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1. 发明授权

US09234781B2 Automatic filling up spuit 有权
标题翻译：自动填充药物
公开(公告)号：US09234781B2
公开(公告)日：2016-01-12
申请号：US13912869
申请日：2013-06-07
申请人： Young Ju Lee , Jae Kwang Hwang
发明人： Young Ju Lee , Jae Kwang Hwang
IPC分类号： B65D83/00 , G01F11/02 , B65D41/56
CPC分类号： G01F11/028 , B65D41/56
摘要： An automatic filling up spuit (100) screwed to an entrance (1a) of a cosmetics container (1) for suctioning and discharging liquid stored in the cosmetics container (1) includes: a spuit pipe (10); a cylinder member (20); a piston member (30); a cylindrical push button (50); and a top/bottom-opened cylindrical enclosure (60). The automatic filling up spuit has an advantage of convenient use in that it is capable of automatically filling up liquid contents in a cosmetics container by a certain amount precisely at all times through joining with the cosmetics container without requiring a separate filling up operation.
摘要翻译：旋转到化妆品容器（1）的入口（1a）的自动填充线（100），用于抽吸和排出存储在化妆品容器（1）中的液体，包括：管道（10）; 气缸构件（20）; 活塞构件（30）; 圆柱形按钮（50）; 和顶部/底部开放的圆柱形外壳（60）。自动充填线具有使用方便的优点，因为它能够通过与化妆品容器接合而在化妆品容器中自动填充一定量的液体内容物，而不需要单独的填充操作。

2. 发明授权

US08469246B2 Cup holder for vehicle 有权
标题翻译：汽车杯架
公开(公告)号：US08469246B2
公开(公告)日：2013-06-25
申请号：US12938127
申请日：2010-11-02
申请人： Young Ju Lee , Cheol Soo Choi , Dong-Jin Park
发明人： Young Ju Lee , Cheol Soo Choi , Dong-Jin Park
IPC分类号： B60N3/10
CPC分类号： B60N3/102
摘要： A cup holder apparatus for a vehicle may include an accommodating tray provided inside a vehicle compartment and having an accommodation space for accommodating a cup therein, a cup support member rotatably provided around a rotating shaft (Z axis) against the accommodating tray and including a bottom portion for safe-placing the cup in the accommodation space and a support portion formed in a stand from the bottom portion to support an outer periphery of the cup, and a release prevention member prepared separately from the cup support member and connected to the bottom portion of the cup support member, while being rotatably coupled to the accommodating tray, to prevent release of the cup support member from the accommodating tray, wherein the release of the release prevention member from the accommodating tray is hindered by an upper stopper formed on the accommodating tray while the cup support member is rotatably coupled to the upper stopper and is rotated around the rotating shaft.
摘要翻译：一种用于车辆的杯架装置可以包括设置在车厢内部并且具有用于容纳杯子的容置空间的容纳盘，可旋转地设置在旋转轴（Z轴）周围的杯支撑构件抵靠容纳盘，并且包括底部用于将杯安全地放置在容纳空间中的部分和从底部形成在支架中的支撑部分以支撑杯的外周的部分，以及与杯支撑构件分开设置并连接到底部的防脱部件的杯支撑构件，同时可旋转地联接到容纳盘，以防止杯支撑构件从容纳盘释放，其中防止释放构件从容纳盘释放受到形成在容纳盘上的上止动器的阻碍托盘，同时杯支撑构件可旋转地联接到上止动件并围绕旋转轴旋转。

3. 再颁专利

USRE41255E1 Device having an improved apparatus and method for setting power management mode 有权
标题翻译：具有用于设置电源管理模式的改进的装置和方法的装置
公开(公告)号：USRE41255E1
公开(公告)日：2010-04-20
申请号：US10972112
申请日：2004-10-22
申请人： Young Ju Lee , Jong Goon Choi
发明人： Young Ju Lee , Jong Goon Choi
IPC分类号： G06F1/32
CPC分类号： G06F1/3203 , G06F1/263
摘要： The present invention supports power management modes which includes (1) a maximum power performance mode, (2) a battery-optimized mode, and (3) a performance/optimization cycling mode for performing the maximum performance mode and the battery-optimized mode alternately within a prescribed period of time. The cycling mode allows flexibility in power management and faster charging of the battery.
摘要翻译：本发明支持电源管理模式，其包括（1）最大功率性能模式，（2）电池优化模式，以及（3）用于执行最大性能模式和电池优化模式的性能/优化循环模式在规定的时间内。循环模式允许电源管理的灵活性和电池的更快充电。

4. 发明申请

US20130292457A1 SOLDER SHEET AND SMOLDERING METHOD USING THE SAME 审中-公开
标题翻译：使用该方法的焊接工艺和使用方法
公开(公告)号：US20130292457A1
公开(公告)日：2013-11-07
申请号：US13554006
申请日：2012-07-20
申请人： Hyun Jung Lee , Young Ju Lee , Yun Bog Kim , Seon Young Myoung , Suk Jin Ham , Seong Chan Park
发明人： Hyun Jung Lee , Young Ju Lee , Yun Bog Kim , Seon Young Myoung , Suk Jin Ham , Seong Chan Park
IPC分类号： B23K35/02 , B23K1/00
CPC分类号： B23K35/0244 , B23K3/0623 , B23K3/08 , B23K3/087 , B23K35/0222 , B23K35/0227 , Y10T428/24174
摘要： Disclosed herein are a solder sheet and a soldering method using the same. The solder sheet includes: a plurality of solder rods arranged to have a uniform height h and an area density N; and a support having an adhesive formed on one surface thereof and supporting the plurality of solder rods such that one end of each of the plurality of solder rods is attached to be perpendicular to the surface on which the adhesive is formed. Solder bumps can be formed on soldering portions of the substrate by using the solder sheet through a single process without a mask, and thus, the process can be simplified, costs can be reduced, and a defect rate can be lowered, thereby enhancing reliability.
摘要翻译：这里公开了一种焊料片和使用其的焊接方法。焊料片包括：多个焊料棒，其布置成具有均匀的高度h和面积密度N; 以及具有在其一个表面上形成的粘合剂并且支撑多个焊料棒的支撑件，使得多个焊料棒中的每一个的一端附接成垂直于其上形成有粘合剂的表面。可以通过在没有掩模的情况下通过单个工艺使用焊料片而在基板的焊接部分上形成焊料凸块，因此可以简化工艺，可以降低成本，并且可以降低缺陷率，从而提高可靠性。

5. 发明授权

US08536612B2 Light emitting device having a pluralilty of light emitting cells and package mounting the same 有权
标题翻译：具有多个发光单元的发光器件和安装它们的封装
公开(公告)号：US08536612B2
公开(公告)日：2013-09-17
申请号：US13152566
申请日：2011-06-03
申请人： Chung Hoon Lee , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
发明人： Chung Hoon Lee , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
IPC分类号： H01L29/18 , H01L23/48 , H01L33/00
CPC分类号： H01L27/153 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.
摘要翻译：公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。多个发光单元被接合到副安装座基板。因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

6. 发明授权

US08227272B2 Light emitting device having a pluralilty of light emitting cells and package mounting the same 有权
标题翻译：具有多个发光单元的发光器件和安装它们的封装
公开(公告)号：US08227272B2
公开(公告)日：2012-07-24
申请号：US12481998
申请日：2009-06-10
申请人： Chung Hoon Lee , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
发明人： Chung Hoon Lee , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
IPC分类号： H01L21/44 , H01L33/00 , H01L29/18 , H01L21/00
CPC分类号： H01L27/153 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.
摘要翻译：公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。多个发光单元被接合到副安装座基板。因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

7. 发明申请

US20090272971A1 LIGHT EMITTING DEVICE HAVING A PLURALILTY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME 有权
标题翻译：具有多个发光细胞的发光装置和安装其的包装
公开(公告)号：US20090272971A1
公开(公告)日：2009-11-05
申请号：US12481998
申请日：2009-06-10
申请人： Chung Hoon LEE , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
发明人： Chung Hoon LEE , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
IPC分类号： H01L29/10 , H01L33/00 , H01L21/00 , H01L29/15
CPC分类号： H01L27/153 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.
摘要翻译：公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。多个发光单元被接合到副安装座基板。因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

8. 发明申请

US20080087902A1 Light Emitting Device Having a Plurality of Light Emitting Cells and Package Mounting the Same 有权
标题翻译：具有多个发光单元和封装的发光装置安装在其上
公开(公告)号：US20080087902A1
公开(公告)日：2008-04-17
申请号：US11721803
申请日：2005-10-25
申请人： Chung Hoon Lee , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
发明人： Chung Hoon Lee , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
IPC分类号： H01L33/00
CPC分类号： H01L27/153 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.
摘要翻译：公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。多个发光单元被接合到副安装座基板。因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

9. 发明授权

US06463000B2 First-in first-out memory device and method of generating flag signal in the same 有权
标题翻译：先进先出的存储器件和产生标志信号的方法相同
公开(公告)号：US06463000B2
公开(公告)日：2002-10-08
申请号：US09950263
申请日：2001-09-10
申请人： Young Ju Lee , Jeung Joo Lim
发明人： Young Ju Lee , Jeung Joo Lim
IPC分类号： G11C700
CPC分类号： G06F5/14 , G11C7/1018
摘要： A FIFO memory device includes a write address generating circuit generating a write address in response to a write clock signal and a read address generating circuit generating a read address in response to a read clock signal. A memory cell array includes a plurality of memory cells arranged between a plurality of write and read word lines and a plurality of write and read bit lines, the memory cell array storing write data in response to the write address and outputting read data in response to the read address. A flag signal generating circuit compares a next write address with a current read address to generate a full flag signal in response to the write clock signal when the next write address and the current read address are equal, and compares a current write address with a next read address to generate an empty flag signal in response to the read clock signal when the current write address and the next read address are equal.
摘要翻译： FIFO存储器件包括响应于写时钟信号产生写地址的写地址产生电路和响应于读时钟信号产生读地址的读地址产生电路。存储单元阵列包括布置在多个写入和读取字线和多个写入和读取位线之间的多个存储器单元，所述存储单元阵列响应于所述写入地址存储写入数据，并且响应于读地址。当下一个写入地址和当前读取地址相等时，标志信号发生电路将下一个写入地址与当前读取地址进行比较，以响应写入时钟信号产生一个满标志信号，并将当前写入地址与下一个写入地址进行比较读取地址以在当前写入地址和下一个读取地址相等时响应于读取时钟信号而产生空白标志信号。

10. 发明授权

US07838891B2 Light emitting device having a plurality of light emitting cells and package mounting the same 有权
标题翻译：具有多个发光单元的发光器件和安装它们的封装
公开(公告)号：US07838891B2
公开(公告)日：2010-11-23
申请号：US12766656
申请日：2010-04-23
申请人： Chung Hoon Lee , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
发明人： Chung Hoon Lee , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
IPC分类号： H01L29/18 , H01L23/48 , H01L33/00
CPC分类号： H01L27/153 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.
摘要翻译：公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。多个发光单元被接合到副安装座基板。因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

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