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1. 发明申请

US20110242780A1 MOUNT BOARD AND ELECTRONIC DEVICE 有权
标题翻译：安装板和电子设备
公开(公告)号：US20110242780A1
公开(公告)日：2011-10-06
申请号：US13158037
申请日：2011-06-10
申请人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
发明人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
IPC分类号： H05K7/14 , H05K7/00
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

2. 发明申请

US20140003015A1 MOUNT BOARD AND ELECTRONIC DEVICE 有权
标题翻译：安装板和电子设备
公开(公告)号：US20140003015A1
公开(公告)日：2014-01-02
申请号：US14016707
申请日：2013-09-03
申请人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
发明人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
IPC分类号： H05K1/18
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

3. 发明申请

US20120140330A1 LENS BARREL DEVICE AND IMAGING APPARATUS 审中-公开
标题翻译：镜头贝尔装置和成像装置
公开(公告)号：US20120140330A1
公开(公告)日：2012-06-07
申请号：US13302100
申请日：2011-11-22
申请人： Tatsuyuki NAKAYAMA , Hideharu MIYAGAKI , Tomohiro YASUI , Junya SATO , Yusuke HOSOMI
发明人： Tatsuyuki NAKAYAMA , Hideharu MIYAGAKI , Tomohiro YASUI , Junya SATO , Yusuke HOSOMI
IPC分类号： G02B7/20 , G02B7/02
CPC分类号： G02B27/0018 , G02B7/08 , G03B17/04 , G03B2205/0046
摘要： A lens barrel device that configures a lens barrel supporting an optical system includes: a first lens barrel; a second lens barrel that moves in a direction of an optical axis with respect to the first lens barrel in accordance with rotation of the first lens barrel around the optical axis of the optical system; and a light shielding member that is disposed so as to block a gap between the second lens barrel and the first lens barrel.
摘要翻译：配置支撑光学系统的透镜镜筒的镜筒装置包括：第一透镜镜筒; 根据第一透镜筒绕光学系统的光轴的旋转，相对于第一透镜镜筒在光轴方向上移动的第二镜筒; 以及遮光部件，其设置成阻挡第二透镜镜筒与第一镜筒之间的间隙。

4. 发明申请

US20090241902A1 INTERNAL COMBUSTION ENGINE 有权
标题翻译：内燃机
公开(公告)号：US20090241902A1
公开(公告)日：2009-10-01
申请号：US12394753
申请日：2009-02-27
申请人： Kazuhito HOTTA , Junya SATO , Yuji KASHIWABARA
发明人： Kazuhito HOTTA , Junya SATO , Yuji KASHIWABARA
IPC分类号： F02M63/00
CPC分类号： F02M69/54 , F02M35/10032 , F02M35/10216 , F02M35/116 , F02M35/162 , F02M69/044 , F02M69/462 , F02M2200/315
摘要： An internal combustion engine includes a cylinder head having a plurality of intake ports; throttle devices including a plurality of respective intake passages equipped with throttle valves therein; a plurality of fuel injection valves for injecting fuel into the corresponding intake passages; a fuel pipe adapted to supply fuel to the fuel injection valves; and a pulsation damper connected to the fuel pipe to damp fuel pressure pulsation. In the engine, a connection pipe coupled to the pulsation damper is formed between a plurality of branch portions with respect a longitudinal direction of the fuel pipe, adapted to deliver fuel from the fuel pipe to the fuel injection valves and the connection pipe is disposed to at least partially overlap the fuel injection valve as viewed from the longitudinal direction of the fuel pipe.
摘要翻译：内燃机包括具有多个进气口的气缸盖; 节流装置包括在其中配有节流阀的多个相应的进气通道; 多个燃料喷射阀，用于将燃料喷射到相应的进气通道中; 燃料管，适于向燃料喷射阀供应燃料; 和连接到燃料管的脉动阻尼器以阻止燃料压力脉动。在发动机中，连接在脉动阻尼器上的连接管相对于燃料管的纵向方向形成在多个分支部分之间，适用于将燃料从燃料管输送到燃料喷射阀，连接管设置在从燃料管的纵向方向观察燃料喷射阀至少部分重叠。

5. 发明申请

US20100057249A1 THERMAL PROCESSING APPARATUS, THERMAL PROCESSING METHOD, AND STORAGE MEDIUM 有权
标题翻译：热处理设备，热处理方法和储存介质
公开(公告)号：US20100057249A1
公开(公告)日：2010-03-04
申请号：US12548873
申请日：2009-08-27
申请人： Yo ABE , Kiichi TAKAHASHI , Junya SATO , Yoshinobu MOTODATE
发明人： Yo ABE , Kiichi TAKAHASHI , Junya SATO , Yoshinobu MOTODATE
IPC分类号： H01L21/68
CPC分类号： H01L21/67098 , H01L21/67109 , H01L21/67766 , H01L21/67781
摘要： When a substrate is transferred by a holding arm to a multiple tier wafer boat, contact between the holding arm and the substrate is prevented. When the wafer boat is not subjected to a thermal effect, a normal height position of a ring member is obtained by relatively elevating and lowering a transfer base member with respect to the wafer boat. Before a wafer, which is not yet thermally processed, is transferred to the wafer boat, a height position of the corresponding ring member is obtained. By comparing a difference between the normal height position of the ring member and the height position of the ring member before the wafer is transported, with a threshold value, whether to transfer the wafer by the wafer transfer mechanism to the wafer boat can be judged.
摘要翻译：当基板被保持臂转移到多层晶片舟皿时，防止了保持臂和基板之间的接触。当晶片舟不受热效应时，通过相对于晶片舟相对地升高和降低转印基底构件，获得环形构件的正常高度位置。在尚未热处理的晶片被转移到晶片舟皿之前，获得相应的环件的高度位置。通过比较环状构件的正常高度位置与晶片运送前环状构件的高度位置之间的差异，可以判断是否通过晶片传送机构将晶片转移到晶片舟皿上。

6. 发明申请

US20090241900A1 INTAKE AIR CONTROL SYSTEM OF V-TYPE INTERNAL COMBUSTION ENGINE 有权
标题翻译：采用V型内燃机的空气控制系统
公开(公告)号：US20090241900A1
公开(公告)日：2009-10-01
申请号：US12392311
申请日：2009-02-25
申请人： Junya SATO , Kazuhito HOTTA , Yuji KASHIWABARA
发明人： Junya SATO , Kazuhito HOTTA , Yuji KASHIWABARA
IPC分类号： F02M7/26
CPC分类号： F02M35/116 , F02B61/02 , F02D9/1095 , F02M35/10032 , F02M35/10085 , F02M35/10111 , F02M35/10216 , F02M35/162 , F02M69/043 , F02M69/044
摘要： An intake air control system of a V-type internal combustion engine having cylinder axes formed in a V-shape with a crankshaft provided therebetween is provided. An operation input shaft driven by an operator's input and an operation input shaft turning angle sensor that detects a turning angle of the operation input shaft are also provided. A throttle body having a throttle valve is formed with an intake passage for each of the cylinders. The operation input shaft is located between valve shafts of an opposing pair of throttle valves that are located on opposing bank portions of the V-type internal combustion engine, when viewed from the direction of the crankshaft. The operation input shaft is disposed separately from the throttle valve shafts and the operation input shaft turning angle sensor is provided at a shaft end of the operation input shaft.
摘要翻译：提供了一种V型内燃机的进气控制系统，其具有形成为V形的气缸轴线，其间设置有曲轴。还提供了由操作者输入驱动的操作输入轴和检测操作输入轴的转动角度的操作输入轴转向角传感器。具有节流阀的节气门体形成有用于每个气缸的进气通道。当从曲轴的方向观察时，操作输入轴位于相对的一对节流阀的位于V型内燃机的相对的堤部上的阀轴之间。操作输入轴与节流阀轴分开设置，操作输入轴转角传感器设置在操作输入轴的轴端。

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