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    • 2. 发明授权
    • Process for producing a semiconductor wafer
    • 半导体晶片的制造方法
    • US06416393B2
    • 2002-07-09
    • US09824394
    • 2001-04-02
    • Laszlo FabryGabriele LechnerAnton SchneggAndreas Ehlert
    • Laszlo FabryGabriele LechnerAnton SchneggAndreas Ehlert
    • B24B719
    • H01L21/02024B24B37/0056B24B37/042B24B37/08
    • A process is for producing a semiconductor wafer with a front surface and a back surface, in which the semiconductor wafer is subjected to two-sided polishing. The process includes the following: (a) producing a hydrophobic surface on the semiconductor wafer by treating the semiconductor wafer with an aqueous HF solution; (b) simultaneous polishing of the front surface and the back surface of the semiconductor wafer with a surface which has been rendered hydrophobic, with an alkaline polishing abrasive being continuously supplied between two rotating upper and lower polishing plates, which are both covered with a polishing cloth, the pH of the polishing abrasive being from pH 8.5 to pH 12.5; (c) after an intended polishing abrasion has been reached, supplying a stopping agent to the semiconductor wafer; and (d) removing the semiconductor wafer from the polishing plates. There is also a carrier for the double-side polishing of at least one semiconductor wafer, having a cutout for holding the semiconductor wafer which is lined with a shaped part made from plastic. The shaped part is constructed in such a manner that it divides a free space between an edge of the semiconductor wafer and the carrier into a plurality of separate empty spaces.
    • 一种制造具有正面和背面的半导体晶片的方法,其中半导体晶片进行双面抛光。 该方法包括以下步骤:(a)通过用HF水溶液处理半导体晶片在半导体晶片上产生疏水表面; (b)用已经变得疏水的表面同时抛光半导体晶片的前表面和后表面,碱性抛光磨料被连续地供应在两个旋转的上和下抛光板之间,两个旋转的上和下抛光板都被抛光 布,抛光磨料的pH为pH8.5至pH12.5; (c)在达到预期的抛光磨损之后,向半导体晶片供应止动剂; 和(d)从抛光板上去除半导体晶片。 还有一种用于至少一个半导体晶片的双面抛光的载体,具有用于保持半导体晶片的切口,该半导体晶片衬有由塑料制成的成形部件。 成形部分以这样的方式构造,即将半导体晶片的边缘与载体之间的自由空间分成多个分开的空间。
    • 5. 发明申请
    • Single crystal and semiconductor wafer and apparatus and method for producing a single crystal
    • 单晶和半导体晶片及其制造方法
    • US20070163485A1
    • 2007-07-19
    • US11655509
    • 2007-01-18
    • Laszlo FabryGunter StrebelHans Oelkrug
    • Laszlo FabryGunter StrebelHans Oelkrug
    • C30B15/00C30B11/00C30B21/06
    • C30B35/00C30B15/00Y10T117/10Y10T117/1064
    • The disclosure relates to an apparatus and a method for producing a single crystal of semiconductor material. The apparatus comprises a chamber and a crucible which is arranged in the chamber and is enclosed by a crucible heater, a radiation shield for shielding a growing single crystal and thermal insulation between the crucible heater and an inner wall of the chamber. The apparatus may include a resilient seal which seals a gap between the inner wall and the thermal insulation and forms an obstacle for the transport of gaseous iron carbonyls to the single crystal. The disclosure also relates to a method for producing a single crystal of semiconductor material by using the apparatus, the single crystal which is produced and a semiconductor wafer cut therefrom. The single crystal and the semiconductor wafer are distinguished by an edge region, which extends from the circumference to a distance of up to R-5 mm radially into the single crystal or the semiconductor wafer and has an iron concentration, wherein the iron concentration in the edge region is less than 1*109 atoms/cm3.
    • 本公开涉及一种用于制造半导体材料的单晶的装置和方法。 该装置包括一个室和一个坩埚,该坩埚被布置在室中并由坩埚加热器封闭,用于屏蔽增长的单晶的辐射屏蔽以及坩埚加热器和室的内壁之间的绝热。 该装置可以包括密封内壁和隔热层之间的间隙的弹性密封件,并且形成用于将气态铁羰基转移到单晶的障碍物。 本公开还涉及通过使用该装置制造半导体材料的单晶的方法,所制造的单晶和从其切下的半导体晶片。 单晶和半导体晶片的区别在于边缘区域,其从圆周延伸到直径为R-5mm的距离,直到单晶或半导体晶片,并具有铁浓度,其中铁浓度 边缘区域小于1×10 9原子/ cm 3。
    • 9. 发明申请
    • SINGLE CRYSTAL AND SEMICONDUCTOR WAFER AND APPARATUS AND METHOD FOR PRODUCING A SINGLE CRYSTAL
    • 单晶和半导体晶体及其制造方法
    • US20090031945A1
    • 2009-02-05
    • US12175376
    • 2008-07-17
    • Laszlo FabryGunter StrebelHans Oelkrug
    • Laszlo FabryGunter StrebelHans Oelkrug
    • C30B15/10
    • C30B35/00C30B15/00Y10T117/10Y10T117/1064
    • The disclosure relates to an apparatus and a method for producing a single crystal of semiconductor material. The apparatus comprises a chamber and a crucible which is arranged in the chamber and is enclosed by a crucible heater, a radiation shield for shielding a growing single crystal and thermal insulation between the crucible heater and an inner wall of the chamber. The apparatus may include a resilient seal which seals a gap between the inner wall and the thermal insulation and forms an obstacle for the transport of gaseous iron carbonyls to the single crystal. The disclosure also relates to a method for producing a single crystal of semiconductor material by using the apparatus, the single crystal which is produced and a semiconductor wafer cut therefrom. The single crystal and the semiconductor wafer are distinguished by an edge region, which extends from the circumference to a distance of up to R-5 mm radially into the single crystal or the semiconductor wafer and has an iron concentration, wherein the iron concentration in the edge region is less than 1*109 atoms/cm3.
    • 本公开涉及一种用于制造半导体材料的单晶的装置和方法。 该装置包括一个室和一个坩埚,该坩埚被布置在室中并由坩埚加热器封闭,用于屏蔽增长的单晶的辐射屏蔽以及坩埚加热器和室的内壁之间的绝热。 该装置可以包括密封内壁和隔热层之间的间隙的弹性密封件,并且形成用于将气态铁羰基转移到单晶的障碍物。 本公开还涉及通过使用该装置制造半导体材料的单晶的方法,所制造的单晶和从其切下的半导体晶片。 单晶和半导体晶片的区别在于边缘区域,其从圆周延伸到直径为R-5mm的距离,直到单晶或半导体晶片,并具有铁浓度,其中铁浓度 边缘区域小于1×10 9原子/ cm 3。