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1. 发明申请

US20110242780A1 MOUNT BOARD AND ELECTRONIC DEVICE 有权
标题翻译：安装板和电子设备
公开(公告)号：US20110242780A1
公开(公告)日：2011-10-06
申请号：US13158037
申请日：2011-06-10
申请人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
发明人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
IPC分类号： H05K7/14 , H05K7/00
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

2. 发明申请

US20140003015A1 MOUNT BOARD AND ELECTRONIC DEVICE 有权
标题翻译：安装板和电子设备
公开(公告)号：US20140003015A1
公开(公告)日：2014-01-02
申请号：US14016707
申请日：2013-09-03
申请人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
发明人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
IPC分类号： H05K1/18
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

3. 发明申请

US20120250425A1 SEMICONDUCTOR MEMORY AND SEMICONDUCTOR MEMORY CONTROL METHOD 有权
标题翻译：半导体存储器和半导体存储器控制方法
公开(公告)号：US20120250425A1
公开(公告)日：2012-10-04
申请号：US13432708
申请日：2012-03-28
申请人： Masahiro YOSHIHARA , Katsumi ABE
发明人： Masahiro YOSHIHARA , Katsumi ABE
IPC分类号： G11C7/10
CPC分类号： G11C7/1078 , G11C7/08 , G11C7/1051 , G11C7/106 , G11C7/1087 , G11C7/12 , G11C7/22 , G11C16/0483 , G11C16/10 , G11C16/26 , G11C16/3418 , G11C2207/2227 , G11C2207/2245
摘要： According to one embodiment, the semiconductor memory includes a memory cell array which includes memory cells to store data, a buffer circuit which includes latches, each of the latches including transistors as control elements and a flip-flop, and a control circuit which turns off the transistors to deactivate one or more of the latches.
摘要翻译：根据一个实施例，半导体存储器包括存储单元阵列，其包括用于存储数据的存储单元，包括锁存器的缓冲电路，每个锁存器包括作为控制元件的晶体管和触发器，以及控制电路，晶体管去激活一个或多个锁存器。

4. 发明申请

US20100291480A1 ELECTROPHOTOGRAPHIC PHOTOSENSITIVE BODY 审中-公开
标题翻译：电子感光体
公开(公告)号：US20100291480A1
公开(公告)日：2010-11-18
申请号：US12840679
申请日：2010-07-21
申请人： Katsumi ABE , Atsushi Takesue , Takehiro Nakajima , Makoto Koike , Shinya Nagai
发明人： Katsumi ABE , Atsushi Takesue , Takehiro Nakajima , Makoto Koike , Shinya Nagai
IPC分类号： G03G5/04
CPC分类号： G03G5/102 , G03G5/0564 , G03G5/0614 , G03G5/0679 , G03G5/0681 , G03G5/0685 , G03G5/0696
摘要： An object of the present invention is to provide an electrophotographic photosensitive body having improved electrophotographic characteristics such as sensitivity and residual potential and also having excellent durability. The present invention provides an electrophotographic photosensitive body having a layer containing at least one specific p-terphenyl compound and at least one polycarbonate resin represented by the general formula (I): in a mass ratio of the p-terphenyl compound to the polycarbonate resin within the range of 2:8 to 7:3.
摘要翻译：本发明的目的是提供一种电子照相感光体，其具有改善的电子照相特性，例如灵敏度和残留电位，并且还具有优异的耐久性。本发明提供一种电子照相感光体，其具有含有至少一种特定对三联苯化合物的层和至少一种由通式（I）表示的聚碳酸酯树脂：以对三联苯化合物与聚碳酸酯树脂的质量比范围为2：8至7：3。

5. 发明申请

US20100285273A1 ACRYLIC RUBBER-METAL COMPOSITE 有权
标题翻译：丙烯橡胶 - 金属复合材料
公开(公告)号：US20100285273A1
公开(公告)日：2010-11-11
申请号：US12663310
申请日：2008-05-13
申请人： Katsumi ABE , Kiyofumi FUKASAWA
发明人： Katsumi ABE , Kiyofumi FUKASAWA
IPC分类号： B32B15/08 , B32B3/10
CPC分类号： B32B15/06 , B32B5/147 , B32B7/12 , B32B15/18 , B32B2255/06 , B32B2255/20 , B32B2255/26 , B32B2307/306 , B32B2307/538 , B32B2307/554 , B32B2307/714 , C23C22/08 , Y10T428/24355 , Y10T428/31696
摘要： An acrylic rubber-metal composite, which comprises an iron phosphate treated iron-based metal, and an adhesive layer comprising a phenol resin and a metal oxide, and preferably further a halogenated polymer, and an acrylic rubber layer, successively provided on the iron-based metal surface, has not only distinguished initial adhesiveness and water resistance, when the acrylic rubber is bonded to the metal owing to application of the iron phosphate treatment to the metal surface, but also can reduce the abrasion of the mating materials when brought into contact with rubber-unbaked parts of the sheet, because the surface roughness Ra[according to JIS 0601(1994)] of the surface treated steel sheet is 0.6 or less.
摘要翻译：包含磷酸铁处理的铁基金属的丙烯酸橡胶 - 金属复合物和包含酚醛树脂和金属氧化物的粘合剂层，并且优选地还包含卤化聚合物和丙烯酸橡胶层，由于将金属磷酸盐处理应用于金属表面，当将丙烯酸橡胶与金属接合时，不仅可以区分初始的粘合性和耐水性，而且还可以在接触时减少配合材料的磨损由于表面处理钢板的表面粗糙度Ra [根据JIS0601（1994）]为0.6以下，因此具有橡胶未烘烤部分的片材。

6. 发明申请

US20100188913A1 SEMICONDUCTOR MEMORY DEVICE HAVING SENSE AMPLIFIER 有权
标题翻译：具有感测放大器的半导体存储器件
公开(公告)号：US20100188913A1
公开(公告)日：2010-07-29
申请号：US12693798
申请日：2010-01-26
申请人： Masahiro YOSHIHARA , Katsumi ABE
发明人： Masahiro YOSHIHARA , Katsumi ABE
IPC分类号： G11C7/06 , G11C7/00
CPC分类号： G11C7/12 , G11C7/08 , G11C2207/005
摘要： A semiconductor memory device includes a memory cell array, a page buffer, a data line pair, a differential amplifier and a precharger. The memory cell array includes a plurality of pages in which a plurality of memory cells are arranged. The page buffer is formed adjacent to the memory cell array, and includes a plurality of sense amplifiers configured to temporarily hold page data read from the memory cells in the page. The data line pair is arranged in the page buffer and is connected to the sense amplifiers. The differential amplifier is configured to amplify a potential difference between lines of the data line pair. The precharger is configured to precharge the data line pair to a predetermined potential. At least one of the differential amplifier and the precharger is formed in the page buffer, and the at least one circuit is electrically connected to the data line pair.
摘要翻译：半导体存储器件包括存储单元阵列，页缓冲器，数据线对，差分放大器和预充电器。存储单元阵列包括多个存储单元布置在其中的多个页面。页面缓冲器形成在与存储单元阵列相邻的位置，并且包括多个读出放大器，被配置为临时保持从页面中的存储器单元读取的页面数据。数据线对被布置在页缓冲器中并连接到读出放大器。差分放大器被配置为放大数据线对的线之间的电位差。预充电器被配置为将数据线对预充电到预定电位。差分放大器和预充电器中的至少一个形成在页面缓冲器中，并且至少一个电路电连接到数据线对。

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