会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Method of electroplating semiconductor wafer using variable currents and
mass transfer to obtain uniform plated layer
    • 使用可变电流和质量传递电镀半导体晶片以获得均匀的镀层的方法
    • US06162344A
    • 2000-12-19
    • US393226
    • 1999-09-09
    • Jonathan D. ReidRobert J. ContoliniEdward C. OpocenskyEvan E. PattonEliot K. Broadbent
    • Jonathan D. ReidRobert J. ContoliniEdward C. OpocenskyEvan E. PattonEliot K. Broadbent
    • C25D5/18C25D7/12C25D5/00
    • C25D5/18C25D7/123Y10S205/915
    • In electroplating a metal layer on a semiconductor wafer, the resistive voltage drop between the edge of the wafer, where the electrical terminal is located, and center of the wafer causes the plating rate to be greater at the edge than at the center. As a result of this so-called "terminal effect", the plated layer tends to be concave. This problem is overcome by first setting the current at a relatively low level until the plated layer is sufficiently thick that the resistive drop is negligible, and then increasing the current to improve the plating rate. Alternatively, the portion of the layer produced at the higher current can be made slightly convex to compensate for the concave shape of the portion of the layer produced at the lower current. This is done by reducing the mass transfer of the electroplating solution near the edge of the wafer to the point that the electroplating process is mass transfer limited in that region. As a result, the portion of the layer formed under these conditions is thinner near the edge of the wafer.
    • 在电镀半导体晶片上的金属层时,电极端子所在的晶片边缘与晶片的中心之间的电阻电压降使得电镀速率在边缘比在中心处更大。 作为这种所谓的“终端效应”的结果,镀层倾向于是凹的。 通过首先将电流设置在相对低的电平直到电镀层足够厚以使电阻降可忽略,然后增加电流以提高电镀速率来克服该问题。 或者,可以使在较高电流下产生的层的部分略微凸起,以补偿在较低电流下产生的层的部分的凹形。 这是通过减少靠近晶片边缘的电镀溶液的质量传递来实现的,即在该区域中电镀过程被传质限制。 结果,在这些条件下形成的层的部分在晶片的边缘附近更薄。
    • 6. 发明授权
    • Electrochemical synthesis of crystalline compound or alloy films
    • 结晶化合物或合金膜的电化学合成
    • US06228243B1
    • 2001-05-08
    • US09246676
    • 1999-02-08
    • Shalini Menezes
    • Shalini Menezes
    • C25D510
    • C30B7/12C25D9/00C25D21/12C30B7/00C30B7/005C30B29/46C30B29/48Y10S205/915
    • A new method to synthesize crystalline films, superlattices and multilayered devices based on metallic or semiconductor compounds or alloys in electrolyte media on non-crystalline substrates. An automated sequence of flow, equilibration and underpotential electrodeposition from a single electrolyte comprising the film constituents leads to the synthesis of stoichiometric, epitaxial layers. The invention process is based on a new concept of electrochemical molecular layer epitaxy; it provides a relatively simple, fast and inexpensive method to fabricate a wide range of high quality technological materials, ranging from large-area single phase films to multiple quantum-well structures.
    • 一种基于金属或半导体化合物或合金在非结晶基质上的电解质介质中合成晶体膜,超晶格和多层器件的新方法。 由包含膜组分的单一电解质的自动顺序的流动,平衡和欠电位电沉积导致化学计量的外延层的合成。 本发明方法基于电化学分子层外延的新概念; 它提供了一种相对简单,快速和便宜的方法来制造广泛的高质量技术材料,从大面积单相膜到多个量子阱结构。