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    • 9. 发明申请
    • GaN semiconductor device
    • GaN半导体器件
    • US20090256159A1
    • 2009-10-15
    • US12382955
    • 2009-03-27
    • Yi-Chieh LinCheng-Ta KuoYu-Pin HsuChi-Ming Tsai
    • Yi-Chieh LinCheng-Ta KuoYu-Pin HsuChi-Ming Tsai
    • H01L33/00H01L29/20
    • H01L33/12H01L21/0237H01L21/02458H01L21/0254H01L21/02642H01L21/02647H01L33/007
    • This invention discloses a GaN semiconductor device comprising a substrate; a metal-rich nitride compound thin film on the substrate; a buffer layer formed on the metal-rich nitride compound thin film, and a semiconductor stack layer on the buffer layer wherein the metal-dominated nitride compound thin film covers a partial upper surface of the substrate. Because metal-rich nitride compound is amorphous, the epitaxial growth direction of the buffer layer grows upwards in the beginning and then turns laterally, and the epitaxy defects of the buffer layer also bend with the epitaxial growth direction of the buffer layer. Therefore, the probability of the epitaxial defects extending to the semiconductor stack layer is reduced and the reliability of the GaN semiconductor device is improved.
    • 本发明公开了一种包括基板的GaN半导体器件; 在基板上形成富金属的氮化物化合物薄膜; 形成在富金属氮化物化合物薄膜上的缓冲层,以及缓冲层上的半导体堆叠层,其中金属主导的氮化物化合物薄膜覆盖基板的部分上表面。 因为富金属的氮化物是非晶体,所以缓冲层的外延生长方向在开始时向上生长然后横向变化,并且缓冲层的外延缺陷也随着缓冲层的外延生长方向而弯曲。 因此,延伸到半导体堆叠层的外延缺陷的概率降低,并且提高了GaN半导体器件的可靠性。