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    • 1. 发明申请
    • ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
    • 电子设备及制造电子设备的方法
    • US20120104593A1
    • 2012-05-03
    • US13286494
    • 2011-11-01
    • Yoko KANEMOTOAkira SATOShogo INABA
    • Yoko KANEMOTOAkira SATOShogo INABA
    • H01L23/06H01L21/52
    • B81C1/00333B81C2203/0145
    • An electronic device according to the invention includes: a substrate; an MEMS structure formed above the substrate; and a covering structure defining a cavity in which the MEMS structure is arranged, wherein the covering structure has a first covering layer covering from above the cavity and having a through-hole in communication with the cavity and a second covering layer formed above the first covering layer and closing the through-hole, the first covering layer has a first region located above at least the MEMS structure and a second region located around the first region, the first covering layer is thinner in the first region than in the second region, and a distance between the substrate and the first covering layer in the first region is longer than a distance between the substrate and the first covering layer in the second region.
    • 根据本发明的电子设备包括:基板; 在衬底上形成的MEMS结构; 以及限定了其中布置有MEMS结构的空腔的覆盖结构,其中所述覆盖结构具有从所述空腔上方覆盖并具有与所述空腔连通的通孔的第一覆盖层和形成在所述第一覆盖物上方的第二覆盖层 并且关闭所述通孔,所述第一覆盖层具有位于至少所述MEMS结构之上的第一区域和位于所述第一区域周围的第二区域,所述第一覆盖层在所述第一区域中比在所述第二区域中更薄,以及 第一区域中的基板和第一覆盖层之间的距离比第二区域中的基板和第一覆盖层之间的距离长。
    • 7. 发明申请
    • MEMS RESONATOR AND MANUFACTURING METHOD OF THE SAME
    • MEMS谐振器及其制造方法
    • US20080142912A1
    • 2008-06-19
    • US11928519
    • 2007-10-30
    • Shogo INABAAkira SATOToru WATANABETakeshi MORI
    • Shogo INABAAkira SATOToru WATANABETakeshi MORI
    • H03H9/02H01L21/8228
    • H03H3/0073H03H9/1057Y10S977/721
    • A method is for manufacturing a microeletromechanical system resonator having a semiconductor device and a microelectromechanical system structure unit formed on a substrate. The method includes: forming a lower electrode of an oxide-nitride-oxide capacitor unit included in the semiconductor device using a first silicon layer; forming, using a second silicon layer, a substructure of the microelectromechanical system structure unit and an upper electrode of the oxide-nitride-oxide capacitor unit included in the semiconductor device; and forming, using a third silicon layer, a superstructure of the microelectromechanical system structure unit and a gate electrode of a complementary metal oxide semiconductor circuit unit included in the semiconductor device.
    • 一种用于制造具有半导体器件和形成在衬底上的微机电系统结构单元的微机械系统谐振器的方法。 该方法包括:使用第一硅层形成包括在半导体器件中的氧化物 - 氮化物 - 氧化物电容器单元的下电极; 使用第二硅层形成微机电系统结构单元的子结构和包括在半导体器件中的氧化物 - 氮化物 - 氧化物电容器单元的上电极; 以及使用第三硅层形成所述微机电系统结构单元的上部结构和包括在所述半导体器件中的互补金属氧化物半导体电路单元的栅电极。