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1. 发明授权

US09371744B2 Heat engine 有权
标题翻译：热机
公开(公告)号：US09371744B2
公开(公告)日：2016-06-21
申请号：US12897233
申请日：2010-10-04
申请人： Norio Gouko , Masahiro Asano , Atusi Sakaida , Tomikazu Ishikawa , Keiji Okamoto
发明人： Norio Gouko , Masahiro Asano , Atusi Sakaida , Tomikazu Ishikawa , Keiji Okamoto
IPC分类号： F03C1/00 , F01K11/00
CPC分类号： F01K11/00
摘要： A heat engine is provided which includes: a boiler unit including an evaporation chamber and a fluid-pool chamber, the evaporation chamber heating a working fluid by supplied heat and generating vapor of the fluid, and the fluid-pool chamber collecting the fluid supplied to the evaporation chamber; an output unit through which the vapor flows, and which converts energy of the vapor to mechanical energy; a condensation unit which condenses the vapor that has passed through the output unit, and refluxes the condensed fluid to the fluid-pool chamber; and a working fluid guide member which is disposed in the boiler unit, and which sucks the fluid in the fluid-pool chamber by using capillary force and supplies the fluid to the evaporation chamber. The evaporation chamber is separated from the fluid-pool chamber. Pressure in the evaporation chamber is higher than pressure in the fluid-pool chamber. The working fluid guide member satisfies (2σ/r)·cos θ>PH−PL.
摘要翻译：提供了一种热机，其包括：包括蒸发室和流体池室的锅炉单元，所述蒸发室通过供应热量加热工作流体并产生流体的蒸气，并且所述流体池室收集供应到蒸发室; 蒸汽流过的输出单元，其将蒸气的能量转化为机械能; 冷凝单元，其冷凝已经通过所述输出单元的蒸气，并且将所述冷凝流体回流到所述流体池室; 以及工作流体引导构件，其设置在所述锅炉单元中，并且通过使用毛细管力吸入所述流体池室中的流体并将所述流体供应到所述蒸发室。蒸发室与流体池分离。蒸发室中的压力高于流体池室中的压力。工作流体引导构件满足（2＆sgr; / r）·cos＆thetas;> PH-PL。

2. 发明授权

US08182729B2 Wiring board and method of making the same 有权
标题翻译：接线板及其制作方法
公开(公告)号：US08182729B2
公开(公告)日：2012-05-22
申请号：US12382138
申请日：2009-03-10
申请人： Toshikazu Harada , Koji Kondo , Atusi Sakaida , Toshihisa Taniguchi , Keiji Okamoto
发明人： Toshikazu Harada , Koji Kondo , Atusi Sakaida , Toshihisa Taniguchi , Keiji Okamoto
IPC分类号： B29C65/02
CPC分类号： H05K1/0366 , B29C43/003 , B29C43/18 , B29C43/203 , B29C2043/025 , B32B37/185 , B32B2309/025 , B32B2457/08 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2203/065 , H05K2203/1178
摘要： In a method of making a multilayer wiring board having a substrate and a wiring pattern formed in the substrate, base films are stacked in a predetermined direction to form a stacked film structure. Each base film includes thermoplastic resin. Pressure and heat are applied to the stacked film structure from its both sides in the stacked direction so that the base films are joined together to form the substrate. At least one of the base films is a combined film including a fiber sheet. Both sides of the fiber sheet are covered with the thermoplastic resin in such a manner that air space remains in the fiber sheet.
摘要翻译：在制造具有基板和形成在基板中的布线图案的多层布线板的方法中，基膜沿预定方向堆叠以形成层叠膜结构。每个基膜包括热塑性树脂。压力和热量从层叠方向的两侧施加到层叠膜结构体上，使得基膜结合在一起形成基板。基膜中的至少一个是包括纤维片的组合膜。纤维片的两侧用热塑性树脂覆盖，使纤维片中残留有空气。

3. 发明申请

US20050034780A1 Filling equipment and method for filling fluidized material 失效
标题翻译：灌装设备及填充流化物料的方法
公开(公告)号：US20050034780A1
公开(公告)日：2005-02-17
申请号：US10849011
申请日：2004-05-20
申请人： Atusi Sakaida , Toshihisa Taniguchi , Keikichi Takada
发明人： Atusi Sakaida , Toshihisa Taniguchi , Keikichi Takada
IPC分类号： H05K3/12 , H05K3/40 , H05K3/46 , B65B1/04
CPC分类号： H05K3/4053 , H05K3/4069 , H05K2201/0394 , H05K2203/0143 , H05K2203/0191 , H05K2203/085
摘要： A method for filling a fluidized material into a hole having a bottom, the hole disposed on one surface of a sheet member, the method includes the steps of: depressurizing a first closed space, which is formed on the one surface of the sheet member; depressurizing a second closed space, which is adjacent to the first closed space and accumulates the fluidized material; displacing the hole together with the sheet member to the second closed space, the hole depressurized in the first closed space; applying the fluidized material on the surface of the sheet member; and filling the applied fluidized material into the hole.
摘要翻译：一种用于将流化材料填充到具有底部的孔中的方法，所述孔设置在片状构件的一个表面上，所述方法包括以下步骤：对形成在所述片状构件的一个表面上的第一封闭空间进行减压; 减压与第一封闭空间相邻的第二封闭空间并积聚流化材料; 将所述孔与所述片构件一起移位到所述第二封闭空间，所述孔在所述第一封闭空间中减压; 将流化材料施加在片材的表面上; 并将施加的流化材料填充到孔中。

4. 发明申请

US20090266492A1 Printed circuit board manufacturing equipment 有权
标题翻译：印刷电路板制造设备
公开(公告)号：US20090266492A1
公开(公告)日：2009-10-29
申请号：US12385895
申请日：2009-04-23
申请人： Satoshi Takeuchi , Atusi Sakaida , Toshihisa Taniguchi , Toshikazu Harada , Maki Chiba
发明人： Satoshi Takeuchi , Atusi Sakaida , Toshihisa Taniguchi , Toshikazu Harada , Maki Chiba
IPC分类号： B30B15/34
CPC分类号： B30B15/061 , B30B15/024 , H05K3/4611 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2201/0133 , H05K2203/065 , H05K2203/068
摘要： In a printed circuit board manufacturing equipment, a pressing die includes a first pressing part, a second pressing part, and a frame part. A buffer member is disposed between a first surface of a laminated body and the first pressing part. The second pressing part has a portion facing a second surface of the laminated body and a portion facing the buffer member. The frame part surrounds a whole area of a side surface of the buffer member. Before pressing and heating, the laminated body, the second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member deformed due to the pressing. A lip protrudes from the frame part toward the laminated body. The lip is deformed following the deformation of the buffer member and comes in contact with a surface of the second pressing part facing the buffer member.
摘要翻译：在印刷电路板制造装置中，压模包括第一按压部，第二按压部和框部。缓冲构件设置在层叠体的第一表面和第一按压部之间。第二按压部具有面向层叠体的第二面的部分和面向缓冲部件的部分。框架部分围绕缓冲构件的侧表面的整个区域。在加压之前，层叠体，第二按压部和缓冲部件在其间限定了由于按压而变形的缓冲部件的逸出空间。唇缘从框架部分朝向层叠体突出。在缓冲构件的变形之后唇部变形，并且与第二按压部的面向缓冲构件的表面接触。

5. 发明授权

US07418901B2 Screen printing method and apparatus thereof 失效
标题翻译：丝网印刷方法及其装置
公开(公告)号：US07418901B2
公开(公告)日：2008-09-02
申请号：US11311180
申请日：2005-12-20
申请人： Atusi Sakaida , Toshihisa Taniguchi , Norio Goko
发明人： Atusi Sakaida , Toshihisa Taniguchi , Norio Goko
IPC分类号： B41M1/12 , B05C17/04
CPC分类号： H05K3/1216 , B41P2200/40 , H01L2924/0002 , H05K1/0269 , H05K3/0008 , H05K2201/10204 , H01L2924/00
摘要： A dummy work (DW: a work for printing a reference necessary for subsequent printing) is moved to a printing position while the dummy work is fixed to a work alignment mechanism 2, and solder printing is made. The printed dummy work is then returned to the work alignment position and its image is taken by image processing cameras 7 and an image of position coordinates of a solder bump specified for alignment is stored. Positioning of subsequent works W is conducted on the basis of the image of the dummy work stored and solder printing of the works is subsequently made at the printing position.
摘要翻译：虚拟工作（DW：用于打印随后打印所需的参考的工作）移动到打印位置，同时将虚拟工作固定到工件对准机构2，并进行焊接印刷。打印的虚拟工件然后返回到工件对准位置，并且其图像由图像处理相机7拍摄，并且存储用于对准的焊料凸块的位置坐标的图像。随后的作品W的定位是根据存储的虚拟作品的图像进行的，随后在打印位置进行作品的焊接印刷。

6. 发明申请

US20060144264A1 Screen printing method and apparatus thereof 失效
标题翻译：丝网印刷方法及其装置
公开(公告)号：US20060144264A1
公开(公告)日：2006-07-06
申请号：US11311180
申请日：2005-12-20
申请人： Atusi Sakaida , Toshihisa Taniguchi , Norio Goko
发明人： Atusi Sakaida , Toshihisa Taniguchi , Norio Goko
IPC分类号： B41F15/08 , B41F15/14 , B41F15/18
CPC分类号： H05K3/1216 , B41P2200/40 , H01L2924/0002 , H05K1/0269 , H05K3/0008 , H05K2201/10204 , H01L2924/00
摘要： A dummy work (DW: a work for printing a reference necessary for subsequent printing) is moved to a printing position while the dummy work is fixed to a work alignment mechanism 2, and solder printing is made. The printed dummy work is then returned to the work alignment position and its image is taken by image processing cameras 7 and an image of position coordinates of a solder bump specified for alignment is stored. Positioning of subsequent works W is conducted on the basis of the image of the dummy work stored and solder printing of the works is subsequently made at the printing position.
摘要翻译：虚拟工作（DW：用于打印随后打印所需的参考的工作）移动到打印位置，同时将虚拟工作固定到工件对准机构2，并进行焊接印刷。打印的虚拟工件然后返回到工件对准位置，并且其图像由图像处理相机7拍摄，并且存储用于对准的焊料凸块的位置坐标的图像。随后的作品W的定位是根据存储的虚拟作品的图像进行的，随后在打印位置进行作品的焊接印刷。

7. 发明申请

US20060124003A1 Screen printing machine and printing method thereof 审中-公开
标题翻译：丝网印刷机及其印刷方法
公开(公告)号：US20060124003A1
公开(公告)日：2006-06-15
申请号：US11299767
申请日：2005-12-13
申请人： Atusi Sakaida , Norio Goko , Toshihisa Taniguchi , Yuji Tuduki
发明人： Atusi Sakaida , Norio Goko , Toshihisa Taniguchi , Yuji Tuduki
IPC分类号： B05C17/04
CPC分类号： H05K3/1233 , B41F15/42 , B41M1/12 , H05K2203/0126
摘要： A printing mechanism 6 of a screen printing machine 1 for printing paste P at a printing position to a work W through a screen S includes a packing nozzle 62 coming into contact, at the distal end thereof, with the screen, a packing head 62 to which the paste consumed during printing is packed and a feed tank 63 for supplying the paste to the filling head. Each of the packing head and the feed tank has therein an extrusion mechanism 62b, 63a and can control an extrusion pressure of the paste to the screen. The printing mechanism further includes a packing head supporting mechanism 64 capable of supporting the packing head in such a manner as to be capable of moving up and down and also capable of regulating the pushing force of the packing head onto the screen.
摘要翻译：丝网印刷机1的印刷机构1，其通过丝网S在打印位置将印刷浆料P印刷到工件W上，包括在其远端与丝网接触的包装喷嘴62，包装头62至打印期间消耗的糊料被填充，以及用于将糊剂供应到填充头的进料罐63。每个包装头和进料罐都具有挤出机构62b，63a，并且可以将糊料的挤出压力控制到筛网。打印机构还包括能够以能够上下移动的方式支撑包装头的包装头支撑机构64，还能够将包装头的推压调节到屏幕上。

8. 发明授权

US07022244B2 Method and apparatus for generation of fine particles 失效
标题翻译：用于产生细颗粒的方法和装置
公开(公告)号：US07022244B2
公开(公告)日：2006-04-04
申请号：US10651153
申请日：2003-08-28
申请人： Atusi Sakaida , Toshihisa Taniguchi , Hiroshi Tanaka
发明人： Atusi Sakaida , Toshihisa Taniguchi , Hiroshi Tanaka
IPC分类号： H01L21/00 , B01D47/06
CPC分类号： B05B7/0012 , B01D1/18 , B01J2/04
摘要： To supply microfine liquid droplets to a microscopic space for enabling micromachining and provide a method and an apparatus for forming the microfine liquid droplets, there is provided a method and an apparatus for generating liquid fine particles, comprising atomizing a liquid, fractionating the atomized liquid particles to form microfine liquid droplets by inertial fractionation and contacting the microfine liquid droplets with a heated carrier gas, thereby thermally drying the liquid particles to form finer particles.
摘要翻译：为了将微细液滴提供到微观空间以实现微机械加工，并且提供了一种用于形成微细液滴的方法和装置，提供了一种产生液体细颗粒的方法和装置，包括雾化液体，分离雾化液体颗粒通过惯性分馏形成微细液滴，并使微细液滴与加热的载气接触，从而热干燥液体颗粒以形成更细的颗粒。

9. 发明授权

US07931065B2 Printed circuit board manufacturing equipment 有权
标题翻译：印刷电路板制造设备
公开(公告)号：US07931065B2
公开(公告)日：2011-04-26
申请号：US12385895
申请日：2009-04-23
申请人： Satoshi Takeuchi , Atusi Sakaida , Toshihisa Taniguchi , Toshikazu Harada , Maki Chiba
发明人： Satoshi Takeuchi , Atusi Sakaida , Toshihisa Taniguchi , Toshikazu Harada , Maki Chiba
IPC分类号： B32B37/00
CPC分类号： B30B15/061 , B30B15/024 , H05K3/4611 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2201/0133 , H05K2203/065 , H05K2203/068
摘要： In a printed circuit board manufacturing equipment, a pressing die includes a first pressing part, a second pressing part, and a frame part. A buffer member is disposed between a first surface of a laminated body and the first pressing part. The second pressing part has a portion facing a second surface of the laminated body and a portion facing the buffer member. The frame part surrounds a whole area of a side surface of the buffer member. Before pressing and heating, the laminated body, the second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member deformed due to the pressing. A lip protrudes from the frame part toward the laminated body. The lip is deformed following the deformation of the buffer member and comes in contact with a surface of the second pressing part facing the buffer member.
摘要翻译：在印刷电路板制造装置中，压模包括第一按压部，第二按压部和框部。缓冲构件设置在层叠体的第一表面和第一按压部之间。第二按压部具有面向层叠体的第二面的部分和面向缓冲部件的部分。框架部分围绕缓冲构件的侧表面的整个区域。在加压之前，层叠体，第二按压部和缓冲部件在其间限定了由于按压而变形的缓冲部件的逸出空间。唇缘从框架部分朝向层叠体突出。在缓冲构件的变形之后唇部变形，并且与第二按压部的面向缓冲构件的表面接触。

10. 发明申请

US20090057265A1 Method of manufacturing multilayer printed circuit board 审中-公开
标题翻译：多层印刷电路板的制造方法
公开(公告)号：US20090057265A1
公开(公告)日：2009-03-05
申请号：US12230219
申请日：2008-08-26
申请人： Yoshihiko Shiraishi , Kouji Kondo , Yoshitaro Yazaki , Atusi Sakaida
发明人： Yoshihiko Shiraishi , Kouji Kondo , Yoshitaro Yazaki , Atusi Sakaida
IPC分类号： C23F1/00
CPC分类号： H05K3/4617 , H05K3/4046 , H05K3/4053 , H05K2201/0272 , H05K2201/0394 , H05K2203/1131
摘要： In a method of manufacturing a multilayer printed circuit board, a plurality of insulating substrates each having a first surface and a second surface is prepared. A circuit pattern is formed on each of the first surfaces of the insulating substrates. A plurality of via holes is provided so as to extend through respective ones of the insulating substrates from a side of the second surfaces in such a manner that the via holes reach corresponding ones of the circuit patterns. Ones of a plurality of sintered bodies made of conductive particles is inserted into corresponding ones of the via holes and is fixed in the via holes. The insulating substrates are stacked so that the circuit patterns are electrically coupled through the sintered bodies.
摘要翻译：在制造多层印刷电路板的方法中，准备了具有第一表面和第二表面的多个绝缘基板。在绝缘基板的每个第一表面上形成电路图案。多个通孔设置成从第二表面的一侧延伸通过相应的绝缘基板，使得通孔到达对应的电路图形。将由导电粒子构成的多个烧结体的一部分插入对应的通孔中，并固定在通孔中。绝缘基板被堆叠，使得电路图案通过烧结体电耦合。

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