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    • 8. 发明授权
    • Scanning probe microscope
    • 扫描探针显微镜
    • US08387161B2
    • 2013-02-26
    • US12921832
    • 2009-03-12
    • Martin F. FinlanShelley J. Wilkins
    • Martin F. FinlanShelley J. Wilkins
    • G01Q60/24
    • G01Q60/38G01Q60/34G01Q70/10G01Q70/14
    • An elongate probe (50) for use in probe microscopy comprises a module (51) provided between a probe tip (53) and a driver (52). In use the driver (52) applies oscillations to the module (51) which are transmitted by the module to the tip (53). With the probe tip (53) positioned close to the surface of a sample, any phase variance in the oscillation of the tip with respect to the driving oscillation is representative of an interaction between the tip and the sample surface. The elongate arrangement of the probe (50) is particularly beneficial when used to probe samples which require a liquid environment.
    • 用于探针显微镜的细长探针(50)包括设置在探针末端(53)和驱动器(52)之间的模块(51)。 在使用中,驱动器(52)向模块(51)施加振荡,模块(51)由模块传送到尖端(53)。 当探针尖端(53)位于样品表面附近时,尖端相对于驱动振荡的振荡的任何相位变化代表尖端和样品表面之间的相互作用。 当用于探测需要液体环境的样品时,探针(50)的细长布置是特别有利的。
    • 10. 发明申请
    • Transferable Probe Tips
    • 可转移探头技巧
    • US20120279287A1
    • 2012-11-08
    • US13101253
    • 2011-05-05
    • Paul S. AndryBing DangSteven L. Wright
    • Paul S. AndryBing DangSteven L. Wright
    • G01B5/28B05D5/00C23F1/00
    • G01B5/28B81B2201/12B81C3/001B81C2201/0194G01Q40/02G01Q70/14G01Q70/16G01R1/067G01R1/06738G01R1/07378G01R3/00G03F7/00
    • Transferable probe tips including a metallic probe, a delamination layer covering a portion of the metallic probe, and a bonding alloy, wherein the bonding alloy contacts the metallic probe at a portion of the probe that is not covered by the delamination layer are provided herein. Also, techniques for creating a transferable probe tip are provided, including etching a handler substrate to form one or more via arrays, depositing a delamination layer in each via array, depositing one or more metals in each via array to form a probe tip structure, and depositing a bonding alloy on a portion of the probe tip structure that is not covered by the delamination layer. Additionally, techniques for transferring transferable probe tips are provided, including removing a handler substrate from a probe tip structure, and transferring the probe tip structure via flip-chip joining the probe tip structure to a target probe head substrate.
    • 本发明提供了包括金属探针,覆盖金属探针的一部分的分层和可接合的探针尖端,以及接合合金,其中接合合金在探针的未被分层的覆盖部分处接触金属探针。 此外,提供了用于产生可转移探针尖端的技术,包括蚀刻处理器衬底以形成一个或多个通孔阵列,在每个通孔阵列中沉积分层,在每个通孔阵列中沉积一个或多个金属以形成探针尖端结构, 以及在未被分层层覆盖的探针尖端结构的一部分上沉积接合合金。 此外,提供了用于传送可转移的探针尖端的技术,包括从探针尖端结构去除处理器基底,以及通过将探针尖端结构连接到目标探针头基底的倒装芯片来传送探针尖端结构。