会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 6. 发明申请
    • Method for Producing an Electronic Circuit
    • 电子电路的制造方法
    • US20070231968A1
    • 2007-10-04
    • US11575586
    • 2005-11-28
    • Wolfgang JacobChristoph RufAlbert-Andreas HoebelRolf Becker
    • Wolfgang JacobChristoph RufAlbert-Andreas HoebelRolf Becker
    • H01L21/02
    • H01L23/49575H01L23/49537H01L23/49562H01L2924/0002H01L2924/00
    • The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips (46) with essentially the same structure are mounted on a surface (13) pertaining to a first conductor carrier (10) and coated with strip conductors (16). Said two semiconductor chips (46) comprise a first surface (49) and a second surface (58), one semiconductor chip (46) being mounted on the conductor carrier surface (13) with the first surface (49) thereof, and the other semiconductor chip (46) being mounted on the conductor carrier surface (13) with the second surface (58) thereof. The second surface (58) of the first semiconductor chip (46) and the first surface (49) of the other semiconductor chip (46) are interconnected by a lead frame (64) with an A.C. power supply (31).
    • 本发明涉及电子电路的制造方法。 根据所述方法,具有基本上相同结构的两个半导体芯片(46)安装在与第一导体载体(10)相关的表面(13)上并且涂覆有带状导体(16)。 所述两个半导体芯片(46)包括第一表面(49)和第二表面(58),一个半导体芯片(46)与其第一表面(49)一起安装在导体载体表面(13)上,另一个半导体芯片 半导体芯片(46)与第二表面(58)安装在导体载体表面(13)上。 第一半导体芯片(46)的第二表面(58)和另一个半导体芯片(46)的第一表面(49)通过引脚框架(64)与交流电源(31)互连。