专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20140029208A1 COMPONENT-CONTAINING MODULE AND METHOD FOR PRODUCING COMPONENT-CONTAINING MODULE 审中-公开
标题翻译：包含组件的组件模块和用于生产组件模块的方法
公开(公告)号：US20140029208A1
公开(公告)日：2014-01-30
申请号：US14110341
申请日：2012-04-02
申请人： Nozomu Nishimura , Nobuhiro Mikami
发明人： Nozomu Nishimura , Nobuhiro Mikami
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K1/181 , H01L2224/16 , H01L2924/181 , H01L2924/18161 , H05K1/119 , H05K3/0014 , H05K3/284 , H05K3/30 , H05K5/064 , H05K2201/091 , H05K2203/1316 , Y10T29/49146 , H01L2924/00012
摘要： The present invention pertains to a component-containing module that is: provided with a substrate configured from flat sections and a projecting section, and electronic components mounted on the flat sections and the projecting section; and characterized in that the electronic components mounted on the flat sections are sealed in resin, and the electronic component mounted on the projecting section has an upper part thereof exposed above the resin surface.
摘要翻译：本发明涉及一种含有组件的模块，该组件设置有由平坦部分和突出部分构成的基板，以及安装在平坦部分和突出部分上的电子部件; 并且其特征在于，安装在平坦部分上的电子部件被密封在树脂中，并且安装在突出部分上的电子部件的上部暴露在树脂表面之上。

2. 发明申请

US20130176746A1 COMPONENT BUILT-IN MODULE, ELECTRONIC DEVICE INCLUDING SAME, AND METHOD FOR MANUFACTURING COMPONENT BUILT-IN MODULE 有权
标题翻译：组件内置模块，包括它们的电子设备以及制造组件内置模块的方法
公开(公告)号：US20130176746A1
公开(公告)日：2013-07-11
申请号：US13824805
申请日：2011-07-19
申请人： Nozomu Nishimura , Nobuhiro Mikami
发明人： Nozomu Nishimura , Nobuhiro Mikami
IPC分类号： H05K1/18 , H05K3/44 , F21V21/00
CPC分类号： H05K1/186 , F21V21/00 , H05K1/189 , H05K3/284 , H05K3/44 , H05K2201/2009 , H05K2203/1316 , H05K2203/1327 , Y10T29/49146
摘要： A component built-in module of the present invention includes: a flexible substrate that includes a first surface and a second surface on an opposite side of the first surface, the first surface including a concave part recessed in a direction from the first surface toward the second surface; a plurality of electronic components that are mounted on the first surface, mounting heights of the electronic components from the first surface to respective upper surfaces of the electronic components differing from each other; and a resin that seals the first surface. Among the plurality of electronic components, at least an electronic component having a highest mounting height is mounted in the concave part.
摘要翻译：本发明的组件内置模块包括：柔性基板，包括第一表面和与第一表面相对的第二表面，第一表面包括从第一表面朝向第一表面的方向凹陷的凹部第二面安装在第一表面上的多个电子部件，将电子部件的高度从第一表面安装到电子部件的相应上表面彼此不同; 以及密封第一表面的树脂。在多个电子部件中，至少具有最高安装高度的电子部件安装在凹部中。

3. 发明授权

US08443874B2 Heat dissipating structure and portable phone 失效
标题翻译：散热结构和便携式电话
公开(公告)号：US08443874B2
公开(公告)日：2013-05-21
申请号：US12593434
申请日：2008-01-28
申请人： Nobuhiro Mikami
发明人： Nobuhiro Mikami
IPC分类号： F28F27/00 , F28D17/00 , F28D19/00
CPC分类号： G06F1/203 , F28D20/00 , F28F13/00 , G06F2200/203 , H04B1/036 , H04M1/0216
摘要： A heat dissipating structure and a portable device are provided, which enable that heat is dissipated from a heat generating part without causing a user to feel discomfort. A heat transfer member is configured to transfer heat generated in a heat generating body and a thermal storrage unit is thermally connected to the heat transfer member. The thermal storrage unit includes a pack with stretching property and a thermal storrage medium which is filled in the pack and a volume of which changes with a change in temperature. The pack is arranged such that there is a gap between the pack and a first heat dissipating portion at normal temperature and the pack contacts the first heat dissipating portion when the thermal storrage medium expands with a change in temperature.
摘要翻译：提供了一种散热结构和便携式装置，其使得热量能够从发热部件散发而不会使使用者感到不适。热传递构件被构造成传递在发热体中产生的热量，并且热存储单元热连接到传热构件。热存储单元包括具有拉伸性能的包装和热储存介质，其填充在包装中，并且其量随温度变化而变化。该组件被布置成使得当热存储介质随着温度的变化而膨胀时，在常规温度下在包装和第一散热部分之间存在间隙，并且包装件接触第一散热部分。

4. 发明授权

US08144482B2 Circuit board device, wiring board interconnection method, and circuit board module device 有权
标题翻译：电路板装置，接线板互连方式及电路板模块装置
公开(公告)号：US08144482B2
公开(公告)日：2012-03-27
申请号：US12227803
申请日：2007-05-14
申请人： Junya Sato , Toru Taura , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
发明人： Junya Sato , Toru Taura , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K1/144 , H01R12/52 , H05K1/0218 , H05K3/325 , H05K2201/10378 , H05K2201/2018 , Y10T29/49126
摘要： A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged between wiring boards (101 and 102) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block (104) composed of a metal material and arranged between the wiring boards (101 and 102) to enclose anisotropic conductive member (103), and a pair of holding blocks (105 and 106) composed of a metal material arranged to clamp the plurality of wiring boards (101 and 102), wherein the plurality of wiring boards (101 and 102), while in a state of being clamped between the pair of holding blocks (105 and 106), is connected together by the anisotropic conductive member (103) and the terminals provided on each of the wiring boards (101 and 102), the functional block (104), and the holding blocks (105 and 106) are electrically connected.
摘要翻译：电路板装置包括：多个在前表面和后表面上设置有端子的布线板（101和102），并且设有用于将端子连接在一起的通孔;布置在布线板（101和102）之间的各向异性导电构件 102），用于将一个布线板的电极连接到另一个布线板的电极;功能块（104），由金属材料构成并布置在布线板（101和102）之间以封闭各向异性导电构件（103）;以及一对夹持多个布线板（101和102）的金属材料构成的保持块（105和106），其中所述多个布线板（101和102）处于夹在所述多个布线板一对保持块（105和106）通过各向异性导电构件（103）和设置在每个布线板（101和102）上的端子，功能块（104）和保持块（105）连接在一起和 106）电连接。

5. 发明授权

US08119918B2 Printed circuit board and semiconductor package 失效
标题翻译：印刷电路板和半导体封装
公开(公告)号：US08119918B2
公开(公告)日：2012-02-21
申请号：US12066474
申请日：2006-09-01
申请人： Junya Sato , Shinji Watanabe , Nobuhiro Mikami , Atsumasa Sawada
发明人： Junya Sato , Shinji Watanabe , Nobuhiro Mikami , Atsumasa Sawada
IPC分类号： H05K1/11
CPC分类号： H01L23/49827 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H05K1/0271 , H05K1/115 , H05K3/108 , H05K3/403 , H05K3/421 , H05K2201/0355 , H05K2201/0394 , H05K2201/09509 , H05K2201/09563 , H05K2201/09645 , H05K2201/09745 , H05K2201/09909 , H01L2924/00014 , H01L2924/00
摘要： An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed circuit board includes a first wiring layer 11, an electrical insulating base material 12 formed on the first wiring layer 11 and including a via base hole 12a that leads to the first wiring layer 11, and a second wiring layer 16 that is formed on the electrical insulating base material 12 and is electrically connected to the first wiring layer 11 through the via base hole 12a. In a region of the second wiring layer 16 disposed at least in the vicinity of the via base hole 12a, a stress relieving portion 17 is formed which relieves bending stress, tensile stress, compressive stress, and shear stress that may arise when the electrical insulating base material 12 is curved.
摘要翻译：本发明的目的在于防止电路故障的发生，例如由于印刷电路板是由印刷电路板所产生的各种应力引起的通孔和印刷电路板之间的剥离引起的信号断开等。弯曲。印刷电路板包括第一布线层11，形成在第一布线层11上的电绝缘基材12，并且包括通向第一布线层11的通孔基底孔12a和形成在第一布线层11上的第二布线层16 电绝缘基材12，并且通过通孔基底孔12a与第一布线层11电连接。在至少设置在通孔基底孔12a附近的第二布线层16的区域中，形成有减轻应力消除部分17，该部分减轻了当电绝缘材料时可能产生的弯曲应力，拉伸应力，压缩应力和剪切应力基材12弯曲。

6. 发明申请

US20110242780A1 MOUNT BOARD AND ELECTRONIC DEVICE 有权
标题翻译：安装板和电子设备
公开(公告)号：US20110242780A1
公开(公告)日：2011-10-06
申请号：US13158037
申请日：2011-06-10
申请人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
发明人： Shinji WATANABE , Nobuhiro MIKAMI , Junya SATO , Kenichiro FUJII , Katsumi ABE , Atsumasa SAWADA
IPC分类号： H05K7/14 , H05K7/00
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

7. 发明授权

US07847389B2 Semiconductor package, electronic part and electronic device 有权
标题翻译：半导体封装，电子元器件及电子器件
公开(公告)号：US07847389B2
公开(公告)日：2010-12-07
申请号：US12093896
申请日：2006-11-13
申请人： Nobuhiro Mikami , Shinji Watanabe , Junya Sato , Atsumasa Sawada
发明人： Nobuhiro Mikami , Shinji Watanabe , Junya Sato , Atsumasa Sawada
IPC分类号： H01L23/48
CPC分类号： H01L23/4985 , H01L23/49816 , H01L24/50 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3511
摘要： Even when a substrate on which a semiconductor package has been mounted is made curved, stress upon electrical connections is mitigated, thereby eliminating faulty connections and improving connection reliability. A semiconductor chip has electrodes on a second face thereof. Support blocks, capable of bending and flexing, are placed at two locations on a peripheral edge of a first face of the semiconductor chip. An interposer is placed so as to span the support blocks with the support blocks interposed between itself and the semiconductor chip, and has a wiring pattern in a flexible resin film. Two end portions of the interposer are folded back onto the side of the second face of the semiconductor chip, and the wiring pattern thereof is electrically connected to the electrodes of the semiconductor chip.
摘要翻译：即使当安装了半导体封装的衬底弯曲时，电气连接上的应力减轻，从而消除了连接错误并提高了连接的可靠性。半导体芯片在其第二面具有电极。能够弯曲和弯曲的支撑块被放置在半导体芯片的第一面的外围边缘上的两个位置处。放置插入件以跨越支撑块，其中插入其自身和半导体芯片之间的支撑块，并且在柔性树脂膜中具有布线图案。插入器的两端部被折回到半导体芯片的第二面的一侧，并且其布线图案电连接到半导体芯片的电极。

8. 发明申请

US20090135573A1 Circuit board device, wiring board interconnection method, and circuit board module device 有权
标题翻译：电路板装置，接线板互连方式及电路板模块装置
公开(公告)号：US20090135573A1
公开(公告)日：2009-05-28
申请号：US12227803
申请日：2007-05-14
申请人： Junya Sato , Toru Taura , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
发明人： Junya Sato , Toru Taura , Nobuhiro Mikami , Shinji Watanabe , Atsumasa Sawada , Nozomu Nishimura
IPC分类号： H05K1/14 , H05K3/36
CPC分类号： H05K1/144 , H01R12/52 , H05K1/0218 , H05K3/325 , H05K2201/10378 , H05K2201/2018 , Y10T29/49126
摘要： A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged between wiring boards (101 and 102) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block (104) composed of a metal material and arranged between the wiring boards (101 and 102) to enclose anisotropic conductive member (103), and a pair of holding blocks (105 and 106) composed of a metal material arranged to clamp the plurality of wiring boards (101 and 102), wherein the plurality of wiring boards (101 and 102), while in a state of being clamped between the pair of holding blocks (105 and 106), is connected together by the anisotropic conductive member (103) and the terminals provided on each of the wiring boards (101 and 102), the functional block (104), and the holding blocks (105 and 106) are electrically connected.
摘要翻译：电路板装置包括：多个在前表面和后表面上设置有端子的布线板（101和102），并且设有用于将端子连接在一起的通孔;布置在布线板（101和102）之间的各向异性导电构件 102），用于将一个布线板的电极连接到另一个布线板的电极;功能块（104），由金属材料构成并布置在布线板（101和102）之间以封闭各向异性导电构件（103）;以及一对夹持多个布线板（101和102）的金属材料构成的保持块（105和106），其中所述多个布线板（101和102）处于夹在所述多个布线板一对保持块（105和106）通过各向异性导电构件（103）和设置在每个布线板（101和102）上的端子，功能块（104）和保持块（105）连接在一起和 106）电连接。

9. 发明申请

US20090096080A1 SEMICONDUCTOR PACKAGE, ELECTRONIC PART AND ELECTRONIC DEVICE 有权
标题翻译：半导体封装，电子部件和电子器件
公开(公告)号：US20090096080A1
公开(公告)日：2009-04-16
申请号：US12093896
申请日：2006-11-13
申请人： Nobuhiro Mikami , Shinji Watanabe , Junya Sato , Atsumasa Sawada
发明人： Nobuhiro Mikami , Shinji Watanabe , Junya Sato , Atsumasa Sawada
IPC分类号： H01L23/48
CPC分类号： H01L23/4985 , H01L23/49816 , H01L24/50 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3511
摘要： Even when a substrate on which a semiconductor package has been mounted is made curved, stress upon electrical connections is mitigated, thereby eliminating faulty connections and improving connection reliability. A semiconductor chip has electrodes on a second face thereof. Support blocks, capable of bending and flexing, are placed at two locations on a peripheral edge of a first face of the semiconductor chip. An interposer is placed so as to span the support blocks with the support blocks interposed between itself and the semiconductor chip, and has a wiring pattern in a flexible resin film. Two end portions of the interposer are folded back onto the side of the second face of the semiconductor chip, and the wiring pattern thereof is electrically connected to the electrodes of the semiconductor chip.
摘要翻译：即使当安装了半导体封装的衬底弯曲时，电气连接上的应力减轻，从而消除了连接错误并提高了连接的可靠性。半导体芯片在其第二面具有电极。能够弯曲和弯曲的支撑块被放置在半导体芯片的第一面的外围边缘上的两个位置处。放置插入件以跨越支撑块，其中插入其自身和半导体芯片之间的支撑块，并且在柔性树脂膜中具有布线图案。插入器的两端部被折回到半导体芯片的第二面的一侧，并且其布线图案电连接到半导体芯片的电极。

10. 发明申请

US20090002973A1 Mount Board and Electronic Device 审中-公开
标题翻译：安装板和电子设备
公开(公告)号：US20090002973A1
公开(公告)日：2009-01-01
申请号：US12093496
申请日：2006-11-08
申请人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
发明人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
IPC分类号： H05K7/00
CPC分类号： H05K1/18 , H01L24/18 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/16227 , H01L2224/18 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1515 , H01L2924/15151 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , H01L2924/3511 , H05K1/023 , H05K1/0271 , H05K1/0284 , H05K1/185 , H05K1/189 , H05K3/0014 , H05K3/32 , H05K3/4644 , H05K2201/0187 , H05K2201/0191 , H05K2201/0195 , H05K2201/09018 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09436 , H05K2201/10477 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , H05K2203/1469 , H05K2203/302 , Y02P70/611 , H01L2924/00
摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
摘要翻译：本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。基座部分13a由绝缘材料形成。半导体封装20安装在焊盘部分15a上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式