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1. 发明申请

US20140003015A1 MOUNT BOARD AND ELECTRONIC DEVICE 有权
标题翻译：安装板和电子设备
公开(公告)号：US20140003015A1
公开(公告)日：2014-01-02
申请号：US14016707
申请日：2013-09-03
申请人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
发明人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
IPC分类号： H05K1/18
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

2. 发明申请

US20110242780A1 MOUNT BOARD AND ELECTRONIC DEVICE 有权
标题翻译：安装板和电子设备
公开(公告)号：US20110242780A1
公开(公告)日：2011-10-06
申请号：US13158037
申请日：2011-06-10
申请人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
发明人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
IPC分类号： H05K7/14 , H05K7/00
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

3. 发明申请

US20150179615A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20150179615A1
公开(公告)日：2015-06-25
申请号：US14557644
申请日：2014-12-02
申请人： Shinji WATANABE , Tsuyoshi KIDA , Yoshihiro ONO , Kentaro MORI , Kenji SAKATA , Yusuke YAMADA
发明人： Shinji WATANABE , Tsuyoshi KIDA , Yoshihiro ONO , Kentaro MORI , Kenji SAKATA , Yusuke YAMADA
IPC分类号： H01L25/065 , H01L23/00 , H01L21/78 , H01L25/00
CPC分类号： H01L25/0657 , H01L21/78 , H01L23/3135 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/50 , H01L2224/13017 , H01L2224/13025 , H01L2224/13082 , H01L2224/13084 , H01L2224/13111 , H01L2224/13147 , H01L2224/1601 , H01L2224/16058 , H01L2224/1607 , H01L2224/16145 , H01L2224/16146 , H01L2224/16238 , H01L2224/165 , H01L2224/16505 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75252 , H01L2224/81075 , H01L2224/81191 , H01L2224/81815 , H01L2224/8183 , H01L2224/81986 , H01L2224/83192 , H01L2224/83862 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/014 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/20106 , H01L2924/2064 , H01L2924/00012 , H01L2224/16225 , H01L2924/00 , H01L2924/00014 , H01L2924/01029 , H01L2924/013
摘要： To improve reliability of a semiconductor device. In a conductive material that electrically couples a Cu pillar electrode and a lead, an alloy part comprised of an alloy of tin and copper is formed inside this conductive material. At this time, the alloy part contacts both the Cu pillar electrode and the lead, and the Cu pillar electrode and the lead are bound through the alloy part. Similarly, also in FIG. 8, it is found that the Cu pillar electrode and the lead are electrically coupled to each other by the alloy part. Thereby, it is possible to improve electric coupling reliability between the Cu pillar electrode and the lead.
摘要翻译：提高半导体器件的可靠性。在电耦合Cu柱电极和引线的导电材料中，在该导电材料内形成由锡和铜合金组成的合金部分。此时，合金部分接触Cu柱电极和引线，Cu柱电极和引线通过合金部分结合。类似地，也在图1中。如图8所示，发现Cu柱电极和引线通过合金部件彼此电耦合。由此，能够提高Cu柱电极与引线之间的电耦合可靠性。

4. 发明申请

US20120270700A1 ENGINE START CONTROL DEVICE 有权
标题翻译：发动机起动控制装置
公开(公告)号：US20120270700A1
公开(公告)日：2012-10-25
申请号：US13278277
申请日：2011-10-21
申请人： Nozomu KAMIOKA , Shinji WATANABE , Kensuke HAYASHI , Satoshi WACHI
发明人： Nozomu KAMIOKA , Shinji WATANABE , Kensuke HAYASHI , Satoshi WACHI
IPC分类号： B60W30/00 , B60W10/06 , F02N11/08 , B60W10/02
CPC分类号： F04B49/022 , B60Y2300/18016 , B60Y2300/192 , F02D41/0215 , F02D2250/28 , F02N11/0814 , F02N15/08 , F02N2200/041 , F16H61/0031 , Y02T10/48 , Y10T477/6418 , Y10T477/71
摘要： An engine start control device includes a mechanical pump supplying hydraulic pressure; an electric pump connected in parallel to the mechanical pump and independently driven; a device for stopping the engine when an idling stop condition is satisfied and starting the engine when a restart condition and a fuel injection condition are satisfied; a device for driving the electric pump when the hydraulic pressure is less than a first hydraulic pressure when the engine is stopped by idling stop; and a device for driving a motor at a target speed and for performing control so that the change in the target speed is small compared with the change exhibited when the hydraulic pressure is equal or higher than a second hydraulic pressure, when the hydraulic pressure is less than the second hydraulic pressure, and the restart condition is satisfied after the idling stop.
摘要翻译：发动机启动控制装置包括提供液压的机械泵; 电动泵并联连接到机械泵并独立驱动; 当满足怠速停止条件时停止发动机的装置，并且当重新启动条件和燃料喷射条件被满足时启动发动机; 当发动机通过怠速停止而停止时，液压小于第一液压时驱动电动泵的装置; 以及用于以目标速度驱动电动机并且用于执行控制的装置，使得当液压等于或高于第二液压时显示的变化与目标速度的变化相比较小，当液压较小时超过第二液压，并且在怠速停止之后满足重启条件。

5. 发明申请

US20080180065A1 CHARGING DEVICE 有权
标题翻译：充电设备
公开(公告)号：US20080180065A1
公开(公告)日：2008-07-31
申请号：US12020968
申请日：2008-01-28
申请人： Takao ARADACHI , Kazuhiko FUNABASHI , Shinji WATANABE
发明人： Takao ARADACHI , Kazuhiko FUNABASHI , Shinji WATANABE
IPC分类号： H02J7/10
CPC分类号： H02J7/0031 , H02J2007/0095
摘要： To prevent a battery pack from being over-discharged even under a state that the battery pack (a secondary battery) is connected to a discharging device that is not connected to an ac input power source for a long time. A charging device 200 has a pair of output lines L1 and L2 and an anode terminal O1 and a cathode terminal O2 of a secondary battery 2 electrically connected between the output lines L1 and L2 to carry out a charging operation. In the charging device 200 including a component circuit part (a resistance 33, a series connecting circuit of resistances 102, 103 and 105, a series connecting circuit of resistances 91 and 92 and an inner circuit part of a shunt regulator 116) electrically connected by traversing a part between the pair of output lines L1 and L2, a switching element 121 is inserted between the component circuit part (the resistance 33 or the like) and one of the pair of output lines L1 and L2. When the charging device 200 is not connected to an input power source 1, the switching element 121 is allowed to be non-conductive to interrupt a discharging path so that the component circuit part does not form the discharging path.
摘要翻译：即使在电池组（二次电池）连接到长时间未连接到交流输入电源的放电装置的状态下，也可防止电池组过度放电。充电装置200具有一对输出线L 1和L 2以及电连接在输出线L 1和L 2之间的二次电池2的阳极端子O 1和阴极端子O 2，以执行充电操作。在包括组件电路部分（电阻33，电阻102,103和105的串联连接电路，电阻91和92的串联连接电路和分流调节器116的内部电路部分）的充电装置200中，电连接穿过一对输出线L 1和L 2之间的部分，开关元件121插入在组件电路部分（电阻33等）和一对输出线L 1和L 2中的一个之间。当充电装置200未连接到输入电源1时，允许开关元件121不导通以中断放电路径，使得元件电路部分不形成放电路径。

6. 发明申请

US20120197509A1 ENGINE CONTROL APPARATUS 失效
标题翻译：发动机控制装置
公开(公告)号：US20120197509A1
公开(公告)日：2012-08-02
申请号：US13179238
申请日：2011-07-08
申请人： Shinji WATANABE
发明人： Shinji WATANABE
IPC分类号： F02D28/00
CPC分类号： F02D29/02 , F02D9/02 , F02D11/106 , F02D41/0002 , F02D41/042 , F02D41/062 , F02D41/1401 , F02D2041/1422 , F02D2200/021 , F02D2200/501 , F02N11/0818 , Y02T10/42
摘要： An engine control apparatus includes an ISS control unit provided with ISS determination means for inputting at least an engine cooling water temperature, vehicle speed, and brake information, and target opening setting means for setting a target opening in an idle stop/start control period; and a throttle control unit provided with proportional gain correction coefficient operation means for correcting a proportional gain to a value that is larger than a proportional gain outside the idle stop/start control period, throttle opening feedback control means for performing a throttle opening feedback control operation based on an opening deviation between a target opening and an actual opening, and PWM driving means for outputting a voltage that is in proportion to the operation amount to a motor.
摘要翻译：发动机控制装置包括：ISS控制单元，其具有至少输入发动机冷却水温度，车速和制动信息的ISS判定单元，以及用于在怠速停止/起动控制期间内设定目标开度的目标开度设定单元; 以及节气门控制单元，其具有比例增益校正系数运算单元，用于将比例增益校正为大于怠速停止/开始控制周期以外的比例增益的值;节气门开度反馈控制单元，其执行节气门开度反馈控制动作基于目标开度和实际开度之间的开度偏差，以及用于输出与电动机的操作量成比例的电压的PWM驱动装置。

7. 发明申请

US20110242717A1 POWER TOOL 审中-公开
公开(公告)号：US20110242717A1
公开(公告)日：2011-10-06
申请号：US13084059
申请日：2011-04-11
申请人： Kazuhiko FUNABASHI , Shinji WATANABE , Eiji NAKAYAMA
发明人： Kazuhiko FUNABASHI , Shinji WATANABE , Eiji NAKAYAMA
IPC分类号： H02H3/00 , H02J7/00
CPC分类号： H01M10/48 , H01M10/425 , H01M10/441 , H01M10/448 , Y10T307/826
摘要： A power tool 1 is connected to a battery pack 5 including an overcurrent detector 533 which detects overcurrent of a battery module 51 and outputs a detection signal, and an overdischarge detector 532 which detects overdischarge of the battery module 51 and outputs a detection signal. The power tool 1 includes a motor 2 which is driven by electric power supplied from the battery pack 5, a trigger switch 31 for setting the power supply from the battery pack 5 to the motor 2 in ON/OFF state, and an FET 410 which sets the power supply to the motor 2 in ON/OFF state on the basis of the detection signal from the overcurrent detector 533 or the overdischarge detector 532.

8. 发明申请

US20110150353A1 INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND PROGRAM 失效
标题翻译：信息处理设备，信息处理方法和程序
公开(公告)号：US20110150353A1
公开(公告)日：2011-06-23
申请号：US12911290
申请日：2010-10-25
申请人： Shinji WATANABE , Junichiro Enoki
发明人： Shinji WATANABE , Junichiro Enoki
IPC分类号： G06K9/40
CPC分类号： G06T5/003
摘要： An information processing apparatus includes a first generating unit, a second generating unit, and an updating unit. The first generating unit generates a point spread function representing the degree of blurring generated in the input image. The second generating unit generates a plurality of corrected block images obtained by correcting blurring of structure components of plural input block images based on the point spread function. The updating unit executes one or more times an updating process to update the corrected block images, followed by making structure components of the updated corrected block images into new corrected block images.
摘要翻译：信息处理设备包括第一生成单元，第二生成单元和更新单元。第一生成单元生成表示在输入图像中生成的模糊程度的点扩散函数。第二生成单元生成通过基于点扩展函数来校正多个输入块图像的结构成分的模糊而获得的多个校正块图像。更新单元执行一次或多次更新处理以更新校正的块图像，随后将更新的校正块图像的结构分量构成新的校正块图像。

9. 发明申请

US20090243075A1 MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS USING SAME 失效
标题翻译：使用相同的半导体器件和电子设备的安装结构
公开(公告)号：US20090243075A1
公开(公告)日：2009-10-01
申请号：US12409796
申请日：2009-03-24
申请人： Shinji WATANABE , Takao YAMAZAKI
发明人： Shinji WATANABE , Takao YAMAZAKI
IPC分类号： H01L23/12 , H01L23/498
CPC分类号： H01L25/105 , H01L23/3128 , H01L23/5387 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/107 , H01L2924/00014 , H01L2924/01078 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A mounting structure comprises: at least one semiconductor device having solder bumps as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is structured to be wrapped by the flexible wiring board, the mounting structure is provided with outer electrodes on both sides of the flexible wiring board, one side being a side where outer terminals of the semiconductor device are formed, and the other side being an opposite side thereof. At least one wiring layer is formed on the flexible wiring board. A supporting member is provided covering side faces and a surface of the semiconductor device opposite to the side where the outer terminals are formed and protruding from the side faces of the semiconductor device and extending toward the surface on which the outer terminals are formed.
摘要翻译：安装结构包括：至少一个具有作为外部端子的焊料凸块的半导体器件和其上形成有布线的柔性布线板。半导体器件被构造成被柔性布线板包裹，安装结构在柔性布线板的两侧设置有外部电极，一侧是形成半导体器件的外部端子的一侧，另一侧是相反的一面。在柔性布线板上形成至少一个布线层。提供了一种支撑构件，其覆盖半导体器件的与形成外部端子的侧相对的侧面和表面，并且从半导体器件的侧面突出并且朝向形成有外部端子的表面延伸。

10. 发明申请

US20120295757A1 VEHICLE DRIVE CONTROL SYSTEM 有权
标题翻译：车辆驾驶控制系统
公开(公告)号：US20120295757A1
公开(公告)日：2012-11-22
申请号：US13232537
申请日：2011-09-14
申请人： Shinji WATANABE , Nozomu KAMIOKA , Kensuke HAYASHI
发明人： Shinji WATANABE , Nozomu KAMIOKA , Kensuke HAYASHI
IPC分类号： B60W10/08 , B60W20/00
CPC分类号： B60W10/06 , B60W10/30 , B60W30/18018 , B60W30/18063 , B60W2510/0604 , B60W2510/0638 , B60W2510/0676 , B60W2510/0685 , B60W2510/105 , B60W2540/10 , B60W2540/12 , B60W2710/0644 , F02N11/04 , F02N11/0814 , F02N11/0822 , F02N2011/0896 , F02N2200/022 , F02N2300/104 , F02N2300/2004 , Y02T10/48 , Y02T10/7258 , Y10T477/24
摘要： A vehicle drive control system includes a motor coupled with the driving shaft of an internal combustion engine so that torque can be transmitted to the drive wheels when fuel supply to the engine is cut off. The vehicle travels in a creeping mode in this state while motoring of the engine is performed through driving force of the motor. When accelerator depression is detected, fuel injection into a cylinder waiting for the intake stroke of the engine is begun and the engine is started. The crank angle position at a time when fuel injection is started is utilized as a reference position. When the crankshaft of the engine rotates from the reference crank angle position to a predetermined crank angle position, driving by the motor is stopped and the vehicle is then driven by the engine.
摘要翻译：车辆驱动控制系统包括与内燃机的驱动轴结合的马达，使得在向发动机供油的燃料被切断时扭矩可以传递到驱动轮。在该状态下，车辆以爬行模式行驶，同时通过马达的驱动力来进行发动机的驱动。当检测到加速器下压时，开始向等待发动机的进气冲程的气缸中的燃料喷射，并且发动机起动。燃料喷射开始时的曲柄角位置用作基准位置。当发动机的曲轴从基准曲柄角位置旋转到预定的曲柄角位置时，停止通过马达的驱动，然后由发动机驱动车辆。

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