专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

81. 发明授权

US5826329A Method of making printed circuit board using thermal transfer techniques 失效
标题翻译：使用热转印技术制作印刷电路板的方法
公开(公告)号：US5826329A
公开(公告)日：1998-10-27
申请号：US574734
申请日：1995-12-19
申请人： Joseph D. Roth
发明人： Joseph D. Roth
IPC分类号： H05K3/04 , H05K3/20 , H05K3/12 , H05K3/46
CPC分类号： H05K3/046 , H05K3/207 , H01L2221/68363 , H05K2203/0195 , H05K2203/0528 , H05K2203/1105 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156
摘要： A method of making a printed circuit board using thermal transfer techniques to transfer electrically conductive coating from a thermal transfer ribbon to a non-conductive surface of a non-conductive receiver board. The electrically conductive material transferred to the receiver board form traces on the non-conductive surface of the non-conductive receiver board, thus providing a printed circuit board.
摘要翻译：使用热转印技术制造印刷电路板的方法，其将导电涂层从热转印带转移到非导电接收板的非导电表面。转移到接收器板的导电材料在非导电接收器板的非导电表面上形成迹线，从而提供印刷电路板。

82. 发明授权

US5759683A Holographic document with holographic image or diffraction pattern directly embossed thereon 失效
$Holographic document with holographic image or diffraction pattern directly embossed thereon$
标题翻译：具有直立压花的全息图像或衍射图案的全息文件
公开(公告)号：US5759683A
公开(公告)日：1998-06-02
申请号：US495183
申请日：1995-06-27
申请人： David R. Boswell
发明人： David R. Boswell
IPC分类号： B29C59/04 , B29D11/00 , B32B7/02 , B32B7/06 , B32B15/08 , B32B27/00 , B32B37/22 , B32B38/04 , B32B38/06 , B41M1/22 , B41M1/24 , B41M3/14 , B41M7/00 , B42D15/10 , B44C1/17 , G03H1/02 , G03H1/18 , H05K3/04 , B32B7/12 , B32B15/04
CPC分类号： B32B38/06 , B29C59/046 , B29D11/0073 , B32B15/08 , B32B37/22 , B32B38/00 , B32B38/1841 , B32B7/06 , B41M1/22 , B41M1/24 , B41M3/14 , B41M7/0027 , B44C1/1729 , G03H1/0252 , B29L2017/00 , B32B2425/00 , B32B2429/00 , B42D25/328 , G03H1/0244 , G03H1/028 , G03H2227/04 , G03H2240/55 , G03H2250/10 , G03H2250/12 , G03H2250/40 , H05K3/046 , Y10S428/913 , Y10T156/1041 , Y10T428/1338 , Y10T428/1438 , Y10T428/1443 , Y10T428/1457 , Y10T428/24802 , Y10T428/24942 , Y10T428/24975 , Y10T428/263 , Y10T428/265 , Y10T428/2804 , Y10T428/2813 , Y10T428/2817 , Y10T428/2826 , Y10T428/31504 , Y10T428/31663 , Y10T428/31667 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31696 , Y10T428/31699 , Y10T428/31703 , Y10T428/31714 , Y10T428/31786 , Y10T428/31801 , Y10T428/31935
摘要： A holographic article and method for forming permits the party producing the final document to print the holographic image directly on the final document thereby permitting such party to retain and maintain control of its own embossing shim on which the hologram has been formed and which is utilized for embossing the holographic image on the document. A film upon which a holographic image can be directly stamped upon the final document includes a layer of metal having a thickness in the range of 20 millimicrons to 100 millimicrons, a lacquer coating having a thickness in the range of 0.5 microns to 3 microns and a heat activatible adhesive. The metal layer lacquer coating and heat activatible adhesive are caused to be adhered to the substrate forming the final document during a stamping operation which releases said metal layer, lacquer coating and heat activatible adhesive from a plastic carrier film to which had initially been applied.
摘要翻译：全息制品和成型方法允许生产最终文件的一方直接在最终文件上打印全息图像，从而允许这些缔约方保留并维持已经形成全息图的其自己的压花垫片的控制，并且其用于在文件上压印全息图像。全息图像可以直接印在最终文件上的胶片包括厚度在20毫微米至100毫微米范围内的金属层，厚度在0.5微米至3微米范围内的漆层和热敏性粘合剂。在冲压操作期间，将金属层漆层和热活性粘合剂粘附到形成最终文件的基材上，从最初施加的塑料载体膜释放所述金属层，漆层和热活性粘合剂。

83. 发明授权

US5733465A Process for producing cutting die and produced cutting die 失效
标题翻译：生产切割模具和生产切割模具的工艺
公开(公告)号：US5733465A
公开(公告)日：1998-03-31
申请号：US529432
申请日：1995-09-18
申请人： Yoshihito Kitamura , Yasuo Sumikawa , Ryuichi Hayashi , Shigeo Ogawa
发明人： Yoshihito Kitamura , Yasuo Sumikawa , Ryuichi Hayashi , Shigeo Ogawa
IPC分类号： B26F1/00 , B23P15/40 , B26F1/38 , C23F1/02 , G03F7/00 , H05K3/04 , B44C1/22 , C23F1/00
CPC分类号： B23P15/406 , C23F1/02 , G03F7/00 , H05K3/041
摘要： A cutting die is produced by a process of forming resist patterns corresponding to the shapes of low cutting edges and resist patterns corresponding to the shapes of high cutting edges on a metal plate and conducting an etching treatment on the metal plate, wherein the height of each of the cutting edges is varied by varying the width of the relevant resist pattern, varying the timing of removing the relevant resist pattern and applying or not applying sealing treatment thereto. This process enables easy production of a cutting die provided either with low cutting edges and high cutting edges or with embossing parts and high cutting edges. Further, the use of this cutting die enables simultaneous execution of full cutting and half cutting (or embossing) operations, so that labels, box development base papers and the like can be produced by a single process.
摘要翻译：通过形成对应于与金属板上的高切削刃的形状相对应的低切削刃和抗蚀剂图案的形状的抗蚀剂图案并对金属板进行蚀刻处理的工艺来生产切割模，其中每个通过改变相关抗蚀剂图案的宽度，改变去除相关抗蚀剂图案的时间并施加或不对其施加密封处理来改变切割刃的位置。该方法能够容易地生产具有低切削刃和高切削刃或具有压花部件和高切削刃的切削模具。此外，使用该切割模具能够同时执行全切割和半切割（或压花）操作，从而可以通过单个处理来生产标签，盒子开发基础纸等。

84. 发明授权

US5725706A Laser transfer deposition 失效
标题翻译：激光转印沉积
公开(公告)号：US5725706A
公开(公告)日：1998-03-10
申请号：US628752
申请日：1996-03-12
申请人： Eben Daniel Thoma , Richard Taylor Williams , Jeff Cherng-chou Wu
发明人： Eben Daniel Thoma , Richard Taylor Williams , Jeff Cherng-chou Wu
IPC分类号： C23C14/04 , C23C14/28 , C23C26/00 , H05K3/04 , B05D3/06
CPC分类号： C23C26/00 , C23C14/048 , C23C14/28 , H05K3/046
摘要： The present invention is directed to a method for producing a smooth and continuous pressure bonded layer of a material on a base substrate through the driving force of a pulsed laser. The method comprises the steps of selecting a laser absorptive material. Then applying thereto a thin layer of the material for pressure bonding to the base substrate. Next, placing the base substrate and the thin layer of material on the laser absorptive material in a vacuum, then placing the base substrate in close proximity to the thin layer of material. Finally, directing pulsed laser energy toward the laser absorptive material and the layer to be pressure bonded, whereby the laser energy is absorbed by the laser absorptive material causing heating and vaporization thereof to a controlled depth of the laser absorptive material, leaving remaining portions of the laser absorptive material unvaporized after the vaporization to act as a support for the material to be bonded. After bonding, the thin material adheres to the base substrate when the remaining continuous absorptive material is peeled away, the vaporization having provided the necessary pressure for pressure bonding on to the base material.
摘要翻译：本发明涉及通过脉冲激光器的驱动力在基底基板上制造光滑且连续的压接层的方法。该方法包括选择激光吸收材料的步骤。然后向其施加用于压力结合到基底基板的材料的薄层。接下来，将真空中的基底基板和薄层材料放置在激光吸收材料上，然后将基底基板放置在薄层材料附近。最后，将脉冲激光能量引向激光吸收材料和待压接的层，由此激光能量被激光吸收材料吸收，从而将激光吸收材料加热并蒸发到激光吸收材料的受控深度，留下剩余部分在蒸发后未蒸发的激光吸收材料用作待结合材料的载体。接合后，当剩余的连续吸收材料被剥离时，薄材料粘附到基底基板上，汽化已经为基材提供了压力粘合所需的压力。

85. 发明授权

US5676866A Apparatus for laser machining with a plurality of beams 失效
标题翻译：具有多个光束的激光加工装置
公开(公告)号：US5676866A
公开(公告)日：1997-10-14
申请号：US422577
申请日：1995-04-14
申请人： Joachim Schulte in den Baumen , Robert Grub , Herbert Gross , Jurgen Schweizer , Hans-Jurgen Kahlert , Siegfrid Dippon , Wilhelm Tamm , Si-Ty Lam , Heinrich Endert
发明人： Joachim Schulte in den Baumen , Robert Grub , Herbert Gross , Jurgen Schweizer , Hans-Jurgen Kahlert , Siegfrid Dippon , Wilhelm Tamm , Si-Ty Lam , Heinrich Endert
IPC分类号： B23K26/04 , B23K26/06 , B23K26/067 , B23K26/42 , B23K101/42 , H05K1/03 , H05K3/00 , H05K3/04 , H05K3/10 , H05K3/18 , H05K3/38 , H05K3/42
CPC分类号： B23K26/0673 , B23K26/04 , B23K26/0604 , B23K26/067 , B23K26/702 , H05K3/045 , H05K3/107 , H05K3/188 , H05K1/036 , H05K2201/0329 , H05K2201/0347 , H05K2201/0376 , H05K2201/09036 , H05K2203/025 , H05K2203/107 , H05K3/0017 , H05K3/0023 , H05K3/0032 , H05K3/105 , H05K3/108 , H05K3/388 , H05K3/426
摘要： An apparatus for laser machining by creating a plurality of discrete and separate beams which are sent to a deflecting device including a support and a plurality of individual elements that act independently and are individually controlled to machine different points on the workpiece simultaneously.
摘要翻译：一种用于激光加工的设备，其通过产生多个离散和分离的梁，其被发送到偏转装置，所述偏转装置包括支撑件和独立地起作用并且被单独地控制以在所述工件上同时加工不同点的多个单独元件。

86. 发明授权

US5620286A Flycutting machine for manufacturing printed circuit boards 失效
标题翻译：用于制造印刷电路板的飞切机
公开(公告)号：US5620286A
公开(公告)日：1997-04-15
申请号：US336847
申请日：1994-11-09
申请人： David H. Youden
发明人： David H. Youden
IPC分类号： B23Q17/22 , H05K3/04 , B23C3/00
CPC分类号： B23Q17/2233 , H05K3/045 , Y10T409/305208 , Y10T409/30672 , Y10T409/306944 , Y10T409/307336
摘要： A flycutting apparatus and a method of manufacturing printed circuit boards are disclosed. The flycutting apparatus may include a sensor for detecting changes in the relative positioning of an associated rotatable flywheel and the surface of an object, such as a web of flexible printed circuit board, to be machined. The sensor is adapted to send signals to an adjustment device of the flycutting apparatus during machining operations whereby the adjustment device responds to the signals by adjusting the relative position of the rotatable flywheel with respect to the surface of the object. The flycutting apparatus may include a horizontally arranged slide assembly in conjunction with a vertically arranged slide assembly and a translation device for translating movement of the horizontally arranged slide assembly to vertical movement of an associated rotatable flywheel along the vertical slide assembly. The flycutting apparatus may be used to manufacture printed circuit boards without requiring the use of photoresist and acid-based etching solutions.
摘要翻译：公开了一种飞切设备和制造印刷电路板的方法。飞切装置可以包括用于检测相关联的可旋转飞轮和待加工的物体（例如柔性印刷电路板的腹板）的相对定位的变化的传感器。该传感器适于在加工操作期间将信号发送到飞切设备的调节装置，由此调节装置通过调节可旋转飞轮相对于物体表面的相对位置来响应信号。飞切设备可以包括水平布置的滑动组件，其结合垂直布置的滑动组件和平移装置，用于将水平布置的滑动组件的运动转换成相关联的可旋转飞轮沿垂直滑动组件的垂直运动。飞切设备可用于制造印刷电路板，而不需要使用光致抗蚀剂和酸基蚀刻溶液。

87. 发明授权

US5584120A Method of manufacturing printed circuits 失效
标题翻译：制造印刷电路的方法
公开(公告)号：US5584120A
公开(公告)日：1996-12-17
申请号：US358851
申请日：1994-12-19
申请人： Joseph A. Roberts
发明人： Joseph A. Roberts
IPC分类号： H01R31/00 , H05K1/03 , H05K3/04 , H05K3/28 , H05K3/32 , H05K3/38 , H05K3/46 , H05K7/14 , H05K9/00 , H05K3/02
CPC分类号： H01R31/00 , H05K3/045 , H05K3/4614 , H05K7/1451 , H05K9/0039 , H05K1/036 , H05K2201/0195 , H05K2201/0355 , H05K2201/0367 , H05K2201/0382 , H05K2201/0715 , H05K2203/025 , H05K2203/063 , H05K3/281 , H05K3/328 , H05K3/386 , H05K3/4647 , Y10T29/49155 , Y10T29/49156
摘要： A process and apparatus for producing supported conductive networks which can be flexible or rigid, having densely packed circuits. The process and apparatus for making the conductive network involves forming a conductive material supported on a "dynamic pressure cushion" into a non-planar pattern defining the desired conductive circuits in relation to a fixed reference plane. The "dynamic pressure cushion" is a material having suitable viscosity and flow characteristics to flow out from under the conductive material as it is being formed and fill up any voids. To ensure that the "dynamic pressure cushion" properly flows without deforming the desired circuits, the die used to form the conductive material is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane leaving the desired conductive circuits.
摘要翻译：一种用于生产支撑导电网络的方法和装置，其可以是柔性的或刚性的，具有密集堆积的电路。用于制造导电网络的方法和装置包括将支撑在“动态压力衬垫”上的导电材料形成为限定相对于固定参考平面的所需导电电路的非平面图案。 “动态压力缓冲垫”是具有适当的粘度和流动特性的材料，当它被形成时从导电材料下面流出并填充任何空隙。为了确保“动态压力缓冲垫”适当地流动而不使所需的电路变形，用于形成导电材料的模具设置有材料流动控制网格和材料膨胀槽。在形成不需要的材料之后，以与尺寸相关的方式机械地移除留下所需导电电路的参考平面。

88. 发明授权

US5528001A Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths 失效
标题翻译：在具有与路径电绝缘的隔离导电特征网格的电介质上的导电路径的电路
公开(公告)号：US5528001A
公开(公告)日：1996-06-18
申请号：US358855
申请日：1994-12-19
申请人： Joseph A. Roberts
发明人： Joseph A. Roberts
IPC分类号： B21D22/02 , B21D31/00 , H01R31/00 , H05K1/03 , H05K3/04 , H05K3/28 , H05K3/32 , H05K3/38 , H05K3/46 , H05K7/14 , H05K9/00 , H05K1/00
CPC分类号： H01R31/00 , H05K3/045 , H05K3/4614 , H05K7/1451 , H05K9/0039 , H05K1/036 , H05K2201/0195 , H05K2201/0355 , H05K2201/0367 , H05K2201/0382 , H05K2201/0715 , H05K2203/025 , H05K2203/063 , H05K3/281 , H05K3/328 , H05K3/386 , H05K3/4647 , Y10T29/49155
摘要： A process and apparatus for producing supported conductive networks which can be flexible or rigid, having densely packed circuits. The process and apparatus for making the conductive network involves forming a conductive material supported on a "dynamic pressure cushion" into a non-planar pattern defining the desired conductive circuits in relation to a fixed reference plane. The "dynamic pressure cushion" is a material having suitable viscosity and flow characteristics to flow out from under the conductive material as it is being formed and fill up any voids. To ensure that the "dynamic pressure cushion" properly flows without deforming the desired circuits, the die used to form the conductive material is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane leaving the desired conductive circuits.
摘要翻译：一种用于生产支撑导电网络的方法和装置，其可以是柔性的或刚性的，具有密集堆积的电路。用于制造导电网络的方法和装置包括将支撑在“动态压力衬垫”上的导电材料形成为限定相对于固定参考平面的所需导电电路的非平面图案。 “动态压力缓冲垫”是具有适当的粘度和流动特性的材料，当它被形成时从导电材料下面流出并填充任何空隙。为了确保“动态压力缓冲垫”适当地流动而不使所需的电路变形，用于形成导电材料的模具设置有材料流动控制网格和材料膨胀槽。在形成不需要的材料之后，以与尺寸相关的方式机械地移除留下所需导电电路的参考平面。

89. 发明授权

US5464690A Holographic document and method for forming 失效
标题翻译：全息文件和成型方法
公开(公告)号：US5464690A
公开(公告)日：1995-11-07
申请号：US222283
申请日：1994-04-04
申请人： David R. Boswell
发明人： David R. Boswell
IPC分类号： B29C59/04 , B29D11/00 , B32B7/02 , B32B7/06 , B32B15/08 , B32B27/00 , B32B37/22 , B32B38/04 , B32B38/06 , B41M1/22 , B41M1/24 , B41M3/14 , B41M7/00 , B42D15/10 , B44C1/17 , G03H1/02 , G03H1/18 , H05K3/04 , B32B7/12
CPC分类号： B32B38/06 , B29C59/046 , B29D11/0073 , B32B15/08 , B32B37/22 , B32B38/00 , B32B38/1841 , B32B7/06 , B41M1/22 , B41M1/24 , B41M3/14 , B41M7/0027 , B44C1/1729 , G03H1/0252 , B29L2017/00 , B32B2425/00 , B32B2429/00 , B42D25/328 , G03H1/0244 , G03H1/028 , G03H2227/04 , G03H2240/55 , G03H2250/10 , G03H2250/12 , G03H2250/40 , H05K3/046 , Y10S428/913 , Y10T156/1041 , Y10T428/1338 , Y10T428/1438 , Y10T428/1443 , Y10T428/1457 , Y10T428/24802 , Y10T428/24942 , Y10T428/24975 , Y10T428/263 , Y10T428/265 , Y10T428/2804 , Y10T428/2813 , Y10T428/2817 , Y10T428/2826 , Y10T428/31504 , Y10T428/31663 , Y10T428/31667 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31696 , Y10T428/31699 , Y10T428/31703 , Y10T428/31714 , Y10T428/31786 , Y10T428/31801 , Y10T428/31935
摘要： A holographic article and method for forming permits the party producing the final document to print the holographic image directly on the final document thereby permitting such party to retain and maintain control of its own embossing shim on which the hologram has been formed and which is utilized for embossing the holographic image on the document. A film upon which a holographic image can be directly stamped upon the final document includes a layer of metal having a thickness in the range of 20 millimicrons to 100 millimicrons, a lacquer coating having a thickness in the range of 0.5 microns to 3 microns and a heat activatible adhesive. The metal layer lacquer coating and heat activatible adhesive are caused to be adhered to the substrate forming the final document during a stamping operation which releases said metal layer, lacquer coating and heat activatible adhesive from a plastic carrier film to which had initially been applied.
摘要翻译：全息制品和成型方法允许生产最终文件的一方直接在最终文件上打印全息图像，从而允许这些缔约方保留并维持已经形成全息图的其自己的压花垫片的控制，并且其用于在文件上压印全息图像。全息图像可以直接印在最终文件上的胶片包括厚度在20毫微米至100毫微米范围内的金属层，厚度在0.5微米至3微米范围内的漆层和热敏性粘合剂。在冲压操作期间，将金属层漆层和热活性粘合剂粘附到形成最终文件的基材上，从最初施加的塑料载体膜释放所述金属层，漆层和热活性粘合剂。

90. 发明授权

US5462512A Printed circuit board working machine 失效
标题翻译：印刷电路板加工机
公开(公告)号：US5462512A
公开(公告)日：1995-10-31
申请号：US305928
申请日：1994-09-19
申请人： Yasunori Hiroshima , Kenji Kondo
发明人： Yasunori Hiroshima , Kenji Kondo
IPC分类号： B23Q15/00 , B23Q3/155 , B23Q3/157 , G06F17/50 , H05K3/00 , H05K3/04
CPC分类号： B23Q3/15526 , B23Q3/15733 , H05K3/0008 , H05K3/043 , H05K2203/0195 , H05K3/0047 , Y10T483/1793 , Y10T483/1798
摘要： A printed circuit board working machine includes a working table on which a printed circuit board substrate is positioned and fixed, a spindle which is disposed above the working table to be movable horizontally and vertically and to which a predetermined cutting tool is detachably mounted, a controlling unit for controlling the movement of the spindle in accordance with a predetermined cutting data and a data processing unit operatively connected to the controlling unit. The data processing unit includes a data input circuit into which a circuit pattern data is inputted, a contour data preparation circuit for preparing a contour data of a circuit pattern to be prepared from the circuit pattern data from the data input circuit, a hatching data preparation circuit for preparing a hatching data to carry out a hatching operation with a predetermined width in a predetermined direction for working a residual portion of a circuit pattern to be prepared in accordance with the contour data from the contour data preparation circuit, and a cut data preparation circuit for preparing a cut data by continuously connecting adjoining hatching data at end portions thereof in accordance with the hatching data from the hatching data preparation circuit and transmitting the this prepared cut data to the controlling unit.
摘要翻译：一种印刷电路板加工机，包括：印刷电路板基板定位固定的工作台;主轴，其设置在工作台的上方，水平且垂直移动，预定的切削工具可拆卸地安装在该工作台上; 单元，用于根据预定的切割数据控制主轴的运动;以及数据处理单元，可操作地连接到控制单元。数据处理单元包括输入电路图案数据的数据输入电路，用于根据数据输入电路的电路图形数据准备要准备的电路图形的轮廓数据的轮廓数据准备电路，阴影数据准备用于准备阴影数据以在预定方向上以预定宽度执行阴影操作的电路，用于根据来自轮廓数据准备电路的轮廓数据来制作待准备的电路图案的剩余部分，以及切割数据准备电路，用于通过根据来自阴影数据准备电路的阴影数据在端部连续连接相邻的阴影数据并将该准备的切割数据发送到控制单元来准备切割数据。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式