided for directly generating the hit signal from an internal mode signal representative of the test mode so that the timing generator starts the control sequence in the burn-in test regardless of the consistency between the test signal and the stored device identification code.
    • 半导体存储器件具有用于查看分组信号是否寻址到其中的器件识别码,并且定时发生器响应于表示存储的器件识别码和存储器件识别码之间的一致性的命中信号而启动用于数据访问的控制序列 包含在分组信号中的输入装置识别码,其中在分组信号和表示用于老化测试的指令的测试信号之间共享信号接收电路,并且提供逻辑门,用于从内部直接产生命中信号 模式信号表示测试模式,使得定时发生器启动老化测试中的控制序列,而不管测试信号和存储的设备识别码之间的一致性。