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    • 4. 发明申请
    • SHARED BIT LINE STRING ARCHITECTURE
    • 共享点行线建筑
    • US20140269100A1
    • 2014-09-18
    • US13797298
    • 2013-03-12
    • SANDISK TECHNOLOGIES INC.
    • Jongsun SelSeungpil LeeKwang-Ho KimTuan Pham
    • G11C16/24
    • G11C16/24G11C7/12G11C7/18G11C16/0483G11C2207/002
    • Methods for programming and reading memory cells using a shared bit line string architecture are described. In some embodiments, memory cells and select devices may correspond with transistors including a charge storage layer. In some cases, the charge storage layer may be conductive (e.g., a polysilicon layer as used in a floating gate device) or non-conductive (e.g., a silicon nitride layer as used in a SONOS device). In some embodiments, selection of a memory cell in a first string of a pair of strings may include setting an SEO transistor into a conducting state and setting an SGD line controlling drain-side select transistors to a voltage that is greater than a first threshold voltage associated with a first drain-side select transistor of the first string and less than a second threshold voltage associated with a second drain-side select transistor of a second string of the pair of strings.
    • 描述使用共享位线串结构对存储器单元进行编程和读取的方法。 在一些实施例中,存储器单元和选择器件可以对应于包括电荷存储层的晶体管。 在一些情况下,电荷存储层可以是导电的(例如,在浮栅器件中使用的多晶硅层)或非导电的(例如,在SONOS器件中使用的氮化硅层)。 在一些实施例中,一对串的第一串中的存储器单元的选择可以包括将SEO晶体管设置为导通状态,并将控制漏极侧选择晶体管的SGD线设置为大于第一阈值电压 与第一串的第一漏极侧选择晶体管相关联,并且小于与该对串的第二串的第二漏极侧选择晶体管相关联的第二阈值电压。
    • 8. 发明授权
    • Selective word line erase in 3D non-volatile memory
    • 3D非易失性存储器中的选择性字线擦除
    • US09318206B2
    • 2016-04-19
    • US14536923
    • 2014-11-10
    • SanDisk Technologies Inc.
    • Yingda DongAlex MakSeungpil LeeJohann Alsmeier
    • G11C16/14G11C16/04G11C16/16H01L29/792H01L27/115
    • G11C16/14G11C16/0483G11C16/16H01L27/11582H01L29/7926
    • An erase process for a 3D stacked memory device allows a portion of a block of memory cells to be erased. In one approach, in a U-shaped NAND string configuration, memory cells in the drain- or source-side columns are erased. In another approach, such as in a U-shaped or a straight NAND string configuration, memory cells in a portion of a column of memory cells are erased, and a dummy memory cell is provided between the erased and non-erased memory cells. A dummy memory cell can be on either side (e.g., above and below) of an erase memory cell, or on either side of a non-erased memory cell. A dummy memory cell is ineligible to store user data, but prevents a downshift in the threshold voltage of an erased memory cell from changing the threshold voltage of a non-erased memory cell, due to capacitive coupling.
    • 用于3D堆叠存储器件的擦除处理允许擦除存储单元块的一部分。 在一种方法中,在U形NAND串配置中,漏极或源极侧列中的存储单元被擦除。 在另一种方法中,例如在U形或直的NAND串配置中,擦除存储器单元列的一部分中的存储单元,并且在擦除和未擦除的存储器单元之间提供虚拟存储单元。 虚拟存储器单元可以在擦除存储器单元的任一侧(例如,高于和低于),或者在未擦除的存储器单元的任一侧上。 虚拟存储单元不能存储用户数据,但是由于电容耦合,防止擦除的存储单元的阈值电压的降档改变未擦除的存储单元的阈值电压。