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1. 发明公开

US20240267020A1 PIEZOELECTRIC RESONATOR PLATE AND PIEZOELECTRIC RESONATOR DEVICE 审中-公开
公开(公告)号：US20240267020A1
公开(公告)日：2024-08-08
申请号：US18563142
申请日：2022-06-22
申请人： DAISHINKU CORPORATION
发明人： Manabu ONISHI , Hiroki FUJIWARA
IPC分类号： H03H9/02 , H03H9/10 , H03H9/19
CPC分类号： H03H9/02133 , H03H9/1035 , H03H9/19
摘要： A crystal resonator plate according to one or more embodiments may include: a vibrating part; an external frame part surrounding an outer periphery of the vibrating part; and a support part connecting the vibrating part to the external frame part. A plurality of crystal faces is formed on respective side surfaces of the external frame part and the support part. The respective side surfaces are connected to a connecting part of the external frame part and the support part. A plurality of ridge lines is formed by the plurality of crystal faces. An intersection blocking part is provided on the connecting part of the external frame part and the support part, on at least one side of a first main surface side and a second main surface side thereof, to block intersection of two or more of the ridge lines on the connecting part.

2. 发明公开

US20240039505A1 PIEZOELECTRIC RESONATOR DEVICE 审中-公开
公开(公告)号：US20240039505A1
公开(公告)日：2024-02-01
申请号：US18265690
申请日：2021-12-13
申请人： DAISHINKU CORPORATION
发明人： Satoru ISHINO , Hiroaki YAMASHITA
IPC分类号： H03H9/02 , H03H9/10 , H03H9/19
CPC分类号： H03H9/02086 , H03H9/1035 , H03H9/19
摘要： A piezoelectric resonator device according to one or more embodiments may be provided, in which a crystal resonator plate includes a cutout part between a vibrating part and an external frame part, and a metal film formed on a first main surface of a first sealing member is electrically connected to an external electrode terminal formed on a second main surface, which does not face an internal space, of a second sealing member via a first internal wiring formed on an inner wall surface of the external frame part.

3. 发明申请

US20160329484A1 Piezoelectric Resonator Device, and Bonding Structure of Piezoelectric Resonator Device and Circuit Board 审中-公开
标题翻译：压电谐振器器件和压电谐振器器件和电路板的接合结构
公开(公告)号：US20160329484A1
公开(公告)日：2016-11-10
申请号：US15109645
申请日：2014-12-22
申请人： Daishinku Corporation
发明人： Minoru IIZUKA , Takuya KOJO
IPC分类号： H01L41/31 , H03H9/125 , H03H9/10 , H03H9/15
CPC分类号： H01L41/31 , H01L2924/0002 , H03H9/0552 , H03H9/10 , H03H9/1035 , H03H9/125 , H03H9/15 , H03H9/17 , H01L2924/00
摘要： A crystal resonator includes: a crystal resonator plate; a first sealing member that covers a first excitation electrode of the crystal resonator plate; and a second sealing member that covers a second excitation electrode of the crystal resonator plate and includes a first external electrode terminal and a second external electrode terminal to be bonded to a circuit board using a flowable conductive bonding material. The second sealing member includes a second through hole and a third through hole that pass through between a first main surface and a second main surface on which the first external electrode terminal and the second external electrode terminal are formed. The second through hole and the third through hole include: respective through electrodes for conduction between electrodes formed on the first main surface and the second main surface; and respective through parts.
摘要翻译：晶体谐振器包括：晶体谐振器板; 覆盖所述晶体谐振器板的第一激励电极的第一密封构件; 以及第二密封构件，其覆盖所述晶体谐振器板的第二激励电极，并且包括使用可流动的导电接合材料接合到电路板的第一外部电极端子和第二外部电极端子。第二密封构件包括通过第一主表面和形成有第一外部电极端子和第二外部电极端子的第二主表面之间的第二通孔和第三通孔。第二通孔和第三通孔包括：形成在第一主表面和第二主表面上的电极之间的导电的相应通孔; 和相应的通过部件。

4. 发明申请

US20150349746A1 ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT 有权
标题翻译：电子设备，电子设备和移动对象
公开(公告)号：US20150349746A1
公开(公告)日：2015-12-03
申请号：US14721441
申请日：2015-05-26
申请人： Seiko Epson Corporation
发明人： Takashi YAMAZAKI , Masahiro ISHII
IPC分类号： H03H9/21 , H03H9/10
CPC分类号： H03H9/21 , H03H9/1035 , H03H2003/026
摘要： A vibrator (electronic device) includes: a vibrator element including vibrating arms; a base portion supporting the vibrator element and having a rectangular shape in a plan view; and a lid provided on the side of the vibrator element opposite to the base portion 3. Extending directions of long and short sides of the base portion and an extending direction of the vibrating arms cross each other. When an angle formed by the vibrating arms and a Y-axis direction is θ, the angle θ is more than 0° and less than 90°.
摘要翻译：振动器（电子设备）包括：包括振动臂的振动器元件; 支撑振动元件并且在俯视图中具有矩形形状的基部; 以及设置在与基部3相对的振动器元件侧的盖。延伸基部的长边和短边方向以及振动臂的延伸方向彼此交叉。当由振动臂和Y轴方向形成的角度为θ时，角度和角度; 大于0°且小于90°。

5. 发明授权

US08928207B2 Tuning-fork type quartz-crystal vibrating pieces and piezoelectric devices having low crystal impedance 有权
标题翻译：调音叉型石英振动片和低结晶阻抗的压电器件
公开(公告)号：US08928207B2
公开(公告)日：2015-01-06
申请号：US13422913
申请日：2012-03-16
申请人： Shingo Kawanishi
发明人： Shingo Kawanishi
IPC分类号： H03H9/21 , H03H9/05 , H03H9/10
CPC分类号： H03H9/21 , H03H9/0595 , H03H9/1035
摘要： Tuning-fork type quartz-crystal vibrating pieces are disclosed, of which the vibration frequency can be adjusted without increasing CI. An exemplary piezoelectric device has a pair of vibrating arms extending in a predetermined direction from a first edge of a base. Respective first grooves are defined in a first principal surface of the vibrating arms. The first grooves extend in the predetermined direction, and have first excitation electrodes extending from a back-edge surface but not completely to a front-edge surface of the grooves. Respective second grooves are defined in a second principal surface, opposite the first principal surface, of the vibrating arms. The second grooves extend in the predetermined direction, and have second excitation electrodes extending from a back-edge surface completely to a front-edge surface of the second grooves.
摘要翻译：公开了调音叉式石英振动片，其振动频率可以在不增加CI的情况下进行调节。示例性压电装置具有从基座的第一边沿预定方向延伸的一对振动臂。相应的第一凹槽限定在振动臂的第一主表面中。第一凹槽沿预定方向延伸，并且具有从后边缘表面而不是完全延伸到凹槽的前边缘表面的第一激发电极。相应的第二凹槽限定在振动臂的与第一主表面相对的第二主表面中。第二槽沿预定方向延伸，并且具有从后边缘表面完全延伸到第二槽的前边缘表面的第二激励电极。

6. 发明授权

US08723401B2 Piezoelectric device with a package including a convex part 失效
公开(公告)号：US08723401B2
公开(公告)日：2014-05-13
申请号：US14031447
申请日：2013-09-19
申请人： Seiko Epson Corporation
发明人： Katsuo Ishikawa , Akitoshi Hara
IPC分类号： H03H9/215 , H03H9/19 , H03H9/10
CPC分类号： H03H9/1035 , G01C19/5607 , H01L41/053 , H01L41/107 , H03B5/32 , H03H9/1021 , H03H9/19 , H03H9/21
摘要： A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.

7. 发明授权

US08689415B2 Methods for manufacturing piezoelectric devices 失效
标题翻译：制造压电元件的方法
公开(公告)号：US08689415B2
公开(公告)日：2014-04-08
申请号：US12761342
申请日：2010-04-15
申请人： Kozo Ono , Takahiro Inoue
发明人： Kozo Ono , Takahiro Inoue
IPC分类号： H04R17/00 , H01L41/277 , H01L41/04 , H01L41/047 , H01L41/053 , H01L41/083 , H01L41/23 , H01L41/25 , H01L41/293 , H01L41/297 , H03H3/02 , H03H9/17
CPC分类号： H01L41/277 , H01L41/042 , H01L41/0474 , H01L41/0475 , H01L41/053 , H01L41/083 , H01L41/23 , H01L41/25 , H01L41/293 , H01L41/297 , H03H3/02 , H03H9/0595 , H03H9/1035 , H03H9/178 , H03H9/21 , H03H2003/026 , Y10T29/42 , Y10T29/49005 , Y10T29/4908 , Y10T29/49798
摘要： In an exemplary method for manufacturing a piezoelectric device, a lid wafer, a piezoelectric wafer, and a base wafer are prepared. Each wafer defines multiple lids, multiple piezoelectric vibrating pieces, and multiple bases, respectively. The piezoelectric vibrating pieces comprise respective first and second electrodes, and the base wafer is made of glass. The bases comprise respective first and second metal wires extending therethrough, each wire having a respective end and a respective side surface at the end that protrudes at least partially from the first surface. A wafer sandwich is formed with the three wafers co-aligned with each other, with the protruding ends of the wires contacting respective first and second electrodes. The layers are anodic bonded together, which also bonds the protruding ends of the first and second wires to the respective first and second electrodes. The bonded wafer sandwich is cut into separate individual piezoelectric devices thus formed in the sandwich from each other.
摘要翻译：在制造压电元件的示例性方法中，制备了盖晶片，压电晶片和基底晶片。每个晶片分别限定多个盖，多个压电振动片和多个基座。压电振动片包括相应的第一和第二电极，并且基底晶片由玻璃制成。基部包括从其延伸穿过的相应的第一和第二金属丝，每根线具有相应的端部和在端部处的至少部分地从第一表面突出的相应侧表面。晶片三明治形成有三个晶片彼此共同对准，导线的突出端与相应的第一和第二电极接触。这些层是阳极结合在一起的，其也将第一和第二导线的突出端连接到相应的第一和第二电极。将键合晶片夹层切割成彼此形成为夹层的单独的各个压电元件。

8. 发明申请

US20140047687A1 PIEZOELECTRIC RESONATOR DEVICE, MANUFACTURING METHOD FOR PIEZOELECTRIC RESONATOR DEVICE, AND METHOD FOR ETCHING CONSTITUENT MEMBER OF PIEZOELECTRIC RESONATOR DEVICE 审中-公开
标题翻译：压电谐振器装置，用于压电谐振器装置的制造方法和用于蚀刻压电谐振器装置的构成部件的方法
公开(公告)号：US20140047687A1
公开(公告)日：2014-02-20
申请号：US14057076
申请日：2013-10-18
申请人： DAISHINKU CORPORATION
发明人： Naoki Kohda , Hiroki Yoshioka
IPC分类号： H01L41/332
CPC分类号： H01L41/332 , B01D2325/02 , C23C8/40 , C23C12/00 , H01L23/3731 , H01L23/3732 , H01L23/3733 , H01L31/18 , H01L31/1804 , H01L41/23 , H01L41/25 , H01L41/29 , H01L41/33 , H01L2924/0002 , H03H3/02 , H03H9/0547 , H03H9/0552 , H03H9/1035 , H03H9/19 , H03H2003/045 , H03H2003/0457 , Y10T29/42 , H01L2924/00
摘要： A piezoelectric vibration device includes a piezoelectric vibration plate where an excitation electrode is formed, and an upper lid member and a lower lid member that hermetically seal the excitation electrode, the piezoelectric vibration plate having a region where the upper lid member is joined and a region where the lower lid member is joined, on front and back main surfaces, the upper lid member having a region on one main surface where the piezoelectric vibration plate is joined, and the lower lid member having a region on one main surface where the piezoelectric vibration plate is joined. At least one of a substrate of the joining region of the piezoelectric vibration plate, a substrate of the joining region of the upper lid member, and a substrate of the joining region of the lower lid member has a roughened surface.
摘要翻译：压电振动装置包括形成有激励电极的压电振动板以及气密密封激励电极的上盖部件和下盖部件，压电振动板具有上盖部件接合的区域和区域所述下盖构件在前后主表面上接合的上盖构件，所述上盖构件在压电振动板的一个主表面上具有区域，并且所述下盖构件在一个主表面上具有压电振动板块加入。压电振动板的接合区域的基板，上盖部件的接合区域的基板和下盖部件的接合区域的基板中的至少一个具有粗糙面。

9. 发明授权

US08610337B2 Piezoelectric device and method for manufacturing same 失效
标题翻译：压电元件及其制造方法
公开(公告)号：US08610337B2
公开(公告)日：2013-12-17
申请号：US13120256
申请日：2009-09-24
申请人： Hiroshi Kawahara
发明人： Hiroshi Kawahara
IPC分类号： H01L41/00
CPC分类号： H03H9/1035 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H03H9/0595 , H01L2924/00
摘要： A piezoelectric device employs solder on a roughened surface to improve bonding of electrical contacts with the device package. The device package includes a base, a crystal frame and a lid. The base includes connecting electrodes on a side of the base adjacent the crystal frame. The base has a through hole and a through hole electrode formed in the through hole in electrical contact with the connecting electrodes. The through hole is sealed with a sealing material and a first external electrode layer, which is electrically connected to the through hole electrode, is formed on an outside surface of the base opposite the piezoelectric plate. A second external electrode layer is formed to cover the first external electrode layer and the sealing material.
摘要翻译：压电装置在粗糙表面上使用焊料来改善电触点与器件封装的结合。该装置包装包括底座，水晶框架和盖子。底座包括在与水晶框架相邻的底座一侧的连接电极。基座具有通孔和形成在通孔中的与通孔电连接的电气接触的通孔电极。通孔用密封材料密封，与通孔电极电连接的第一外部电极层形成在与压电板相对的基座的外表面上。形成第二外部电极层以覆盖第一外部电极层和密封材料。

10. 发明授权

US08531092B2 Surface-mountable piezoelectric devices including eutectic-bonded packages 有权
标题翻译：可表面贴装的压电器件，包括共晶封装
公开(公告)号：US08531092B2
公开(公告)日：2013-09-10
申请号：US13092871
申请日：2011-04-22
申请人： Ryoichi Ichikawa , Shuichi Mizusawa
发明人： Ryoichi Ichikawa , Shuichi Mizusawa
IPC分类号： H01L41/053
CPC分类号： H03H9/1035 , H03H9/0519
摘要： Piezoelectric devices are disclosed that are mountable on the surface of a printed circuit board or the like. An exemplary device comprises a piezoelectric vibrating piece enclosed and sealed within a package including at least a cover and a base-substrate formed of glass or piezoelectric material. The package includes frame-shaped metallic films formed in peripheral regions of inner main surfaces of the cover and/or the base substrate. The frame-shaped metallic films are used for sealing the package using a eutectic material (e.g., solder). At least one mounting terminal is provided on the outer (bottom) main surface of the base-substrate. At least one of the frame-shaped metallic films and mounting terminals includes a chromium foundation layer formed on the surface of the glass or piezoelectric material, a middle layer of NiW alloy formed on the surface of the chromium layer, and a gold layer formed on the surface of the middle layer.
摘要翻译：公开了可安装在印刷电路板等的表面上的压电器件。示例性装置包括封装并密封在包括至少由玻璃或压电材料形成的盖和基底基板的封装内的压电振动片。该封装包括形成在盖和/或基底基板的内主表面的周边区域中的框状金属膜。框状金属膜用于使用共晶材料（例如焊料）密封封装。至少一个安装端子设置在基底基板的外（底）主表面上。框状金属膜和安装端子中的至少一个包括形成在玻璃或压电材料的表面上的铬基底层，形成在铬层的表面上的NiW合金的中间层和形成在铬层上的金层中间层的表面。

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