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1. 发明授权

US08564317B2 Test socket, and test apparatus with test socket to control a temperature of an object to be tested 有权
标题翻译：测试插座和带有测试插座的测试设备，用于控制待测物体的温度
公开(公告)号：US08564317B2
公开(公告)日：2013-10-22
申请号：US12719267
申请日：2010-03-08
申请人： Jong-Won Han , Seok Goh , Byoung-Jun Min , Jung-Hyeon Kim , Sang-Sik Lee , Bo-Woo Kim , Ho-Jeong Choi
发明人： Jong-Won Han , Seok Goh , Byoung-Jun Min , Jung-Hyeon Kim , Sang-Sik Lee , Bo-Woo Kim , Ho-Jeong Choi
IPC分类号： G01R31/00
CPC分类号： G01R1/0458 , G01R31/2863 , G01R31/2875
摘要： A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.
摘要翻译：提供了一种测试插座，其包括用于接收被测试对象的插座主体，设置在插座主体上的盖子，一个或多个连接到盖的第一表面的推动器，以向该插座的第一表面施加力主体和温度控制构件以向对象提供温度。可以在包括测试插座的测试设备中测试半导体封装，测试方法包括在测试室中的插座中接收半导体封装，将第一温度施加到测试室以在第一测试中测试半导体封装温度，并且向半导体封装施加第二温度以通过控制第二温度与插座的应用来在第二测试温度下测试半导体封装。

2. 发明授权

US6131919A Method of automatically adjusting a body of a tractor to a horizontal position and apparatus for performing the same 失效
标题翻译：将拖拉机的主体自动调整到水平位置的方法以及执行该拖拉机的设备的方法
公开(公告)号：US6131919A
公开(公告)日：2000-10-17
申请号：US344199
申请日：1999-06-24
申请人： Sang Sik Lee , Kie Seok Oh
发明人： Sang Sik Lee , Kie Seok Oh
IPC分类号： B60G1/04 , B60G17/00 , B60G17/016 , B60G21/06 , B60K17/04 , B60P1/16
CPC分类号： B60G17/016 , B60G21/06 , B60K17/043 , B60G2200/10 , B60G2200/32 , B60G2200/422 , B60G2200/44 , B60G2202/413 , B60G2202/414 , B60G2204/128 , B60G2204/129 , B60G2204/80 , B60G2206/30 , B60G2300/082 , B60G2600/182 , B60G2800/019 , B60Y2200/221
摘要： Disclosed is a method of adjusting a tractor to a horizontal position and an apparatus for performing the same. The method comprises the steps of determining whether or not the tractor is in an automatic mode, determining whether the tractor is in a flat land or in a slope land if the tractor is in the automatic mode, adjusting a height of the body with respect to a ground if the tractor is in the flat land, determining a driving direction of the tractor if the tractor is in the slope land, adjusting the body to the horizontal position by controlling the body in left and right directions thereof if the tractor is driving in a contour direction, adjusting the body to the horizontal position by controlling the body in front and rear directions thereof if the tractor is driving in a latitudinal direction, and adjusting the body to the horizontal position by controlling the body in front, rear, left and right directions thereof if the tractor is driving in an oblique direction. The body of the tractor can be maintained to the horizontal position while the tractor is driving and the height of the body with respect to the ground can be adjusted, so the crops can be prevented from being damaged. The apparatus can rapidly adjust the body of the tractor to the horizontal position.
摘要翻译：公开了一种将拖拉机调节到水平位置的方法和用于执行该拖拉机的装置。该方法包括以下步骤：确定拖拉机是否处于自动模式，如果拖拉机处于自动模式，则确定拖拉机是在平坦地面还是在坡地上，相对于如果拖拉机在平坦的地面，则确定拖拉机的行驶方向，如果拖拉机处于斜坡地面，则如果拖拉机正在行驶，则通过控制车体的左右方向将车身调整到水平位置轮廓方向，如果拖拉机在纬向方向上行驶，则通过在前后方向上控制身体来将身体调整到水平位置，并且通过前后左右控制身体将身体调节到水平位置，如果拖拉机在倾斜方向上行驶，则其方向正确。拖拉机的主体可以在拖拉机驾驶时保持在水平位置，并且可以调节车身相对于地面的高度，从而可以防止作物受损。该设备可以将拖拉机的主体快速调整到水平位置。

3. 发明授权

US06335629B1 Test fixture having an opening for exposing the back of a semiconductor chip and testing module comprising the same 失效
标题翻译：测试夹具具有用于露出半导体芯片的背面的开口和包括该开口的测试模块
公开(公告)号：US06335629B1
公开(公告)日：2002-01-01
申请号：US09115910
申请日：1998-07-15
申请人： Sang Sik Lee , Kye Won Ha , Jong Wook Kim , Chung Koo Yoon
发明人： Sang Sik Lee , Kye Won Ha , Jong Wook Kim , Chung Koo Yoon
IPC分类号： G01R3102
CPC分类号： G01R1/0433 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A testing module for use in testing a semiconductor chip for failures in its integrated circuits includes a test fixture, and a decapsulated semiconductor device package mounted to the fixture. The semiconductor device package includes a semiconductor chip having an active front surface at which the integrated circuits are formed, a back which is opposed to the active front, a plurality of leads for electrically connecting the semiconductor chip to an external apparatus, and a package body having a backside which is decapsulated so as to expose the back of the semiconductor chip. The test fixture includes a fixture body having a loading surface contacting the front of the package body and supporting the semiconductor device package, a cover which has an opening through which the back of the semiconductor chip is exposed, and a plurality of projections contacting the leads of the semiconductor device package. The cover is connected to the fixture body but can be opened to allow the semiconductor device package to be inserted into and removed from the test fixture. The test fixture includes a plurality of connection pins having inner ends that are electrically connected to the leads of the semiconductor device package, and outer ends which protrude from the fixture body and are electrically connected to external testing apparatus.
摘要翻译：用于测试其集成电路中的故障的半导体芯片的测试模块包括测试夹具和安装到固定装置上的解封装的半导体器件封装。半导体器件封装包括具有形成集成电路的有源前表面的半导体芯片，与有源前端相对的背面，用于将半导体芯片电连接到外部设备的多个引线和封装体具有被封装的背面以露出半导体芯片的背面。测试夹具包括具有接合包装体的前部并且支撑半导体器件封装的负载表面的固定体，具有露出半导体芯片背面的开口的盖，以及与引线接触的多个突起的半导体器件封装。盖子连接到固定装置本体上，但是可以打开以使半导体器件封装件插入测试夹具中并从测试夹具中移除。测试夹具包括多个连接销，其内端电连接到半导体器件封装的引线，外端从固定体突出并与外部测试装置电连接。

4. 发明授权

US06301167B1 Apparatus for testing semiconductor memory 有权
标题翻译：半导体存储器测试装置
公开(公告)号：US06301167B1
公开(公告)日：2001-10-09
申请号：US09638385
申请日：2000-08-12
申请人： Ill Young Lee , Sang Sik Lee , Jong Hyun Kim , Duk Chun Park , Byung Soo Ham , Byung Koo Ham
发明人： Ill Young Lee , Sang Sik Lee , Jong Hyun Kim , Duk Chun Park , Byung Soo Ham , Byung Koo Ham
IPC分类号： G11C700
CPC分类号： G11C29/56
摘要： An apparatus for testing a semiconductor memory is disclosed, which includes a power control module for varying an output voltage of the power supply unit and supplying to the semiconductor memory in accordance with a power control signal from a CPU(Central Processing Unit) of the main board, and an interface unit for supplying the power control signal from the CPU of the main board to the power control module, thus implementing an accurate operation state of an actual mounting environment of a semiconductor memory device by varying and supplying a certain voltage supplied from a power supply unit when testing whether a semiconductor memory device is defective or not using a main board of a computer apparatus.
摘要翻译：公开了一种用于测试半导体存储器的装置，其包括用于改变电源单元的输出电压并根据来自主体的CPU（中央处理单元）的功率控制信号向半导体存储器供应的功率控制模块以及用于将来自主板的CPU的功率控制信号提供给功率控制模块的接口单元，从而通过改变和提供从半导体存储器件提供的一定电压来实现半导体存储器件的实际安装环境的精确操作状态当使用计算机装置的主板来测试半导体存储器件是否有故障时，电源单元。

5. 发明申请

US20090153171A1 Apparatus for testing objects under controlled conditions 审中-公开
标题翻译：用于在受控条件下测试物体的装置
公开(公告)号：US20090153171A1
公开(公告)日：2009-06-18
申请号：US12314360
申请日：2008-12-09
申请人： Sang-Sik Lee , Yun-Ha Park , Sung-Min Sim , Myoung-Sub Kim
发明人： Sang-Sik Lee , Yun-Ha Park , Sung-Min Sim , Myoung-Sub Kim
IPC分类号： G01R31/28
CPC分类号： G01R31/2874
摘要： An apparatus for testing objects includes a test board having electrical connection areas to connect to the objects, a chamber fixture located on the test board to form test chambers that are configured to individually receive the objects, a thermoelectric element provided to each test chamber to adjust the temperature of the object, and a temperature controller for individually controlling operations of the thermoelectric elements.
摘要翻译：一种用于测试物体的装置包括具有连接到物体的电气连接区域的测试板，位于测试板上的腔室夹具，以形成被配置为分别接收物体的测试室，设置到每个测试室的热电元件以调整物体的温度和用于单独控制热电元件的操作的温度控制器。

6. 发明申请

US20090009204A1 Test socket 审中-公开
标题翻译：测试插座
公开(公告)号：US20090009204A1
公开(公告)日：2009-01-08
申请号：US12214932
申请日：2008-06-24
申请人： Sang-Sik Lee , Bo-Woo Kim , Ho-Jeong Choi
发明人： Sang-Sik Lee , Bo-Woo Kim , Ho-Jeong Choi
IPC分类号： G01R31/02
CPC分类号： G01R1/0458 , G01R31/2875
摘要： A test socket in accordance with one aspect of the present invention includes a socket body, a thermoelectric element and a heat transfer member. The socket body receives an object. The thermoelectric element is arranged in the socket body to emit heat and absorb heat in accordance with current directions. The heat transfer member is arranged between the object and the thermoelectric element to transfer a heat generated from the object to the thermoelectric element. Thus, the object may be directly provided with a desired test temperature using the thermoelectric element so that the desired test temperature may be set rapidly and accurately. Further, the heat transfer member interposed between the object and the thermoelectric element may quickly dissipate the heat in the object.
摘要翻译：根据本发明的一个方面的测试插座包括插座体，热电元件和传热构件。插座主体接收一个对象。热电元件布置在插座主体中以发射热量并根据电流方向吸收热量。传热构件设置在物体和热电元件之间，以将从物体产生的热量传递到热电元件。因此，可以使用热电元件将物体直接设置有期望的测试温度，使得可以快速且准确地设置期望的测试温度。此外，介于物体和热电元件之间的传热构件可能会快速地散发物体中的热量。

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