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1. 发明授权

US06450839B1 Socket, circuit board, and sub-circuit board for semiconductor integrated circuit device 失效
标题翻译：用于半导体集成电路器件的插座，电路板和子电路板
公开(公告)号：US06450839B1
公开(公告)日：2002-09-17
申请号：US09159819
申请日：1998-09-23
申请人： Byoung Jun Min , Hyo Geun Chae , Sang Young Choi
发明人： Byoung Jun Min , Hyo Geun Chae , Sang Young Choi
IPC分类号： H01R1342
CPC分类号： H01R12/585 , H05K3/308
摘要： An embodiment of the present invention provides a circuit board and a socket having mechanical connector for easily connecting and disconnecting a semiconductor integrated circuit device to and from the circuit board. Another embodiment further includes a sub-circuit board for electrically connecting the socket to the circuit board. The socket includes a socket body and a number of socket leads. The socket leads are shaped to compress elastically when inserted in a hole and thereby make contact between the socket leads and inner walls of the holes of the circuit board. The sub-circuit board has connection leads, which make contacts with the through holes of the circuit board in the same manner as the socket leads of the present invention.
摘要翻译：本发明的一个实施例提供一种电路板和插座，其具有用于容易地将半导体集成电路装置连接到电路板和从电路板断开的机械连接器。另一实施例还包括用于将插座电连接到电路板的子电路板。插座包括插座主体和多个插座引线。插座引线被成形为当插入孔中时弹性地压缩，从而使插座引线和电路板的孔的内壁之间接触。子电路板具有与本发明的插座引线相同的方式与电路板的通孔接触的连接引线。

2. 发明授权

US08564317B2 Test socket, and test apparatus with test socket to control a temperature of an object to be tested 有权
标题翻译：测试插座和带有测试插座的测试设备，用于控制待测物体的温度
公开(公告)号：US08564317B2
公开(公告)日：2013-10-22
申请号：US12719267
申请日：2010-03-08
申请人： Jong-Won Han , Seok Goh , Byoung-Jun Min , Jung-Hyeon Kim , Sang-Sik Lee , Bo-Woo Kim , Ho-Jeong Choi
发明人： Jong-Won Han , Seok Goh , Byoung-Jun Min , Jung-Hyeon Kim , Sang-Sik Lee , Bo-Woo Kim , Ho-Jeong Choi
IPC分类号： G01R31/00
CPC分类号： G01R1/0458 , G01R31/2863 , G01R31/2875
摘要： A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.
摘要翻译：提供了一种测试插座，其包括用于接收被测试对象的插座主体，设置在插座主体上的盖子，一个或多个连接到盖的第一表面的推动器，以向该插座的第一表面施加力主体和温度控制构件以向对象提供温度。可以在包括测试插座的测试设备中测试半导体封装，测试方法包括在测试室中的插座中接收半导体封装，将第一温度施加到测试室以在第一测试中测试半导体封装温度，并且向半导体封装施加第二温度以通过控制第二温度与插座的应用来在第二测试温度下测试半导体封装。

3. 发明授权

US07017428B2 Test kit for semiconductor package and method for testing semiconductor package using the same 失效
标题翻译：用于半导体封装的测试套件及使用其的半导体封装测试方法
公开(公告)号：US07017428B2
公开(公告)日：2006-03-28
申请号：US10728544
申请日：2003-12-04
申请人： Byoung-jun Min , Jeong-ho Bang , Hyun-seop Shim , Hyo-geun Chae
发明人： Byoung-jun Min , Jeong-ho Bang , Hyun-seop Shim , Hyo-geun Chae
IPC分类号： G01M19/00
CPC分类号： G01R31/2893 , G01R1/0483 , G01R31/2806
摘要： A test kit for a semiconductor package and a method for testing the semiconductor package using the same are provided. The test kit for a semiconductor package includes a pick-and-place tool for picking up and loading/unloading the semiconductor package, a head assembly having a package guider and a socket guider, and a socket which is positioned under the head assembly. The socket guider performs a pre-alignment function for a correct operation of the package guider, before the package guider starts operating. The package guider aligns the semiconductor package.
摘要翻译：提供了一种用于半导体封装的测试套件以及使用其的半导体封装测试方法。用于半导体封装的测试套件包括用于拾取和加载/卸载半导体封装的拾取和放置工具，具有封装导向器和插座导向器的头部组件以及位于头部组件下方的插座。套件导向器在包导向器开始操作之前执行用于正确操作包导向器的预对准功能。封装导向器对准半导体封装。

4. 发明授权

US06462534B2 Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewith 失效
标题翻译：半导体封装测试设备，包括具有封装导向器的装载器和将半导体封装装载到与之对齐的测试插座上的方法
公开(公告)号：US06462534B2
公开(公告)日：2002-10-08
申请号：US09805212
申请日：2001-03-14
申请人： Seong-goo Kang , Byoung-jun Min , Hyo-geun Chae , Jeong-ho Bang
发明人： Seong-goo Kang , Byoung-jun Min , Hyo-geun Chae , Jeong-ho Bang
IPC分类号： G01R3102
CPC分类号： G01R31/2867 , G01R1/0408 , H01L2224/75 , H01L2224/81
摘要： A loader of semiconductor package burn-in test equipment allows a test socket to be commonly used for semiconductor packages of all sizes. The loader includes a vacuum suction head for picking semiconductor packages to be tested, and a package guider for ensuring that semiconductor packages of any size will be aligned with the test socket. As the semiconductor package is positioned over the test socket by the vacuum suction head of the loader, guide surfaces of the package guider are brought inwardly into guide positions at which the surfaces extend just beneath the vacuum suction head. Any semiconductor package that is not in alignment with the test socket while being held by the vacuum suction head is guided by the guides surfaces into alignment once the vacuum suction is turned off and the package falls from the vacuum suction head. Thus, the package guider serves as an adaptor, eliminating the need for several test sockets having respective adaptors for different sizes of semiconductor packages.
摘要翻译：半导体封装老化测试设备的装载机允许测试插座常用于各种尺寸的半导体封装。装载机包括用于拾取待测试的半导体封装的真空吸头，以及用于确保任何尺寸的半导体封装将与测试插座对准的封装导向器。当半导体封装通过装载机的真空吸头位于测试插座上方时，封装引导件的引导表面向内进入引导位置，在该位置处表面正好在真空抽吸头的正下方延伸。在真空抽吸被关闭并且包装从真空抽吸头落下的情况下，由真空吸头保持的不与测试插座对准的任何半导体封装被引导面对引导。因此，封装导向器用作适配器，消除了对具有用于不同尺寸的半导体封装的相应适配器的多个测试插座的需要。

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