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    • 9. 发明授权
    • Fine electroforming mold and manufacturing method thereof
    • 精细电铸模具及其制造方法
    • US07267756B2
    • 2007-09-11
    • US10503496
    • 2003-02-18
    • Koji NittaShinji InazawaAkihisa Hosoe
    • Koji NittaShinji InazawaAkihisa Hosoe
    • C25D1/10
    • C25D1/10
    • The present invention provides a mold for fine electroforming M having a simple structure. In order to improve the productivity of a metal product, an electrode portion can be arranged with a much higher density, and a metal thin film formed on the electrode portion can easily be peeled off. The present invention provides a manufacturing method for manufacturing the mold M with a higher accuracy and by an easier way.The mold for fine electroforming M has a conductive substrate 1 to function as a cathode during electroforming and insulation layer 2 having an opening 21, which has a shape corresponding to a shape of a plane shape of the metal product P and is through to the conductive substrate 1, and composed of an inorganic insulation material having a thickness T2 of not less than 10 nm and less than one-half the thickness T1 of the metal product P. The surface of the conductive substrate 1 exposed at the opening 21 is adapted to serve as the electrode portion.The manufacturing method of the mold M has steps of: forming an inorganic thin film 2′ to grow into the insulation layer 2 in an area excluding an area, where resist film R is pattern-formed, on the surface of the conductive substrate 1; and removing the resist film R to form the opening 21.
    • 本发明提供一种具有简单结构的精细电铸M的模具。 为了提高金属制品的生产率,可以以更高的密度布置电极部分,并且可以容易地剥离形成在电极部分上的金属薄膜。 本发明提供一种以更高的精度和更容易的方式制造模具M的制造方法。 用于精细电铸的模具M具有导电基板1,其在具有开口21的电铸和绝缘层2中用作阴极,该开口21具有与金属产品P的平面形状相对应的形状,并且通过导电 基板1,并且由金属产品P的厚度T 2 N以上且小于10nm且小于金属产品P的厚度T 1的一半的无机绝缘材料构成 在开口部21露出的导电性基板1的表面适合用作电极部。 模具M的制造方法具有以下步骤:在导电基板1的表面上除了图案形成抗蚀剂膜R的区域之外的区域中形成无机薄膜2'以生长到绝缘层2中; 并除去抗蚀剂膜R以形成开口21。