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    • 8. 发明申请
    • Semiconductor integrated circuit device and fabrication method thereof
    • 半导体集成电路器件及其制造方法
    • US20090044162A1
    • 2009-02-12
    • US12285073
    • 2008-09-29
    • Keiichi Yoshioka
    • Keiichi Yoshioka
    • G06F17/50
    • G06F17/5068H01L27/11803H01L27/1203
    • A semiconductor integrated circuit device and a fabrication method thereof are disclosed, for effective suppression of a temperature increase therein that is caused by heat generation of a semiconductor element. The semiconductor integrated circuit device includes a semiconductor element, a multi-layer wiring structure and a heat conduction part. The semiconductor element is formed on a support substrate. The multi-layer wiring structure is formed in an insulation film on the support substrate and includes at least one connection hole and at least one metal wiring layer. The heat conduction part is formed of the same conductive materials as the connection hole and the metal wiring layer and extends toward an upper layer side along a path different from a wiring path including a connection hole and a metal wiring for signal transmission.
    • 公开了一种半导体集成电路器件及其制造方法,用于有效抑制由半导体元件的发热引起的温度升高。 半导体集成电路器件包括半导体元件,多层布线结构和导热部分。 半导体元件形成在支撑基板上。 多层布线结构形成在支撑基板上的绝缘膜中,并且包括至少一个连接孔和至少一个金属布线层。 导热部分由与连接孔和金属布线层相同的导电材料形成,并且沿着与包括连接孔和用于信号传输的金属布线的布线路径不同的路径向上层侧延伸。
    • 10. 发明申请
    • Nickel-based ultrafine powder
    • 镍基超细粉
    • US20060191608A1
    • 2006-08-31
    • US10548436
    • 2004-03-10
    • Hiroshi YamaneKeiichi Yoshioka
    • Hiroshi YamaneKeiichi Yoshioka
    • C22C1/04
    • H01G4/30B22F1/0014B22F9/28B22F2998/00H01G4/008H01G4/012B22F1/0018
    • In order to reduce the size of a laminated ceramic capacitor by reducing the thickness of a dielectric material, to increase the number of laminated dielectric layers and electrodes, and to elevate the capacity, the quantity of coarse particles of which particle diameters exceed 1 μpm is reduced from the metal powder used in the internal electrodes. There is provided a nickel-based ultra-fine powder, wherein the average particle diameter of primary particles is 0.05 to 0.3 μm, the number of the primary particles that have a particle diameter of 1 μm or larger is 50 ppm or less relative to the total number of the particles, and the number of the primary particles that have a particle diameter of 0.6 times or smaller than the average particle diameter is 10% or less relative to the total number of the particles. The nickel-based ultra-fine powder is produced from nickel chloride vapor or the like using a vapor-phase hydrogen reduction method.
    • 为了通过减小​​介电材料的厚度来减小叠层陶瓷电容器的尺寸,为了增加叠层的电介质层和电极的数量,并且为了提高容量,粒径超过1mupm的粗颗粒的量为 从内部电极中使用的金属粉末减少。 提供了一种镍基超细粉末,其中一次粒子的平均粒径为0.05〜0.3μm,粒径为1μm以上的一次粒子的个数相对于 粒子的总数和粒径为平均粒径的0.6倍以下的一次粒子数相对于粒子的总数为10%以下。 使用气相氢还原法从镍氯化物蒸气等制造镍系超细粉末。