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1. 发明申请

US20160071686A1 LINKAGE CONDUIT FOR VACUUM CHAMBER APPLICATIONS 有权
标题翻译：用于真空室应用的连接管
公开(公告)号：US20160071686A1
公开(公告)日：2016-03-10
申请号：US14482761
申请日：2014-09-10
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Eric D. Hermanson , Robert J. Mitchell , Steven Anella , Jeffrey Charles Blahnik , William T. Weaver , Michael Rohrer , James P. Buonodono
IPC分类号： H01J37/18 , H01J37/20 , H01J37/317
CPC分类号： H01J37/20 , H01J21/18 , H01J37/3171 , H01J2237/2005 , H01J2237/202 , H01L21/18
摘要： An ion implantation apparatus including an enclosure defining a process chamber, a carriage slidably mounted on a shaft within the process chamber and coupled to a drive mechanism adapted to selectively move the carriage along the shaft. A platen assembly can be coupled to the carriage, and a linkage conduit can extend between a side wall of the enclosure and the carriage. The linkage conduit can include a plurality of pivotably interconnected linkage members that define a contiguous internal volume that is sealed from the process chamber. The contiguous volume can be held at a desired vacuum pressure separate from the vacuum environment of the process chamber.
摘要翻译：一种离子注入装置，其包括限定处理室的外壳，可滑动地安装在处理室内的轴上并联接到适于沿着轴选择性地移动托架的驱动机构的托架。压板组件可以联接到滑架，并且连接导管可以在外壳的侧壁和滑架之间延伸。连接导管可以包括多个可枢转地互连的连接构件，其限定了与处理室密封的连续内部容积。连续体积可以保持在与处理室的真空环境分开的期望的真空压力下。

2. 发明授权

US09082799B2 System and method for 2D workpiece alignment 有权
标题翻译： 2D工件对齐的系统和方法
公开(公告)号：US09082799B2
公开(公告)日：2015-07-14
申请号：US13623428
申请日：2012-09-20
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： William T. Weaver , Charles T. Carlson , Scott A. Smith , Michael A. Beck , Aaron P. Webb , James D. Strassner , Lawrence R. Gravell , Michael C. Simmons
IPC分类号： H01L21/673 , H01L21/68 , H01L21/687 , C23C14/04 , C23C14/48 , C23C14/50
CPC分类号： H01L21/67333 , C23C14/042 , C23C14/48 , C23C14/50 , H01L21/68728 , H01L21/68735 , H01L21/68778 , Y10T29/49899
摘要： A carrier capable of holding one or more workpieces is disclosed. The carrier includes movable projections located along the sides of each cell in the carrier. This carrier, in conjunction with a separate alignment apparatus, aligns each workpiece within its respective cell against several alignment pins, using a multiple step alignment process to guarantee proper positioning of the workpiece in the cell. First, the workpieces are moved toward one side of the cell. Once the workpieces have been aligned against this side, the workpieces are then moved toward an adjacent orthogonal side such that the workpieces are aligned to two sides of the cell. Once aligned, the workpiece is held in place by the projections located along each side of each cell. In addition, the alignment pins are also used to align the associated mask, thereby guaranteeing that the mask is properly aligned to the workpiece.
摘要翻译：公开了能够容纳一个或多个工件的承载件。载体包括沿着载体中的每个单元的侧面定位的可移动凸起。该载体与单独的对准装置一起使用多步对准工艺将其各自的电池内的每个工件对准几个对准销，以保证工件在电池中的正确定位。首先，将工件朝向电池的一侧移动。一旦工件已经对准该侧面，工件就移动到相邻的正交侧，使得工件与单元的两侧对齐。一旦对准，工件通过位于每个单元的每一侧的凸起保持就位。此外，对准销还用于对准相关联的掩模，从而保证掩模适当地对准工件。

3. 发明授权

US09437392B2 High-throughput ion implanter 有权
标题翻译：高通量离子注入机
公开(公告)号：US09437392B2
公开(公告)日：2016-09-06
申请号：US13662110
申请日：2012-10-26
申请人： VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
发明人： William T. Weaver , Charles T. Carlson , Joseph C. Olson , James Buonodono , Paul Sullivan
IPC分类号： H01J37/00 , H01J37/20 , H01J37/302 , H01J37/317 , H01L21/266 , H01L21/67 , H01L31/18
CPC分类号： H01J37/20 , H01J37/3023 , H01J37/3171 , H01J2237/024 , H01J2237/31711 , H01L21/266 , H01L21/67213 , H01L31/18 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： One embodiment of this ion implanter includes an ion source and a process chamber. This process chamber is connected to the ion source and separated from the ion source by a plurality of extraction electrodes. A carrier holds multiple workpieces. A mask loader in the process chamber connects a mask to the carrier. A transfer chamber and load lock may be connected to the process chamber. The ion implanter is configured to perform either blanket or selective implantation of the workpieces.
摘要翻译：该离子注入机的一个实施例包括离子源和处理室。该处理室与离子源连接并通过多个提取电极与离子源分离。托架支撑多个工件。处理室中的掩模加载器将掩模连接到载体。传送室和加载锁可以连接到处理室。离子注入机被配置为执行工件的橡皮布或选择性植入。

4. 发明申请

US20140366358A1 WORKPIECE ALIGNMENT DEVICE 审中-公开
标题翻译：工作对准设备
公开(公告)号：US20140366358A1
公开(公告)日：2014-12-18
申请号：US14468732
申请日：2014-08-26
申请人： VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
发明人： Malcolm N. Daniel , Charles T. Carlson , William T. Weaver
IPC分类号： H01L21/68 , H01L21/677
CPC分类号： H01L21/68 , B65G49/07 , H01L21/67769 , H01L21/67775 , H01L21/67781 , H01L21/681 , Y10T29/49764 , Y10T29/49829 , Y10T29/53022 , Y10T29/53539
摘要： An alignment device has a carriage, two rails on the carriage that are configured for a workpiece to pass therebetween, and a finger that protrudes a distance from the carriage. The finger is configured to be disposed on a carrier for the workpieces. The workpieces may be solar cells and may pass through the rails on a conveyor belt. The alignment device may move in order to align the workpieces as the workpieces are loaded into a carrier.
摘要翻译：对准装置具有滑架，滑架上的两个轨道，其构造成用于工件通过它们;以及从滑架突出一定距离的手指。手指被配置为设置在用于工件的载体上。工件可以是太阳能电池，并且可以通过传送带上的轨道。当工件装载到载体中时，对准装置可以移动以便对齐工件。

5. 发明申请

US20140225007A1 SYSTEM AND METHOD FOR HANDLING MULTIPLE WORKPIECES FOR MATRIX CONFIGURATION PROCESSING 审中-公开
标题翻译：用于处理矩阵配置处理的多个工件的系统和方法
公开(公告)号：US20140225007A1
公开(公告)日：2014-08-14
申请号：US14253016
申请日：2014-04-15
申请人： VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
发明人： William T. Weaver , Jamie A. Carrera , Robert B. Vopat , Aaron Webb , Charles T. Carlson
IPC分类号： H01L21/677 , G21K5/10
CPC分类号： H01L21/67739 , G21K5/10 , H01L21/67742 , H01L21/67766 , H01L21/68707
摘要： A system for loading workpieces into a process chamber for processing in a matrix configuration includes a conveyor configured to transport multiple workpieces in a linear fashion. A workpiece hotel is configured to receive the multiple workpieces from the conveyor. The workpiece hotel comprises a matrix of cells arranged in N columns and M floors. A pick blade is configured to insert into the hotel and retract from the hotel in order to unload a plurality of substrates from a first floor into a single row of the pick blade, and to repeat the unloading operation to form a matrix comprising a plurality of rows of substrates disposed on the pick blade. In one example, the workpiece hotel has a staggered configuration that provides individual accessibility of each hotel cell.
摘要翻译：用于将工件加载到用于以矩阵构造处理的处理室中的系统包括被构造成以线性方式输送多个工件的传送器。工件酒店被配置为从输送机接收多个工件。工件酒店包括排列在N列和M层的单元矩阵。拾取刀片被配置成插入酒店并从酒店退回，以便将多个基板从第一层卸载到单行拾取刀片中，并且重复卸载操作以形成矩阵，其包括多个设置在拾取刀片上的一排衬底。在一个例子中，工件酒店具有交错的配置，可以提供每个酒店单元的个人可访问性。

6. 发明申请

US20140170783A1 MASK ALIGNMENT SYSTEM FOR SEMICONDUCTOR PROCESSING 有权
标题翻译：用于半导体处理的掩模对准系统
公开(公告)号：US20140170783A1
公开(公告)日：2014-06-19
申请号：US14101974
申请日：2013-12-10
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Aaron P. Webb , Charles T. Carlson , William T. Weaver , Christopher N. Grant
IPC分类号： H01L21/266
CPC分类号： H01L21/266 , H01L21/682
摘要： A mask alignment system for providing precise and repeatable alignment between ion implantation masks and workpieces. The system includes a mask frame having a plurality of ion implantation masks loosely connected thereto. The mask frame is provided with a plurality of frame alignment cavities, and each mask is provided with a plurality of mask alignment cavities. The system further includes a platen for holding workpieces. The platen may be provided with a plurality of mask alignment pins and frame alignment pins configured to engage the mask alignment cavities and frame alignment cavities, respectively. The mask frame can be lowered onto the platen, with the frame alignment cavities moving into registration with the frame alignment pins to provide rough alignment between the masks and workpieces. The mask alignment cavities are then moved into registration with the mask alignment pins, thereby shifting each individual mask into precise alignment with a respective workpiece.
摘要翻译：掩模对准系统，用于在离子注入掩模和工件之间提供精确和可重复的对准。该系统包括具有松散地连接到其上的多个离子注入掩模的掩模框架。掩模框架设置有多个框架对准空腔，并且每个掩模设置有多个掩模对准空腔。该系统还包括用于保持工件的压板。压板可以设置有多个掩模对准销和框架对准销，其被配置为分别接合掩模对准空腔和框架对准空腔。面罩框架可以下降到台板上，框架对准空腔与框架定位销对齐，以在面罩和工件之间提供粗略对准。然后将掩模对准空腔移动到与掩模对准销对准，从而将每个单独的掩模移动到与相应的工件精确对准。

7. 发明申请

US20140165908A1 TRANSFER CHAMBER AND METHOD OF USING A TRANSFER CHAMBER 审中-公开
标题翻译：传送室和使用传送室的方法
公开(公告)号：US20140165908A1
公开(公告)日：2014-06-19
申请号：US14101945
申请日：2013-12-10
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Aaron P. Webb , Charles T. Carlson , Paul Forderhase , William T. Weaver , Robert Brent Vopat
IPC分类号： H01L31/18
CPC分类号： H01L31/18 , H01J37/185 , H01J37/3171 , H01J37/32412 , H01L21/67155 , H01L21/67173 , H01L21/67184 , H01L31/1804 , Y02E10/547 , Y02P70/521 , Y10T29/49718
摘要： An ion implanter and method for facilitating expeditious performance of maintenance on a component of the ion implanter in a manner that reduces downtime while increasing throughput of the ion implanter. The ion implanter includes a process chamber, a transfer chamber connected to the process chamber, a first isolation gate configured to controllably seal the transfer chamber from the process chamber, and a second isolation gate configured to controllably seal the transfer chamber from an atmospheric environment, wherein a component of the ion implanter can be transferred between the process chamber and the transfer chamber for performing maintenance on the component outside of the process chamber. Performing maintenance on a component of the ion implanter includes the steps of transferring the component from the process chamber to the transfer chamber, sealing the transfer chamber, venting the transfer chamber to atmospheric pressure, an opening the transfer chamber to an atmospheric environment.
摘要翻译：一种离子注入机和方法，用于以减少停机时间同时提高离子注入机的产量的方式促进对离子注入机部件的维护的快速性能。离子注入机包括处理室，连接到处理室的传送室，构造成可以将传送室从处理室可控地密封的第一隔离栅和被配置为可控制地将传送室与大气环境密封的第二隔离栅，其中所述离子注入机的部件可以在所述处理室和所述传送室之间传送，以对所述处理室外的部件执行维护。对离子注入机的部件执行维护包括将部件从处理室传送到传送室，密封传送室，将传送室排出到大气压力，将传送室打开到大气环境的步骤。

8. 发明授权

US10446710B2 Transfer chamber and method of using a transfer chamber 有权
公开(公告)号：US10446710B2
公开(公告)日：2019-10-15
申请号：US14101945
申请日：2013-12-10
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Aaron P. Webb , Charles T. Carlson , Paul Forderhase , William T. Weaver , Robert Brent Vopat
IPC分类号： H01L31/18 , H01J37/317 , H01L21/67 , H01J37/18 , H01J37/32
摘要： An ion implanter and method for facilitating expeditious performance of maintenance on a component of the ion implanter in a manner that reduces downtime while increasing throughput of the ion implanter. The ion implanter includes a process chamber, a transfer chamber connected to the process chamber, a first isolation gate configured to controllably seal the transfer chamber from the process chamber, and a second isolation gate configured to controllably seal the transfer chamber from an atmospheric environment, wherein a component of the ion implanter can be transferred between the process chamber and the transfer chamber for performing maintenance on the component outside of the process chamber. Performing maintenance on a component of the ion implanter includes the steps of transferring the component from the process chamber to the transfer chamber, sealing the transfer chamber, venting the transfer chamber to atmospheric pressure, an opening the transfer chamber to an atmospheric environment.

9. 发明授权

US09899242B2 Device and method for substrate heating during transport 有权
公开(公告)号：US09899242B2
公开(公告)日：2018-02-20
申请号：US14679526
申请日：2015-04-06
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Jason M. Schaller , Morgan D. Evans , Ala Moradian , Robert Brent Vopat , David Blahnik , William T. Weaver
IPC分类号： H01L21/67 , H01L21/324 , H01L27/15 , F27B5/12 , F27B5/14 , F27D3/12 , F27D3/00
CPC分类号： H01L21/67115 , F27B5/12 , F27B5/14 , F27D2003/0051 , H01L21/67161 , H01L21/67196
摘要： A system for heating substrates while being transported between processing chambers is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed in the transfer chamber. The LEDs may be GaN LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. A controller is in communication with the LEDs. The LEDs may be independently controllable, so that the LEDs that are disposed above the substrate as it is moved from one processing chamber to another are illuminated. In other words, the illumination of the LEDs and the movements of the substrate handling robot may be synchronized by the controller.

10. 发明授权

US09728430B2 Electrostatic chuck with LED heating 有权
公开(公告)号：US09728430B2
公开(公告)日：2017-08-08
申请号：US14753870
申请日：2015-06-29
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Jason M. Schaller , William T. Weaver , Morgan D. Evans , Robert Brent Vopat , Paul E. Pergande , Julian G. Blake , David Blahnik , Ala Moradian
IPC分类号： H01L21/683 , H01T23/00 , H01L21/67
CPC分类号： H01L21/67115 , H01L21/67109 , H01L21/6831
摘要： An electrostatic chuck with LED heating is disclosed. The electrostatic chuck with LED heating comprises a first subassembly, which comprises a LED heater, and a second subassembly, which comprises an electrostatic chuck. The LED substrate heater subassembly includes a base having a recessed portion. A plurality of light emitting diodes (LEDs) is disposed within the recessed portion. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The second subassembly, which comprises an electrostatic chuck, is disposed on the LED substrate heater subassembly. The electrostatic chuck includes a top dielectric layer and an interior layer that are transparent at the wavelength emitted by the LEDs. One or more electrodes are disposed between the top dielectric layer and the interior layer to create the electrostatic force.

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