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    • 5. 发明授权
    • Gallium nitride based light-emitting device
    • 基于氮化镓的发光器件
    • US07345315B2
    • 2008-03-18
    • US11352205
    • 2006-02-13
    • Schang-Jing HonJenn-Bin Huang
    • Schang-Jing HonJenn-Bin Huang
    • H01L29/22
    • H01L33/32H01L33/105H01L33/465
    • A manufacturing method and a thus produced light-emitting structure for a white colored light-emitting device (LED) and the LED itself are disclosed. The white colored LED includes a resonant cavity structure, producing and mixing lights which may mix into a white colored light in the resonant cavity structure, so that the white colored LED may be more accurately controlled in its generated white colored light, which efficiently reduces deficiency, generates natural white colored light and aids in luminous efficiency promotion. In addition to the resonant cavity structure, the light-emitting structure also includes a contact layer, an n-type metal electrode and a p-type metal electrode.
    • 公开了一种用于白色发光器件(LED)和LED本身的制造方法和由此制造的发光结构。 白色LED包括谐振腔结构,产生和混合可在谐振腔结构中混合成白色光的光,从而可以在其产生的白色光中更准确地控制白色LED,从而有效地减少缺陷 产生天然白色光,有助于发光效率的提升。 除了谐振腔结构之外,发光结构还包括接触层,n型金属电极和p型金属电极。
    • 7. 发明申请
    • Gallium-nitride based light emitting diode structure and fabrication thereof
    • 氮化镓基发光二极管结构及其制造
    • US20060244017A1
    • 2006-11-02
    • US11428405
    • 2006-07-03
    • Mu-Jen LaiSchang-Jing Hon
    • Mu-Jen LaiSchang-Jing Hon
    • H01L29/80H01L31/112
    • H01L33/42H01L33/32
    • A method for fabricating GaN-based LED is provided. The method first forms a first contact spreading metallic layer on top of the texturing surface of the p-type ohmic contact layer. The method then forms a second and a third contact spreading metallic layers on top of the first contact spreading layer. The p-type transparent metallic conductive layer composed of the three contact spreading metallic layers, after undergoing an alloying process within an oxygenic or nitrogenous environment under a high temperature, would have a superior conductivity. The p-type transparent metallic conductive layer could enhance the lateral contact uniformity between the p-type metallic electrode and the p-type ohmic contact layer, so as to avoid the localized light emission resulted from the uneven distribution of the second contact spreading metallic layer within the third contact spreading metallic layer. The GaN-based LED's working voltage and external quantum efficiency are also significantly improved.
    • 提供了一种用于制造GaN基LED的方法。 该方法首先在p型欧姆接触层的纹理表面的顶部形成第一接触扩展金属层。 该方法然后在第一接触扩散层的顶部上形成第二和第三接触扩展金属层。 由三层接触扩散金属层构成的p型透明金属导电层,在高温下在含氧或含氮环境中进行合金化处理后,具有优异的导电性。 p型透明金属导电层可以增强p型金属电极和p型欧姆接触层之间的横向接触均匀性,以避免由于第二接触扩散金属层的不均匀分布引起的局部发光 在第三接触扩散金属层内。 GaN基LED的工作电压和外部量子效率也得到显着提高。
    • 9. 发明授权
    • Light emitting semiconductor device having reflection layer structure
    • 具有反射层结构的发光半导体器件
    • US06492661B1
    • 2002-12-10
    • US09434316
    • 1999-11-04
    • Fen-Ren ChienSchang-Jing HonMu-Jen Lai
    • Fen-Ren ChienSchang-Jing HonMu-Jen Lai
    • H01L3300
    • H01L33/405H01L33/0079H01L33/145
    • A light-emitting device with a reflection layer is disclosed. The reflection layer is formed on a light emitting stack structure. A second substrate is subsequently combined with the reflection layer, and then the original substrate of the stack structure is removed, such that the second substrate becomes the substrate of the device. The reflection layer can effectively reflect the light emitted from the light emitting stack structure and directed to the substrate, and thus can increase the light-emitting efficiency of a surface-emitting type light-emitting device. The invention can also convert a light-emnitting device using an insulated substrate to be the one having vertical type electrode structure so as to effectively reduce the wafer area used for a die and facilitate subsequent wiring and packaging processes using traditional mechanisms.
    • 公开了一种具有反射层的发光器件。 反射层形成在发光堆叠结构上。 随后将第二衬底与反射层组合,然后去除堆叠结构的原始衬底,使得第二衬底变成器件的衬底。 反射层可以有效地反射从发光堆叠结构发出的光并被引导到衬底,从而可以提高表面发射型发光器件的发光效率。 本发明还可以将使用绝缘基板的发光装置转换为具有垂直型电极结构的发光装置,以便有效地减少用于晶片的晶片面积,并利用传统的机制促进后续的布线和封装工艺。
    • 10. 发明授权
    • Light-emitting device
    • 发光装置
    • US09232586B2
    • 2016-01-05
    • US13336735
    • 2011-12-23
    • Schang-Jing HonChao-Hsing ChenHsin-Mao Liu
    • Schang-Jing HonChao-Hsing ChenHsin-Mao Liu
    • H05B37/02H05B33/08
    • H05B33/0824H01L2924/0002H05B33/0815Y02B20/346H01L2924/00
    • A light-emitting device is capable of receiving a first voltage signal, a second voltage signal, and a third voltage signal in sequence. The light-emitting device includes a first light-emitting unit, a second light-emitting unit, and a switching. The first voltage signal, the second voltage signal, and the third voltage signal is configured to introduce a first current signal, a second current signal, and a third current signal, respectively. The light-emitting device is configured to emit a first light when introducing the first current signal, the second current signal, and the third current signal. The light-emitting device is configured to emit a second light when introducing the second current signal and the third current signal. The light-emitting device is configured to emit a third light when introducing the second current signal.
    • 发光装置能够依次接收第一电压信号,第二电压信号和第三电压信号。 发光装置包括第一发光单元,第二发光单元和开关。 第一电压信号,第二电压信号和第三电压信号被配置为分别引入第一电流信号,第二电流信号和第三电流信号。 发光装置被配置为在引入第一电流信号,第二电流信号和第三电流信号时发射第一光。 发光装置被配置为在引入第二电流信号和第三电流信号时发射第二光。 发光装置被配置为在引入第二电流信号时发射第三光。