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1. 发明授权

US08916827B2 Device and system for selectively detecting gas components or concentrations of gas components in gas to be analyzed and method for operating such device 有权
标题翻译：用于选择性地检测要分析的气体中的气体组分或气体组分的浓度的装置和系统以及用于操作该装置的方法
公开(公告)号：US08916827B2
公开(公告)日：2014-12-23
申请号：US13817413
申请日：2011-08-11
申请人： Alexander Frey , Harry Hedler , Philip Clissold Howell
发明人： Alexander Frey , Harry Hedler , Philip Clissold Howell
IPC分类号： G01N21/00 , G01N33/00 , B82Y20/00 , G02B6/122 , G01J3/10 , G01N21/35 , G01N21/77 , G01N21/03
CPC分类号： G01N33/0027 , B82Y20/00 , G01J3/108 , G01N21/0303 , G01N21/3504 , G01N21/774 , G01N21/7746 , G02B6/1225
摘要： A photonic crystal, which is a periodically arranged structure made of free-standing columns, has a base material of at least one metal or a metal alloy. Intermediate spaces between the columns allow passage of a gas to be analyzed. The photonic crystal has predefined imperfections, by which at least one resonator is formed, the resonant frequency of which is in a frequency range which is absorbed by a gas component to be detected. A heating unit heats at least some of the columns and at least one detector element extracts the energy present in the resonator in the heated state under the action of the gas to be analyzed. The device may have extremely small dimensions and very low energy consumption.
摘要翻译：作为由独立柱构成的周期性排列的结构的光子晶体具有至少一种金属或金属合金的基材。列之间的中间空间允许待分析的气体通过。光子晶体具有预定义的缺陷，由此形成至少一个谐振器，其谐振频率处于被待检测的气体成分吸收的频率范围内。加热单元加热至少一些列，并且至少一个检测器元件在待分析气体的作用下以加热状态提取谐振器中存在的能量。该装置可能具有非常小的尺寸和非常低的能量消耗。

2. 发明申请

US20130284928A1 DEVICE AND SYSTEM FOR SELECTIVELY DETECTING GAS COMPONENTS OR CONCENTRATIONS OF GAS COMPONENTS IN GAS TO BE ANALYZED AND METHOD FOR OPERATING SUCH DEVICE 有权
标题翻译：选择性地检测要分析的气体中的气体组分的气体组分或浓度的装置和系统以及用于操作这些装置的方法
公开(公告)号：US20130284928A1
公开(公告)日：2013-10-31
申请号：US13817413
申请日：2011-08-11
申请人： Alexander Frey , Harry Hedler , Philip Clissold Howell
发明人： Alexander Frey , Harry Hedler , Philip Clissold Howell
IPC分类号： G01N33/00
CPC分类号： G01N33/0027 , B82Y20/00 , G01J3/108 , G01N21/0303 , G01N21/3504 , G01N21/774 , G01N21/7746 , G02B6/1225
摘要： A photonic crystal, which is a periodically arranged structure made of free-standing columns, has a base material of at least one metal or a metal alloy. Intermediate spaces between the columns allow passage of a gas to be analyzed. The photonic crystal has predefined imperfections, by which at least one resonator is formed, the resonant frequency of which is in a frequency range which is absorbed by a gas component to be detected. A heating unit heats at least some of the columns and at least one detector element extracts the energy present in the resonator in the heated state under the action of the gas to be analyzed. The device may have extremely small dimensions and very low energy consumption.
摘要翻译：作为由独立柱构成的周期性排列的结构的光子晶体具有至少一种金属或金属合金的基材。列之间的中间空间允许待分析的气体通过。光子晶体具有预定义的缺陷，由此形成至少一个谐振器，其谐振频率处于被待检测的气体成分吸收的频率范围内。加热单元加热至少一些列，并且至少一个检测器元件在待分析气体的作用下以加热状态提取谐振器中存在的能量。该装置可能具有非常小的尺寸和非常低的能量消耗。

3. 发明授权

US09097808B2 Radiation detector and imaging system 有权
标题翻译：辐射检测器和成像系统
公开(公告)号：US09097808B2
公开(公告)日：2015-08-04
申请号：US14124713
申请日：2012-05-21
申请人： Harry Hedler , Timothy Hughes , Martin Spahn , Stefan Wirth
发明人： Harry Hedler , Timothy Hughes , Martin Spahn , Stefan Wirth
IPC分类号： G01T1/20 , G01T1/28
CPC分类号： G01T1/2006 , G01T1/20 , G01T1/28
摘要： The invention relates to a radiation detector (100; 101; 102; 103; 104; 105; 106), having a scintillator (120) for generating electromagnetic radiation (202) in response to the action of incident radiation (200). The scintillator (120) has two opposing end faces (121; 122) and a lateral wall (123) between the end faces (121; 122). The radiation detector has, in addition, a photocathode section (130) that is located on the lateral electrons wall (123) of the scintillator (120) and that generates electrons (204) in response to the action of electromagnetic radiation (202) that is generated by the scintillator (120), a microchannel plate (161; 162) comprising a plurality of channels (165), for multiplying the electrons (204) that have been generated by the photocathode section (130) and a detection system (171; 172) for detecting the electrons (204) that have been multiplied by means of the microchannel plate (161; 162). The invention also relates to an imaging system (110) comprising a radiation detector of this type (100; 101; 102; 103; 104; 105; 106).
摘要翻译：本发明涉及一种辐射检测器（100; 101; 102; 103; 104; 105; 106），其具有响应于入射辐射（200）的作用产生电磁辐射（202）的闪烁体（120）。闪烁体（120）在端面（121; 122）之间具有两个相对的端面（121; 122）和侧壁（123）。此外，辐射检测器还具有位于闪烁体（120）的横向电子壁（123）上并且响应于电磁辐射（202）的作用而产生电子（204）的光电阴极部分（130），所述光电阴极部分由所述闪烁体（120）产生的微通道板（161; 162）包括多个通道（165），用于将由所述光电阴极部分（130）产生的电子（204）与检测系统（171）相乘 ; 172），用于检测已经通过微通道板（161; 162）倍增的电子（204）。本发明还涉及一种包括这种类型的辐射探测器（100; 101; 102; 103; 104; 105; 106）的成像系统（110）。

4. 发明授权

US08912654B2 Semiconductor chip with integrated via 有权
标题翻译：半导体芯片集成通孔
公开(公告)号：US08912654B2
公开(公告)日：2014-12-16
申请号：US12101501
申请日：2008-04-11
申请人： Franz Kreupl , Harry Hedler
发明人： Franz Kreupl , Harry Hedler
IPC分类号： H01L23/48 , H01L23/52 , H01L21/44 , H01L21/683 , H01L21/768 , H01L25/065 , H01L23/00
CPC分类号： H01L23/481 , H01L21/6835 , H01L21/76898 , H01L24/11 , H01L24/12 , H01L25/0657 , H01L2221/68372 , H01L2224/0401 , H01L2224/0557 , H01L2224/05572 , H01L2224/13025 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/2518 , H01L2225/06517 , H01L2225/06541 , H01L2924/0002 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H01L2224/05552
摘要： An integrated circuit with a substrate with a lower and an upper surface is described. A via extends between the upper and the lower surface of the substrate. The via contains a conductive filling material that comprises carbon.
摘要翻译：描述了具有下表面和上表面的基底的集成电路。通孔延伸在基板的上表面和下表面之间。通孔含有包含碳的导电填充材料。

5. 发明授权

US08742563B2 Component and method for producing a component 有权
标题翻译：用于制造组件的组件和方法
公开(公告)号：US08742563B2
公开(公告)日：2014-06-03
申请号：US12955484
申请日：2010-11-29
申请人： Thorsten Meyer , Harry Hedler , Markus Brunnbauer
发明人： Thorsten Meyer , Harry Hedler , Markus Brunnbauer
IPC分类号： H01L23/48
CPC分类号： H01L23/49816 , H01L21/568 , H01L21/68 , H01L21/6835 , H01L23/49838 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L24/96 , H01L2224/04105 , H01L2224/12105 , H01L2224/82001 , H01L2224/92 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01068 , H01L2924/01074 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3511 , H01L2224/96 , H01L2224/82 , H01L2924/00
摘要： A component and a method for producing a component are disclosed. The component comprises an integrated circuit, a housing body, a wiring device overlapping the integrated circuit and the housing body, and one or more external contact devices in communication with the wiring device.
摘要翻译：公开了一种组件的制造方法。该组件包括集成电路，壳体，与集成电路重叠的布线装置和壳体，以及与布线装置连通的一个或多个外部接触装置。

6. 发明申请

US20140103219A1 RADIATION DETECTOR AND IMAGING SYSTEM 有权
标题翻译：辐射探测器和成像系统
公开(公告)号：US20140103219A1
公开(公告)日：2014-04-17
申请号：US14124713
申请日：2012-05-21
申请人： Harry Hedler , Timothy Hughes , Martin Spahn , Stefan Wirth
发明人： Harry Hedler , Timothy Hughes , Martin Spahn , Stefan Wirth
IPC分类号： G01T1/20
CPC分类号： G01T1/2006 , G01T1/20 , G01T1/28
摘要： The invention relates to a radiation detector (100; 101; 102; 103; 104; 105; 106), having a scintillator (120) for generating electromagnetic radiation (202) in response to the action of incident radiation (200). The scintillator (120) has two opposing end faces (121; 122) and a lateral wall (123) between the end faces (121; 122). The radiation detector has, in addition, a photocathode section (130) that is located on the lateral wall (123) of the scintillator (120) and that generates electrons (204) in response to the action of electromagnetic radiation (202) that is generated by the scintillator (120), a microchannel plate (161; 162) comprising a plurality of channels (165), for multiplying the electrons (204) that have been generated by the photocathode section (130) and a detection system (171; 172) for detecting the electrons (204) that have been multiplied by means of the microchannel plate (161; 162). The invention also relates to an imaging system (110) comprising a radiation detector of this type (100; 101; 102; 103; 104; 105; 106).
摘要翻译：本发明涉及一种辐射检测器（100; 101; 102; 103; 104; 105; 106），其具有响应于入射辐射（200）的作用产生电磁辐射（202）的闪烁体（120）。闪烁体（120）在端面（121; 122）之间具有两个相对的端面（121; 122）和侧壁（123）。另外，放射线检测器还具有位于闪烁体（120）的侧壁（123）上并且响应于电磁辐射（202）的作用产生电子（204）的光电阴极部分（130）由所述闪烁体（120）产生的微通道板（161; 162）包括多个通道（165），用于将由所述光电阴极部分（130）产生的电子（204）与检测系统（171; 172），用于检测已经通过微通道板（161; 162）倍增的电子（204）。本发明还涉及一种包括这种类型的辐射探测器（100; 101; 102; 103; 104; 105; 106）的成像系统（110）。

7. 发明授权

US08124521B2 Electrical through contact 有权
标题翻译：电气通过接触
公开(公告)号：US08124521B2
公开(公告)日：2012-02-28
申请号：US11745145
申请日：2007-05-07
申请人： Harry Hedler , Roland Irsigler , Volker Lehmann , Judith Lehmann, legal representative , Thorsten Meyer , Octavio Trovarelli
发明人： Harry Hedler , Roland Irsigler , Volker Lehmann , Thorsten Meyer , Octavio Trovarelli
IPC分类号： H01L21/4763
CPC分类号： H01L21/76898 , H01L24/05 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/13009 , H01L2224/13025 , H01L2224/83894 , H01L2224/9202 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2224/05552 , H01L2924/00
摘要： A method of fabricating an electrical contact through a through hole in a substrate, wherein the through hole is at least in part filled with a liquid conductive material and the solidified liquid conductive material provides an electrical contact through the through hole.
摘要翻译：一种通过衬底中的通孔制造电接触的方法，其中所述通孔至少部分地填充有液体导电材料，并且所述固化的液体导电材料通过所述通孔提供电接触。

8. 发明授权

US08072084B2 Integrated circuit, circuit system, and method of manufacturing 有权
标题翻译：集成电路，电路系统及制造方法
公开(公告)号：US08072084B2
公开(公告)日：2011-12-06
申请号：US11855734
申请日：2007-09-14
申请人： Roland Irsigler , Harry Hedler , Stephan Dobritz
发明人： Roland Irsigler , Harry Hedler , Stephan Dobritz
IPC分类号： H01L23/482
CPC分类号： H01L24/11 , H01L23/3128 , H01L23/5387 , H01L23/5389 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2224/12105 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2924/0001 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3011 , H01L2924/00014
摘要： An integrated circuit, a circuit system and method of manufacturing such is disclosed. One embodiment provides a circuit chip including a first contact field on a chip surface; and an insulating layer on the chip surface. The insulating layer includes a flexible material. A contact pillar is coupled to the first contact field and extends from the chip surface through the insulating layer. The contact pillar includes a conductive material.
摘要翻译：公开了一种集成电路，电路系统及其制造方法。一个实施例提供一种包括芯片表面上的第一接触场的电路芯片; 以及芯片表面上的绝缘层。绝缘层包括柔性材料。接触柱耦合到第一接触场，并从芯片表面延伸穿过绝缘层。接触柱包括导电材料。

9. 发明授权

US08048479B2 Method for placing material onto a target board by means of a transfer board 有权
标题翻译：通过转印板将材料放置在目标板上的方法
公开(公告)号：US08048479B2
公开(公告)日：2011-11-01
申请号：US11496724
申请日：2006-08-01
申请人： Harry Hedler , Roland Irsigler , Volker Lehmann , Judith Lehmann, legal representative
发明人： Harry Hedler , Roland Irsigler , Volker Lehmann
IPC分类号： B05D5/12 , B05D1/18 , B23K31/00 , H01L23/48
CPC分类号： H05K3/3468 , H01L21/6835 , H01L24/11 , H01L51/0003 , H01L2224/0554 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/351 , H01R43/0235 , H05K3/207 , H05K3/3478 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , Y10T29/49155 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for placing material onto a target board by means of a transfer board comprising a plurality of blind holes, the method comprising the steps of immersing the transfer board in a material bath, wherein a first pressure acts on the material bath and a second pressure acts in the blind holes, and wherein the first pressure and the second pressure are substantially equal; generating a pressure difference between the first pressure and the second pressure, so that the blind holes of the transfer board are filled at least partially with the liquid material; extracting the transfer board from the material bath; and positioning the transfer board opposite to the target board, the material being expelled from the blind holes, such that the material touches the target board.
摘要翻译：一种通过包括多个盲孔的转印板将材料放置在目标板上的方法，所述方法包括以下步骤：将转印板浸入材料浴中，其中第一压力作用在材料槽上，第二压力作用在盲孔中，并且其中第一压力和第二压力基本相等; 产生第一压力和第二压力之间的压力差，使得转印板的盲孔至少部分地用液体材料填充; 从材料浴中提取转移板; 并且将转印板定位在与目标板相对的位置，材料从盲孔排出，使得材料接触目标板。

10. 发明授权

US08035220B2 Semiconductor packaging device 有权
标题翻译：半导体封装器件
公开(公告)号：US08035220B2
公开(公告)日：2011-10-11
申请号：US11966968
申请日：2007-12-28
申请人： Harry Hedler , Sven Rzepka
发明人： Harry Hedler , Sven Rzepka
IPC分类号： H01L23/14
CPC分类号： H01L24/96 , H01L21/6835 , H01L23/3114 , H01L23/3677 , H01L23/3735 , H01L23/562 , H01L24/19 , H01L24/97 , H01L25/0657 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/32145 , H01L2224/73267 , H01L2224/97 , H01L2225/06513 , H01L2225/06589 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/3511 , H01L2224/82 , H01L2924/00
摘要： Embodiments of the invention relate to a semiconductor module and to a method for manufacturing a semiconductor module. In an embodiment of the invention, a semiconductor module for mounting to a board may include at least an integrated circuit having connections on at least one side of the integrated circuit, and at least a first layer which is applied to the side of the integrated circuit having the connections, wherein the free surface of the first layer facing away from the integrated circuit has a thermo-mechanical linear expansion in the in-plane direction of the surface which corresponds to the thermo-mechanical linear expansion of the board to which the semiconductor module is to be mounted.
摘要翻译：本发明的实施例涉及半导体模块和半导体模块的制造方法。在本发明的一个实施例中，用于安装到电路板的半导体模块可以至少包括集成电路，该集成电路在集成电路的至少一侧具有连接，并且至少第一层被施加到集成电路的一侧具有连接，其中第一层的远离集成电路的自由表面在表面的面内方向上具有热机械线性膨胀，其对应于板的热机械线性膨胀，半导体模块要安装。

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