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    • 15. 发明授权
    • Line scan sequential lateral solidification of thin films
    • 线扫描顺序横向固化薄膜
    • US08221544B2
    • 2012-07-17
    • US11293655
    • 2005-12-02
    • James S. ImPaul C. Van Der Wilt
    • James S. ImPaul C. Van Der Wilt
    • C30B13/00
    • H01L21/02686B23K26/0738C30B13/00C30B13/24C30B29/06H01L21/02532H01L21/02678H01L21/2026H01L27/1285H01L27/1296Y10T117/10Y10T117/1004Y10T117/1008
    • A polycrystalline film is prepared by (a) providing a substrate having a thin film disposed thereon, said film capable of laser-induced melting, (b) generating a sequence of laser pulses having a fluence that is sufficient to melt the film throughout its thickness in an irradiated region, each pulse forming a line beam having a predetermined length and width, said width sufficient to prevent nucleation of solids in a portion of the thin film that is irradiated by the laser pulse, (c) irradiating a first region of the film with a first laser pulse to form a first molten zone, said first molten zone demonstrating a variation in width along its length to thereby define a maximum width (Wmax) and a minimum width (Wmin), wherein the first molten zone crystallizes upon cooling to form one or more laterally grown crystals, (d) laterally moving the film in the direction of lateral growth a distance that is greater than about one-half Wmax and less than Wmin; and (e) irradiating a second region of the film with a second laser pulse to form a second molten zone having a shape that is substantially the same as the shape of the first molten zone, wherein the second molten zone crystallizes upon cooling to form one or more laterally grown crystals that are elongations of the one or more crystals in the first region.
    • 通过(a)提供具有设置在其上的薄膜的基板,所述膜能够进行激光诱导熔化,(b)产生具有足以使膜在整个厚度上熔化的能量密度的激光脉冲序列来制备多晶膜 在照射区域中,每个脉冲形成具有预定长度和宽度的线束,所述宽度足以防止由激光脉冲照射的薄膜部分中的固体成核,(c)照射第一区域 具有第一激光脉冲以形成第一熔融区的第一熔融区,所述第一熔融区表现出沿其长度的宽度变化,从而限定最大宽度(Wmax)和最小宽度(Wmin),其中第一熔融区在冷却时结晶 以形成一个或多个横向生长的晶体,(d)沿横向生长方向横向移动所述膜的距离大于约一半Wmax且小于Wmin; 和(e)用第二激光脉冲照射所述膜的第二区域以形成具有与所述第一熔融区域的形状基本相同的形状的第二熔融区域,其中所述第二熔融区域在冷却时结晶以形成一个 或更多横向生长的晶体,其是第一区域中的一种或多种晶体的伸长率。
    • 19. 发明授权
    • Soi wafer and a method for producing the same
    • 硅晶片及其制造方法
    • US07518187B2
    • 2009-04-14
    • US10546693
    • 2004-03-12
    • Masahiro Sakurada
    • Masahiro Sakurada
    • C30B13/00H01L29/94H01L21/331
    • C30B29/06C30B15/203H01L21/76243H01L21/76254
    • The present invention is an SOI wafer in which at least a silicon active layer is formed over a support substrate via an insulator film or on a support substrate directly, wherein, at least, the silicon active layer consists of a P(phosphorus)-doped silicon single crystal grown by Czochralski method, which is occupied by N region and/or defect-free I region, and contains Al (aluminum) with concentration of 2×1012 atoms/cc or more. There can be provided with ease and at low cost an SOI wafer with high electrical reliability in a device fabrication process, that has an excellent electric property without generation of micro pits by cleaning with hydrofluoric acid etc. even in the case of forming an extremely thin silicon active layer, or that retains high insulation property even in the case of forming an extremely thin inter-layer insulator film.
    • 本发明是一种SOI晶片,其中至少有一个硅有源层经由绝缘膜或直接在支撑衬底上形成在支撑衬底上,其中至少硅活性层由P(磷)掺杂 通过Czochralski法生长的硅单晶,其被N区和/或无缺陷I区占据,并且含有浓度为2×10 12原子/ cc以上的Al(铝)。 可以容易且廉价地提供在器件制造工艺中具有高电可靠性的SOI晶片,即使在形成非常薄的情况下也具有优异的电性能而不产生微凹坑,甚至通过用氢氟酸等清洗 硅的有源层,即使在形成极薄的层间绝缘膜的情况下也能够保持高的绝缘性。